JPS62139895A - 部分メツキ装置 - Google Patents

部分メツキ装置

Info

Publication number
JPS62139895A
JPS62139895A JP60281217A JP28121785A JPS62139895A JP S62139895 A JPS62139895 A JP S62139895A JP 60281217 A JP60281217 A JP 60281217A JP 28121785 A JP28121785 A JP 28121785A JP S62139895 A JPS62139895 A JP S62139895A
Authority
JP
Japan
Prior art keywords
plating
net
plating solution
parts
pass line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60281217A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0140117B2 (enExample
Inventor
Yasuto Murata
康人 村田
Junichi Tezuka
純一 手塚
Kenji Yamamoto
健治 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP60281217A priority Critical patent/JPS62139895A/ja
Priority to DE8686114812T priority patent/DE3683595D1/de
Priority to EP19860114812 priority patent/EP0222232B1/en
Priority to US06/924,657 priority patent/US4683045A/en
Publication of JPS62139895A publication Critical patent/JPS62139895A/ja
Publication of JPH0140117B2 publication Critical patent/JPH0140117B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
JP60281217A 1985-11-11 1985-12-16 部分メツキ装置 Granted JPS62139895A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60281217A JPS62139895A (ja) 1985-12-16 1985-12-16 部分メツキ装置
DE8686114812T DE3683595D1 (de) 1985-11-11 1986-10-24 Vorrichtung zum selektiven metallbeschichten von steckverbinderkontaktstiften.
EP19860114812 EP0222232B1 (en) 1985-11-11 1986-10-24 Plating device for minute portions of connector terminals
US06/924,657 US4683045A (en) 1985-12-16 1986-10-29 Partial plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60281217A JPS62139895A (ja) 1985-12-16 1985-12-16 部分メツキ装置

Publications (2)

Publication Number Publication Date
JPS62139895A true JPS62139895A (ja) 1987-06-23
JPH0140117B2 JPH0140117B2 (enExample) 1989-08-25

Family

ID=17635994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60281217A Granted JPS62139895A (ja) 1985-11-11 1985-12-16 部分メツキ装置

Country Status (2)

Country Link
US (1) US4683045A (enExample)
JP (1) JPS62139895A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104313668A (zh) * 2014-09-30 2015-01-28 苏州芯航元电子科技有限公司 电子产线用电化学处理槽
CN118531483A (zh) * 2024-07-26 2024-08-23 安徽昀水表面科技有限公司 一种自动化端子电镀设备

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818349A (en) * 1988-02-01 1989-04-04 Amp Incorporated Selective plating apparatus for zone plating
CH684840A5 (fr) * 1991-06-11 1995-01-13 Electroplating Eng Eesa Cellule pour plaquer par voie électrolytique sélectivement des zones choisies de pièces métalliques disposées en bande.
DE19758513C2 (de) * 1997-02-06 2000-07-13 Schempp & Decker Praezisionste Vorrichtung zum selektiven galvanischen Beschichten von elektrischen Kontaktelementen
CN102586826A (zh) * 2011-01-17 2012-07-18 欣兴电子股份有限公司 连接器的镀金方法及其镀金装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4163704A (en) * 1975-06-14 1979-08-07 Electroplating Engineers Of Japan, Ltd. Apparatus for selectively plating rectangular sheet continuously or intermittently

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104313668A (zh) * 2014-09-30 2015-01-28 苏州芯航元电子科技有限公司 电子产线用电化学处理槽
CN118531483A (zh) * 2024-07-26 2024-08-23 安徽昀水表面科技有限公司 一种自动化端子电镀设备

Also Published As

Publication number Publication date
JPH0140117B2 (enExample) 1989-08-25
US4683045A (en) 1987-07-28

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