JPS6193633A - 半導体基板用モリブデン板の製造方法 - Google Patents

半導体基板用モリブデン板の製造方法

Info

Publication number
JPS6193633A
JPS6193633A JP59214099A JP21409984A JPS6193633A JP S6193633 A JPS6193633 A JP S6193633A JP 59214099 A JP59214099 A JP 59214099A JP 21409984 A JP21409984 A JP 21409984A JP S6193633 A JPS6193633 A JP S6193633A
Authority
JP
Japan
Prior art keywords
molybdenum
plate
thickness
punching
clearance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59214099A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0574935B2 (ref
Inventor
Hideyuki Kameyasu
亀安　秀行
Akira Kobayashi
昭 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Tungsten Co Ltd
Original Assignee
Tokyo Tungsten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Tungsten Co Ltd filed Critical Tokyo Tungsten Co Ltd
Priority to JP59214099A priority Critical patent/JPS6193633A/ja
Publication of JPS6193633A publication Critical patent/JPS6193633A/ja
Publication of JPH0574935B2 publication Critical patent/JPH0574935B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Punching Or Piercing (AREA)
  • Die Bonding (AREA)
JP59214099A 1984-10-15 1984-10-15 半導体基板用モリブデン板の製造方法 Granted JPS6193633A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59214099A JPS6193633A (ja) 1984-10-15 1984-10-15 半導体基板用モリブデン板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59214099A JPS6193633A (ja) 1984-10-15 1984-10-15 半導体基板用モリブデン板の製造方法

Publications (2)

Publication Number Publication Date
JPS6193633A true JPS6193633A (ja) 1986-05-12
JPH0574935B2 JPH0574935B2 (ref) 1993-10-19

Family

ID=16650205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59214099A Granted JPS6193633A (ja) 1984-10-15 1984-10-15 半導体基板用モリブデン板の製造方法

Country Status (1)

Country Link
JP (1) JPS6193633A (ref)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513056U (ja) * 1991-07-26 1993-02-19 京セラ株式会社 半導体素子収納用パツケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513056U (ja) * 1991-07-26 1993-02-19 京セラ株式会社 半導体素子収納用パツケージ

Also Published As

Publication number Publication date
JPH0574935B2 (ref) 1993-10-19

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