JPS6211973B2 - - Google Patents

Info

Publication number
JPS6211973B2
JPS6211973B2 JP16137981A JP16137981A JPS6211973B2 JP S6211973 B2 JPS6211973 B2 JP S6211973B2 JP 16137981 A JP16137981 A JP 16137981A JP 16137981 A JP16137981 A JP 16137981A JP S6211973 B2 JPS6211973 B2 JP S6211973B2
Authority
JP
Japan
Prior art keywords
masking agent
heat
refrigerant
manufacturing
desired shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16137981A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5866634A (ja
Inventor
Yoshinori Takakura
Ryoichi Ishizoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16137981A priority Critical patent/JPS5866634A/ja
Publication of JPS5866634A publication Critical patent/JPS5866634A/ja
Publication of JPS6211973B2 publication Critical patent/JPS6211973B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP16137981A 1981-10-09 1981-10-09 放熱器の製造方法 Granted JPS5866634A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16137981A JPS5866634A (ja) 1981-10-09 1981-10-09 放熱器の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16137981A JPS5866634A (ja) 1981-10-09 1981-10-09 放熱器の製造方法

Publications (2)

Publication Number Publication Date
JPS5866634A JPS5866634A (ja) 1983-04-20
JPS6211973B2 true JPS6211973B2 (ro) 1987-03-16

Family

ID=15733966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16137981A Granted JPS5866634A (ja) 1981-10-09 1981-10-09 放熱器の製造方法

Country Status (1)

Country Link
JP (1) JPS5866634A (ro)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435925U (ro) * 1987-08-31 1989-03-03
CN111465814A (zh) * 2017-12-19 2020-07-28 乔治洛德方法研究和开发液化空气有限公司 具有表面纹理的间隔元件、以及相关联的热交换器和生产方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103659209B (zh) * 2012-09-11 2016-06-29 常州市常蒸蒸发器有限公司 高平度单面吹胀板式蒸发器的生产工艺
CN114346626A (zh) * 2021-12-14 2022-04-15 常州市常蒸蒸发器有限公司 用于新能源装备的吹胀式蒸发器生产方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435925U (ro) * 1987-08-31 1989-03-03
CN111465814A (zh) * 2017-12-19 2020-07-28 乔治洛德方法研究和开发液化空气有限公司 具有表面纹理的间隔元件、以及相关联的热交换器和生产方法

Also Published As

Publication number Publication date
JPS5866634A (ja) 1983-04-20

Similar Documents

Publication Publication Date Title
CN109661723B (zh) 具有双面散热结构的半导体封装
US6490159B1 (en) Electrical circuit board and method for making the same
JPS5936827B2 (ja) 集積回路素子の冷却装置
JP2006140456A (ja) 中空回路基板の製造方法
JPS62238653A (ja) 冷却構造
CN110349864A (zh) 一种芯片散热片的封装方法及芯片封装产品
CN110402067A (zh) 电子设备及电子设备的组装方法
JPS6211973B2 (ro)
US20050250245A1 (en) Semiconductor chip arrangement and method
JP4311303B2 (ja) パワーモジュール用基板の製造方法
JPH10270612A (ja) 放熱板接合用基板
TWI298938B (ro)
JPH0817855A (ja) 半導体装置の製造方法およびこれに用いられる積層体
JPS6211972B2 (ro)
JPH025534A (ja) ペースト塗布用ノズル及びペースト塗布方法
JPH052739B2 (ro)
TWI720653B (zh) 薄型均溫板
JPH0246741A (ja) 混成集積回路
JPH0530392Y2 (ro)
JPH0526744Y2 (ro)
JP2002237557A (ja) 銅板積層ヒートシンク及びその製造方法
JPH09293811A (ja) 発熱体の冷却装置
CN111182728A (zh) 一种铝围坝金属基板印制电路板的制作方法
US20060237517A1 (en) Apparatus and manufacturing method of combining low melting point alloys and application of low melting point alloys
JPS59188151A (ja) ハイブリツトicの気密封止方法