JPS6194357U - - Google Patents
Info
- Publication number
- JPS6194357U JPS6194357U JP1984179102U JP17910284U JPS6194357U JP S6194357 U JPS6194357 U JP S6194357U JP 1984179102 U JP1984179102 U JP 1984179102U JP 17910284 U JP17910284 U JP 17910284U JP S6194357 U JPS6194357 U JP S6194357U
- Authority
- JP
- Japan
- Prior art keywords
- metal member
- integrated circuit
- hybrid integrated
- insulating substrate
- envelope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の実施例に係る混成集積回路の
断面図、第２図は従来例に係る金属物材の表面で
ケースを接着する場合の混成集積回路の断面図、
第３図は従来例に係る金属部材の側面でケースを
接着する場合の混成集積回路の断面図である。
１……放熱用金造部材、２……表面に回路を形
成している絶縁基板、３……金属部材の表面に設
けられた凹部、４……接着用樹脂、５……ケース
。
FIG. 1 is a sectional view of a hybrid integrated circuit according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional hybrid integrated circuit in which a case is bonded to the surface of a metal material.
FIG. 3 is a sectional view of a conventional hybrid integrated circuit in which a case is bonded to the side surface of a metal member. DESCRIPTION OF SYMBOLS 1... Metal member for heat dissipation, 2... Insulating substrate with a circuit formed on its surface, 3... Recess provided on the surface of the metal member, 4... Adhesive resin, 5... Case.
Claims (1)
板が搭載され、その搭載面をほぼ覆うように外囲
器が装着されている混成集積回路において、前記
金属部材の面のうち絶縁基板で覆われていない部
分に凹部を設け、かつその凹部で前記外囲器と前
記金属部材とが接着剤により接続されていること
を特徴とする混成集積回路。 In a hybrid integrated circuit in which an insulating substrate on which a circuit is configured is mounted on the surface of a metal member for heat dissipation, and an envelope is attached to almost cover the mounting surface, the surface of the metal member that is covered with the insulating substrate 1. A hybrid integrated circuit characterized in that a recess is provided in a portion that is not covered, and the envelope and the metal member are connected by an adhesive at the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984179102U JPH0311892Y2 (en) | 1984-11-26 | 1984-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984179102U JPH0311892Y2 (en) | 1984-11-26 | 1984-11-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6194357U true JPS6194357U (en) | 1986-06-18 |
| JPH0311892Y2 JPH0311892Y2 (en) | 1991-03-20 |
Family
ID=30736665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984179102U Expired JPH0311892Y2 (en) | 1984-11-26 | 1984-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0311892Y2 (en) |
-
1984
- 1984-11-26 JP JP1984179102U patent/JPH0311892Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0311892Y2 (en) | 1991-03-20 |