JPS6214098B2 - - Google Patents

Info

Publication number
JPS6214098B2
JPS6214098B2 JP9779779A JP9779779A JPS6214098B2 JP S6214098 B2 JPS6214098 B2 JP S6214098B2 JP 9779779 A JP9779779 A JP 9779779A JP 9779779 A JP9779779 A JP 9779779A JP S6214098 B2 JPS6214098 B2 JP S6214098B2
Authority
JP
Japan
Prior art keywords
joint
lid
glass
alumina substrate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9779779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5623756A (en
Inventor
Akihiro Dotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP9779779A priority Critical patent/JPS5623756A/ja
Publication of JPS5623756A publication Critical patent/JPS5623756A/ja
Publication of JPS6214098B2 publication Critical patent/JPS6214098B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP9779779A 1979-07-31 1979-07-31 Ceramic package and manufacture thereof Granted JPS5623756A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9779779A JPS5623756A (en) 1979-07-31 1979-07-31 Ceramic package and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9779779A JPS5623756A (en) 1979-07-31 1979-07-31 Ceramic package and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS5623756A JPS5623756A (en) 1981-03-06
JPS6214098B2 true JPS6214098B2 (enExample) 1987-03-31

Family

ID=14201781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9779779A Granted JPS5623756A (en) 1979-07-31 1979-07-31 Ceramic package and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5623756A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61147793A (ja) * 1984-12-18 1986-07-05 Makita Denki Seisakusho:Kk 電動工具の電池駆動による制御装置
JP2555945Y2 (ja) * 1992-03-25 1997-11-26 滋賀ボルト株式会社 ボルト締付け装置
JP2583469Y2 (ja) * 1992-03-25 1998-10-22 滋賀ボルト株式会社 ボルト締付け装置

Also Published As

Publication number Publication date
JPS5623756A (en) 1981-03-06

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