JPS62117386A - 低温焼成セラミツク回路基板 - Google Patents
低温焼成セラミツク回路基板Info
- Publication number
- JPS62117386A JPS62117386A JP60255846A JP25584685A JPS62117386A JP S62117386 A JPS62117386 A JP S62117386A JP 60255846 A JP60255846 A JP 60255846A JP 25584685 A JP25584685 A JP 25584685A JP S62117386 A JPS62117386 A JP S62117386A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- resistor
- low
- layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 title description 11
- 239000004020 conductor Substances 0.000 claims description 26
- 239000011521 glass Substances 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 description 8
- 238000010304 firing Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910003112 MgO-Al2O3 Inorganic materials 0.000 description 1
- 240000004808 Saccharomyces cerevisiae Species 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Glass Compositions (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60255846A JPS62117386A (ja) | 1985-11-16 | 1985-11-16 | 低温焼成セラミツク回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60255846A JPS62117386A (ja) | 1985-11-16 | 1985-11-16 | 低温焼成セラミツク回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62117386A true JPS62117386A (ja) | 1987-05-28 |
| JPH0584680B2 JPH0584680B2 (enrdf_load_stackoverflow) | 1993-12-02 |
Family
ID=17284402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60255846A Granted JPS62117386A (ja) | 1985-11-16 | 1985-11-16 | 低温焼成セラミツク回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62117386A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02265206A (ja) * | 1989-04-05 | 1990-10-30 | Matsushita Electric Ind Co Ltd | 角板型チップ抵抗器およびその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5570056A (en) * | 1978-11-22 | 1980-05-27 | Hitachi Ltd | Preparation of thick film hybrid integrated circuit |
| JPS60160687A (ja) * | 1984-01-31 | 1985-08-22 | ソニー株式会社 | 厚膜積層基板 |
-
1985
- 1985-11-16 JP JP60255846A patent/JPS62117386A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5570056A (en) * | 1978-11-22 | 1980-05-27 | Hitachi Ltd | Preparation of thick film hybrid integrated circuit |
| JPS60160687A (ja) * | 1984-01-31 | 1985-08-22 | ソニー株式会社 | 厚膜積層基板 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02265206A (ja) * | 1989-04-05 | 1990-10-30 | Matsushita Electric Ind Co Ltd | 角板型チップ抵抗器およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0584680B2 (enrdf_load_stackoverflow) | 1993-12-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |