JPS6211986B2 - - Google Patents

Info

Publication number
JPS6211986B2
JPS6211986B2 JP56020201A JP2020181A JPS6211986B2 JP S6211986 B2 JPS6211986 B2 JP S6211986B2 JP 56020201 A JP56020201 A JP 56020201A JP 2020181 A JP2020181 A JP 2020181A JP S6211986 B2 JPS6211986 B2 JP S6211986B2
Authority
JP
Japan
Prior art keywords
workpiece
signal
weight
hole
reference value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56020201A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57138575A (en
Inventor
Kazuhiro Ogawa
Tsuneo Kawai
Koichi Noto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56020201A priority Critical patent/JPS57138575A/ja
Publication of JPS57138575A publication Critical patent/JPS57138575A/ja
Publication of JPS6211986B2 publication Critical patent/JPS6211986B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP56020201A 1981-02-16 1981-02-16 Grinding machine Granted JPS57138575A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56020201A JPS57138575A (en) 1981-02-16 1981-02-16 Grinding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56020201A JPS57138575A (en) 1981-02-16 1981-02-16 Grinding machine

Publications (2)

Publication Number Publication Date
JPS57138575A JPS57138575A (en) 1982-08-26
JPS6211986B2 true JPS6211986B2 (enrdf_load_stackoverflow) 1987-03-16

Family

ID=12020545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56020201A Granted JPS57138575A (en) 1981-02-16 1981-02-16 Grinding machine

Country Status (1)

Country Link
JP (1) JPS57138575A (enrdf_load_stackoverflow)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133857A (ja) * 1984-07-27 1986-02-17 Matsushita Electric Ind Co Ltd 精密研磨装置
US5499733A (en) * 1992-09-17 1996-03-19 Luxtron Corporation Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
US7037403B1 (en) 1992-12-28 2006-05-02 Applied Materials Inc. In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization
US6614529B1 (en) 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US6876454B1 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5964643A (en) * 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6719818B1 (en) 1995-03-28 2004-04-13 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6676717B1 (en) 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6537133B1 (en) 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
DE69635816T2 (de) 1995-03-28 2006-10-12 Applied Materials, Inc., Santa Clara Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen
JP2000183002A (ja) 1998-12-10 2000-06-30 Okamoto Machine Tool Works Ltd ウエハの研磨終点検出方法および研磨終点検出装置
US6994607B2 (en) 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US6524164B1 (en) 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US7374477B2 (en) 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
CN110752169B (zh) * 2019-10-21 2022-03-22 西安奕斯伟材料科技有限公司 一种晶圆处理装置和上下料方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5190095A (enrdf_load_stackoverflow) * 1975-02-05 1976-08-06

Also Published As

Publication number Publication date
JPS57138575A (en) 1982-08-26

Similar Documents

Publication Publication Date Title
JPS6211986B2 (enrdf_load_stackoverflow)
US5447463A (en) Apparatus for microfinishing
JP4192135B2 (ja) 加工装置及び加工方法
JPH11333685A (ja) 眼鏡レンズ加工装置
JP2004298985A (ja) レンズ球面研磨装置
JPH10109261A (ja) 研磨方法及び装置
JPS63180454A (ja) ワークにおいてきわめて小さな直径の長い孔を内面研削するための方法をおよび装置
JP3368497B2 (ja) 多軸式横型研磨機
US3555745A (en) Process for grinding a cylindrical article
JP2003340702A (ja) ダイヤモンド工具皿揺動回転式のレンズ研削方法とその装置
US2939252A (en) Ultrasonic lens generators
JPH044097B2 (enrdf_load_stackoverflow)
US3603039A (en) Method of and apparatus for machining articles
JPH0623405Y2 (ja) 工作物加熱装置を有する研削装置
JPH10109250A (ja) フライス加工方法及び装置
US3289539A (en) Methods and apparatus for producing test specimens
US2456061A (en) Double end center lapping machine
JPH11320299A (ja) 整流子加工機における外径研磨仕上装置
JPH0627318Y2 (ja) 工作物加熱装置を有する加工装置
JP7730664B2 (ja) ウエーハの加工方法
JPS61178167A (ja) 研磨装置
JP2002239883A (ja) レンズ心取り装置
JPH02139119A (ja) ボールネジの加工方法
JP2666447B2 (ja) 研摩装置
JPS59219155A (ja) 研磨加工機