JPS62118496U - - Google Patents
Info
- Publication number
- JPS62118496U JPS62118496U JP13020885U JP13020885U JPS62118496U JP S62118496 U JPS62118496 U JP S62118496U JP 13020885 U JP13020885 U JP 13020885U JP 13020885 U JP13020885 U JP 13020885U JP S62118496 U JPS62118496 U JP S62118496U
- Authority
- JP
- Japan
- Prior art keywords
- metal core
- heat sink
- core substrate
- conductive rubber
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図はこの考案の一実施例を示す断面図、第
2図は従来構造の一例を示す断面図である。
図において、1は金属コア基板、2はヒートシ
ンク、3はネジ穴、4は溝、5はネジ、6は熱伝
導性ラバーである。なお、図中同一符号は同一ま
たは相当部分を示す。
FIG. 1 is a sectional view showing an embodiment of this invention, and FIG. 2 is a sectional view showing an example of a conventional structure. In the figure, 1 is a metal core substrate, 2 is a heat sink, 3 is a screw hole, 4 is a groove, 5 is a screw, and 6 is a thermally conductive rubber. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
の金属コア基板に取付けられるヒートシンクと、
熱伝導性ラバーとで構成され、前記金属コア基板
とヒートシンクとの間に熱伝導性ラバーを挾んで
前記金属コア基板にヒートシンクをネジ止めし、
前記熱伝導性ラバーを介して金属コア基板とヒー
トシンクとが熱的に接続されていることを特徴と
する金属コア基板の放熱構造。 A metal core board whose entire surface is covered with an insulating layer, a heat sink attached to this metal core board,
a thermally conductive rubber, the thermally conductive rubber is sandwiched between the metal core substrate and the heat sink, and the heat sink is screwed to the metal core substrate;
A heat dissipation structure for a metal core substrate, characterized in that the metal core substrate and a heat sink are thermally connected via the thermally conductive rubber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13020885U JPS62118496U (en) | 1985-08-27 | 1985-08-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13020885U JPS62118496U (en) | 1985-08-27 | 1985-08-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62118496U true JPS62118496U (en) | 1987-07-28 |
Family
ID=31027483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13020885U Pending JPS62118496U (en) | 1985-08-27 | 1985-08-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62118496U (en) |
-
1985
- 1985-08-27 JP JP13020885U patent/JPS62118496U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS62118496U (en) | ||
JPS61158957U (en) | ||
JPH0268493U (en) | ||
JPS60163738U (en) | semiconductor equipment | |
JPS60163740U (en) | semiconductor equipment | |
JPS6448095U (en) | ||
JPS6133466U (en) | Electroplated insulated metal substrate | |
JPS62182555U (en) | ||
JPS61171259U (en) | ||
JPS62103252U (en) | ||
JPS58184848U (en) | transistor structure | |
JPS61102074U (en) | ||
JPS59101391U (en) | panel heater | |
JPH0338693U (en) | ||
JPH0167046U (en) | ||
JPS61171247U (en) | ||
JPS6133465U (en) | insulated metal substrate | |
JPS63170996U (en) | ||
JPS61114898U (en) | ||
JPS6228498U (en) | ||
JPS61247U (en) | Electrical component | |
JPS60163739U (en) | semiconductor equipment | |
JPH01153697U (en) | ||
JPS6190249U (en) | ||
JPS61102039U (en) |