JPS6190867A - ウェーハの研磨方法 - Google Patents

ウェーハの研磨方法

Info

Publication number
JPS6190867A
JPS6190867A JP59209291A JP20929184A JPS6190867A JP S6190867 A JPS6190867 A JP S6190867A JP 59209291 A JP59209291 A JP 59209291A JP 20929184 A JP20929184 A JP 20929184A JP S6190867 A JPS6190867 A JP S6190867A
Authority
JP
Japan
Prior art keywords
surface plate
low speed
carrier
speed
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59209291A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0225748B2 (enExample
Inventor
Koji Yamaga
山賀　公司
Toshio Miyashita
宮下　利雄
Yukio Ogiwara
幸雄 荻原
Tomoyuki Takeuchi
竹内　知之
Takeshi Tanaka
健 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Naoetsu Electronics Co Ltd
Shin Etsu Engineering Co Ltd
Original Assignee
Naoetsu Electronics Co Ltd
Shin Etsu Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Naoetsu Electronics Co Ltd, Shin Etsu Engineering Co Ltd filed Critical Naoetsu Electronics Co Ltd
Priority to JP59209291A priority Critical patent/JPS6190867A/ja
Publication of JPS6190867A publication Critical patent/JPS6190867A/ja
Publication of JPH0225748B2 publication Critical patent/JPH0225748B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP59209291A 1984-10-05 1984-10-05 ウェーハの研磨方法 Granted JPS6190867A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59209291A JPS6190867A (ja) 1984-10-05 1984-10-05 ウェーハの研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59209291A JPS6190867A (ja) 1984-10-05 1984-10-05 ウェーハの研磨方法

Publications (2)

Publication Number Publication Date
JPS6190867A true JPS6190867A (ja) 1986-05-09
JPH0225748B2 JPH0225748B2 (enExample) 1990-06-05

Family

ID=16570509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59209291A Granted JPS6190867A (ja) 1984-10-05 1984-10-05 ウェーハの研磨方法

Country Status (1)

Country Link
JP (1) JPS6190867A (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4894289U (enExample) * 1972-02-12 1973-11-10
JPS5743738A (en) * 1980-08-26 1982-03-11 Koga Tadashi Non-deashing microscopic wafer polishing machine of hard tissue
JPS5766860A (en) * 1980-10-14 1982-04-23 Supiide Fuamu Kk Abrasive liquid selector device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4894289U (enExample) * 1972-02-12 1973-11-10
JPS5743738A (en) * 1980-08-26 1982-03-11 Koga Tadashi Non-deashing microscopic wafer polishing machine of hard tissue
JPS5766860A (en) * 1980-10-14 1982-04-23 Supiide Fuamu Kk Abrasive liquid selector device

Also Published As

Publication number Publication date
JPH0225748B2 (enExample) 1990-06-05

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