JPS621000B2 - - Google Patents
Info
- Publication number
- JPS621000B2 JPS621000B2 JP53157497A JP15749778A JPS621000B2 JP S621000 B2 JPS621000 B2 JP S621000B2 JP 53157497 A JP53157497 A JP 53157497A JP 15749778 A JP15749778 A JP 15749778A JP S621000 B2 JPS621000 B2 JP S621000B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- wafer
- semiconductor wafer
- plating liquid
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15749778A JPS5585692A (en) | 1978-12-22 | 1978-12-22 | Plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15749778A JPS5585692A (en) | 1978-12-22 | 1978-12-22 | Plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5585692A JPS5585692A (en) | 1980-06-27 |
| JPS621000B2 true JPS621000B2 (cs) | 1987-01-10 |
Family
ID=15650968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15749778A Granted JPS5585692A (en) | 1978-12-22 | 1978-12-22 | Plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5585692A (cs) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3348528B2 (ja) * | 1994-07-20 | 2002-11-20 | 富士通株式会社 | 半導体装置の製造方法と半導体装置及び電子回路装置の製造方法と電子回路装置 |
| JP2000232078A (ja) | 1999-02-10 | 2000-08-22 | Toshiba Corp | メッキ方法及びメッキ装置 |
| US6632335B2 (en) * | 1999-12-24 | 2003-10-14 | Ebara Corporation | Plating apparatus |
| KR100773165B1 (ko) * | 1999-12-24 | 2007-11-02 | 가부시키가이샤 에바라 세이사꾸쇼 | 반도체기판처리장치 및 처리방법 |
| JP4922275B2 (ja) * | 2008-10-20 | 2012-04-25 | 株式会社東芝 | メッキ方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5265665A (en) * | 1975-11-28 | 1977-05-31 | Hitachi Ltd | Formation of protruding electrode of semiconductor device |
-
1978
- 1978-12-22 JP JP15749778A patent/JPS5585692A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5585692A (en) | 1980-06-27 |
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