JPS6183039U - - Google Patents

Info

Publication number
JPS6183039U
JPS6183039U JP1984167689U JP16768984U JPS6183039U JP S6183039 U JPS6183039 U JP S6183039U JP 1984167689 U JP1984167689 U JP 1984167689U JP 16768984 U JP16768984 U JP 16768984U JP S6183039 U JPS6183039 U JP S6183039U
Authority
JP
Japan
Prior art keywords
lead frame
recess
semiconductor
semiconductor chip
mounting agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984167689U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984167689U priority Critical patent/JPS6183039U/ja
Publication of JPS6183039U publication Critical patent/JPS6183039U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/30
    • H10W72/01308
    • H10W72/536
    • H10W72/5363
    • H10W72/884

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1984167689U 1984-11-05 1984-11-05 Pending JPS6183039U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984167689U JPS6183039U (enExample) 1984-11-05 1984-11-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984167689U JPS6183039U (enExample) 1984-11-05 1984-11-05

Publications (1)

Publication Number Publication Date
JPS6183039U true JPS6183039U (enExample) 1986-06-02

Family

ID=30725479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984167689U Pending JPS6183039U (enExample) 1984-11-05 1984-11-05

Country Status (1)

Country Link
JP (1) JPS6183039U (enExample)

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