JPS62122722A - プリント配線板材料の製法 - Google Patents
プリント配線板材料の製法Info
- Publication number
- JPS62122722A JPS62122722A JP60264449A JP26444985A JPS62122722A JP S62122722 A JPS62122722 A JP S62122722A JP 60264449 A JP60264449 A JP 60264449A JP 26444985 A JP26444985 A JP 26444985A JP S62122722 A JPS62122722 A JP S62122722A
- Authority
- JP
- Japan
- Prior art keywords
- molded
- wiring board
- printed wiring
- molds
- bag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/34—Heating or cooling presses or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60264449A JPS62122722A (ja) | 1985-11-25 | 1985-11-25 | プリント配線板材料の製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60264449A JPS62122722A (ja) | 1985-11-25 | 1985-11-25 | プリント配線板材料の製法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62122722A true JPS62122722A (ja) | 1987-06-04 |
| JPH054889B2 JPH054889B2 (enExample) | 1993-01-21 |
Family
ID=17403350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60264449A Granted JPS62122722A (ja) | 1985-11-25 | 1985-11-25 | プリント配線板材料の製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62122722A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02209232A (ja) * | 1989-02-03 | 1990-08-20 | Glasteel Ind Laminates Inc | 金属箔積層体を製造する連続的な方法 |
| US7399022B2 (en) | 2004-07-28 | 2008-07-15 | Peguform Gmbh | Vehicle rear door |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104996562A (zh) | 2014-04-17 | 2015-10-28 | 艾力股份公司-卡皮贾尼集团 | 制备液体或半液体发酵乳制品的方法 |
-
1985
- 1985-11-25 JP JP60264449A patent/JPS62122722A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02209232A (ja) * | 1989-02-03 | 1990-08-20 | Glasteel Ind Laminates Inc | 金属箔積層体を製造する連続的な方法 |
| US7399022B2 (en) | 2004-07-28 | 2008-07-15 | Peguform Gmbh | Vehicle rear door |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH054889B2 (enExample) | 1993-01-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4405971A (en) | Electrical circuit apparatus | |
| JPS62122722A (ja) | プリント配線板材料の製法 | |
| JP2912342B1 (ja) | 多層銅張積層板の製造方法 | |
| JP2700449B2 (ja) | 電子パワーデバイスのヒートシンクを電気的に絶縁するための方法および装置 | |
| JP3277195B2 (ja) | 多層プリント配線板およびその製造方法 | |
| JPS62214939A (ja) | 積層板の製法 | |
| JPH0295826A (ja) | 回路付き樹脂成形体の製造方法 | |
| JP2001308522A (ja) | 多層プリント配線板の製造方法およびプリプレグ | |
| JPS61261012A (ja) | 積層板の製造方法及びその装置 | |
| JP2002164665A (ja) | 配線板成形用の真空成形装置 | |
| JPH01199440A (ja) | 半導体装置の製造方法 | |
| JPH10224032A (ja) | プリント配線板のレイアップ方法 | |
| JP3351468B2 (ja) | 多層プリント配線板の製造方法と積層装置 | |
| JPH0334877B2 (enExample) | ||
| JPS6319897A (ja) | 多層プリント配線板の成形方法 | |
| JPH0722721A (ja) | 金属ベース印刷配線板 | |
| JPH0298426A (ja) | 回路付き樹脂成形体の製造方法 | |
| JPH0825385A (ja) | 積層板の製造方法 | |
| JPS61230916A (ja) | 積層板の成形方法 | |
| JPH1034817A (ja) | 積層板の製造装置 | |
| JPH0328287B2 (enExample) | ||
| JPS60241294A (ja) | 多層印刷配線板の製造方法 | |
| JPH03270094A (ja) | プリント配線用材およびその製造方法ならびに多層プリント配線板の製造方法 | |
| JPH10641A (ja) | 真空積層装置および真空積層方法 | |
| JPS6248551A (ja) | プリント配線板材料の製法 |