JPS6214040B2 - - Google Patents
Info
- Publication number
- JPS6214040B2 JPS6214040B2 JP54164111A JP16411179A JPS6214040B2 JP S6214040 B2 JPS6214040 B2 JP S6214040B2 JP 54164111 A JP54164111 A JP 54164111A JP 16411179 A JP16411179 A JP 16411179A JP S6214040 B2 JPS6214040 B2 JP S6214040B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- treatment
- peel strength
- rough surface
- chromate treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 36
- 239000011889 copper foil Substances 0.000 claims description 35
- 238000011282 treatment Methods 0.000 claims description 34
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 13
- 239000011651 chromium Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 5
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000002265 prevention Effects 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000002845 discoloration Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Chemical group 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical group [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000009920 chelation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- UUWCBFKLGFQDME-UHFFFAOYSA-N platinum titanium Chemical compound [Ti].[Pt] UUWCBFKLGFQDME-UHFFFAOYSA-N 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Electrochemical Coating By Surface Reaction (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16411179A JPS5687694A (en) | 1979-12-19 | 1979-12-19 | Manufacture of copper foil for printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16411179A JPS5687694A (en) | 1979-12-19 | 1979-12-19 | Manufacture of copper foil for printed circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5687694A JPS5687694A (en) | 1981-07-16 |
| JPS6214040B2 true JPS6214040B2 (nl) | 1987-03-31 |
Family
ID=15786955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16411179A Granted JPS5687694A (en) | 1979-12-19 | 1979-12-19 | Manufacture of copper foil for printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5687694A (nl) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6441538U (nl) * | 1987-09-02 | 1989-03-13 | ||
| JPH0386728U (nl) * | 1989-12-20 | 1991-09-03 | ||
| JP5723770B2 (ja) * | 2009-06-05 | 2015-05-27 | Jx日鉱日石金属株式会社 | 半導体パッケージ基板用銅箔及び半導体パッケージ用基板 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5155655A (en) * | 1989-08-23 | 1992-10-13 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
| JP5306620B2 (ja) * | 2007-09-11 | 2013-10-02 | 古河電気工業株式会社 | 超音波溶接用銅箔、およびその表面処理方法 |
| TWI627876B (zh) * | 2012-08-06 | 2018-06-21 | Jx Nippon Mining & Metals Corp | Metal foil with carrier |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5142575A (ja) * | 1974-10-08 | 1976-04-10 | Matsushita Electric Ind Co Ltd | Koondosensaa |
| JPS5440058A (en) * | 1977-09-06 | 1979-03-28 | Toshiba Corp | Maintenance monitor system |
-
1979
- 1979-12-19 JP JP16411179A patent/JPS5687694A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5142575A (ja) * | 1974-10-08 | 1976-04-10 | Matsushita Electric Ind Co Ltd | Koondosensaa |
| JPS5440058A (en) * | 1977-09-06 | 1979-03-28 | Toshiba Corp | Maintenance monitor system |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6441538U (nl) * | 1987-09-02 | 1989-03-13 | ||
| JPH0386728U (nl) * | 1989-12-20 | 1991-09-03 | ||
| JP5723770B2 (ja) * | 2009-06-05 | 2015-05-27 | Jx日鉱日石金属株式会社 | 半導体パッケージ基板用銅箔及び半導体パッケージ用基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5687694A (en) | 1981-07-16 |
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