JPS6186068A - プリント基板把持具保持機構 - Google Patents
プリント基板把持具保持機構Info
- Publication number
- JPS6186068A JPS6186068A JP20866884A JP20866884A JPS6186068A JP S6186068 A JPS6186068 A JP S6186068A JP 20866884 A JP20866884 A JP 20866884A JP 20866884 A JP20866884 A JP 20866884A JP S6186068 A JPS6186068 A JP S6186068A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- shaft
- soldering
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20866884A JPS6186068A (ja) | 1984-10-04 | 1984-10-04 | プリント基板把持具保持機構 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20866884A JPS6186068A (ja) | 1984-10-04 | 1984-10-04 | プリント基板把持具保持機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6186068A true JPS6186068A (ja) | 1986-05-01 |
JPH0156866B2 JPH0156866B2 (enrdf_load_html_response) | 1989-12-01 |
Family
ID=16560072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20866884A Granted JPS6186068A (ja) | 1984-10-04 | 1984-10-04 | プリント基板把持具保持機構 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6186068A (enrdf_load_html_response) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103200781A (zh) * | 2013-04-16 | 2013-07-10 | 中国电子科技集团公司第二十研究所 | 一种smd器件的印焊膏装置 |
CN106385773A (zh) * | 2016-10-27 | 2017-02-08 | 江门市众能电控科技有限公司 | 一种电路板的自动浸锡设备及工艺 |
-
1984
- 1984-10-04 JP JP20866884A patent/JPS6186068A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103200781A (zh) * | 2013-04-16 | 2013-07-10 | 中国电子科技集团公司第二十研究所 | 一种smd器件的印焊膏装置 |
CN106385773A (zh) * | 2016-10-27 | 2017-02-08 | 江门市众能电控科技有限公司 | 一种电路板的自动浸锡设备及工艺 |
Also Published As
Publication number | Publication date |
---|---|
JPH0156866B2 (enrdf_load_html_response) | 1989-12-01 |
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