JPS62142865U - - Google Patents
Info
- Publication number
- JPS62142865U JPS62142865U JP3176486U JP3176486U JPS62142865U JP S62142865 U JPS62142865 U JP S62142865U JP 3176486 U JP3176486 U JP 3176486U JP 3176486 U JP3176486 U JP 3176486U JP S62142865 U JPS62142865 U JP S62142865U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- optical semiconductor
- die
- heat sink
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims 2
- 239000008188 pellet Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Description
第１図は本考案によるヒートシンクの平面図、
第２図ａは本考案によるヒートシンクに半導体レ
ーザペレツトをダイボンデイングした後の平面図
、第２図ｂは第２図ａのＡ―Ａ′における断面図
、第３図は従来例のヒートシンクの平面図、第４
図は従来例のヒートシンクに半導体レーザペレツ
トをダイボンデイングした後の平面図である。
１１，２１，３１，４１…ソルダー部、１２，
２２，３２，４２…シリコン、１３，２３…溝、
１４，２４，３４，４４…ワイヤボンデイング部
、２５，４５…半導体レーザペレツト。
Figure 1 is a plan view of the heat sink according to the present invention.
FIG. 2a is a plan view after die bonding a semiconductor laser pellet to a heat sink according to the present invention, FIG. 2b is a cross-sectional view taken along line A-A' in FIG. 2a, and FIG. 3 is a plan view of a conventional heat sink. , 4th
The figure is a plan view after a semiconductor laser pellet has been die-bonded to a conventional heat sink. 11, 21, 31, 41...Solder part, 12,
22, 32, 42... silicon, 13, 23... groove,
14, 24, 34, 44... wire bonding section, 25, 45... semiconductor laser pellet.
Claims (1)
シンクに光半導体素子の周囲または一方側に、溝
を設け、ダイボンデイング用ソルダの流れを防止
することを特徴とする半導体装置。 A semiconductor device characterized in that a heat sink to which an optical semiconductor element is die-bonded is provided with a groove around or on one side of the optical semiconductor element to prevent flow of solder for die bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3176486U JPS62142865U (en) | 1986-03-04 | 1986-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3176486U JPS62142865U (en) | 1986-03-04 | 1986-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62142865U true JPS62142865U (en) | 1987-09-09 |
Family
ID=30837799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3176486U Pending JPS62142865U (en) | 1986-03-04 | 1986-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62142865U (en) |
-
1986
- 1986-03-04 JP JP3176486U patent/JPS62142865U/ja active Pending