JPS62118458U - - Google Patents
Info
- Publication number
- JPS62118458U JPS62118458U JP508386U JP508386U JPS62118458U JP S62118458 U JPS62118458 U JP S62118458U JP 508386 U JP508386 U JP 508386U JP 508386 U JP508386 U JP 508386U JP S62118458 U JPS62118458 U JP S62118458U
- Authority
- JP
- Japan
- Prior art keywords
- glass
- mesa
- junction
- covered
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims 2
- 238000002161 passivation Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thyristors (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の一実施例の構造を示した縦断
面図、第２図は、本考案の実施例を実現する製法
を示した説明図、第３図は、従来の両面メサ構造
半導体基板の組立図、第４図は、従来の両面メサ
構造サイリスタ基板の縦断面図である。 １…ゲート電極、２…カソード電極、８…アノ
ード電極。
面図、第２図は、本考案の実施例を実現する製法
を示した説明図、第３図は、従来の両面メサ構造
半導体基板の組立図、第４図は、従来の両面メサ
構造サイリスタ基板の縦断面図である。 １…ゲート電極、２…カソード電極、８…アノ
ード電極。
Claims (1)
- 少なくとも１つのＰ・Ｎ接合を有するガラスパ
シベーシヨン型半導体装置において、両主面より
形成したメサ形環状溝を有し、側面がすべてガラ
スにより覆われている事を特徴とする半導体装置
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP508386U JPS62118458U (ja) | 1986-01-20 | 1986-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP508386U JPS62118458U (ja) | 1986-01-20 | 1986-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62118458U true JPS62118458U (ja) | 1987-07-28 |
Family
ID=30786336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP508386U Pending JPS62118458U (ja) | 1986-01-20 | 1986-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118458U (ja) |
-
1986
- 1986-01-20 JP JP508386U patent/JPS62118458U/ja active Pending