JPS6213817B2 - - Google Patents
Info
- Publication number
- JPS6213817B2 JPS6213817B2 JP56191132A JP19113281A JPS6213817B2 JP S6213817 B2 JPS6213817 B2 JP S6213817B2 JP 56191132 A JP56191132 A JP 56191132A JP 19113281 A JP19113281 A JP 19113281A JP S6213817 B2 JPS6213817 B2 JP S6213817B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit board
- electrodes
- insulator
- solder bumps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/072—
-
- H10W72/07236—
-
- H10W72/07251—
-
- H10W72/20—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56191132A JPS5892229A (ja) | 1981-11-27 | 1981-11-27 | フリツプチツプ実装構造の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56191132A JPS5892229A (ja) | 1981-11-27 | 1981-11-27 | フリツプチツプ実装構造の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5892229A JPS5892229A (ja) | 1983-06-01 |
| JPS6213817B2 true JPS6213817B2 (enExample) | 1987-03-28 |
Family
ID=16269405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56191132A Granted JPS5892229A (ja) | 1981-11-27 | 1981-11-27 | フリツプチツプ実装構造の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5892229A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63293867A (ja) * | 1987-05-26 | 1988-11-30 | Matsushita Electric Works Ltd | 半導体装置 |
-
1981
- 1981-11-27 JP JP56191132A patent/JPS5892229A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5892229A (ja) | 1983-06-01 |
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