JPS62118552A - 集積回路の冷却構造 - Google Patents

集積回路の冷却構造

Info

Publication number
JPS62118552A
JPS62118552A JP60257572A JP25757285A JPS62118552A JP S62118552 A JPS62118552 A JP S62118552A JP 60257572 A JP60257572 A JP 60257572A JP 25757285 A JP25757285 A JP 25757285A JP S62118552 A JPS62118552 A JP S62118552A
Authority
JP
Japan
Prior art keywords
heat radiating
block
fixing
cooling jacket
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60257572A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0461506B2 (cg-RX-API-DMAC7.html
Inventor
Toshifumi Sano
佐野　俊史
Yoichi Matsuo
洋一 松尾
Mitsuo Takamoto
高本　光男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60257572A priority Critical patent/JPS62118552A/ja
Priority to DE8686308975T priority patent/DE3666644D1/de
Priority to US06/931,847 priority patent/US4854377A/en
Priority to EP86308975A priority patent/EP0225108B1/en
Publication of JPS62118552A publication Critical patent/JPS62118552A/ja
Publication of JPH0461506B2 publication Critical patent/JPH0461506B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60257572A 1985-11-19 1985-11-19 集積回路の冷却構造 Granted JPS62118552A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60257572A JPS62118552A (ja) 1985-11-19 1985-11-19 集積回路の冷却構造
DE8686308975T DE3666644D1 (en) 1985-11-19 1986-11-18 Liquid cooling system for integrated circuit chips
US06/931,847 US4854377A (en) 1985-11-19 1986-11-18 Liquid cooling system for integrated circuit chips
EP86308975A EP0225108B1 (en) 1985-11-19 1986-11-18 Liquid cooling system for integrated circuit chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60257572A JPS62118552A (ja) 1985-11-19 1985-11-19 集積回路の冷却構造

Publications (2)

Publication Number Publication Date
JPS62118552A true JPS62118552A (ja) 1987-05-29
JPH0461506B2 JPH0461506B2 (cg-RX-API-DMAC7.html) 1992-10-01

Family

ID=17308134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60257572A Granted JPS62118552A (ja) 1985-11-19 1985-11-19 集積回路の冷却構造

Country Status (1)

Country Link
JP (1) JPS62118552A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5636770A (en) * 1994-06-13 1997-06-10 Toyo Aerosol Industry Co. Ltd. Aerosol dip tube
EP2166569A1 (de) * 2008-09-22 2010-03-24 ABB Schweiz AG Kühlvorrichtung für ein Leistungsbauelement

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5636770A (en) * 1994-06-13 1997-06-10 Toyo Aerosol Industry Co. Ltd. Aerosol dip tube
EP2166569A1 (de) * 2008-09-22 2010-03-24 ABB Schweiz AG Kühlvorrichtung für ein Leistungsbauelement

Also Published As

Publication number Publication date
JPH0461506B2 (cg-RX-API-DMAC7.html) 1992-10-01

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