JPS6182993A - 複合ろう材 - Google Patents
複合ろう材Info
- Publication number
- JPS6182993A JPS6182993A JP20510984A JP20510984A JPS6182993A JP S6182993 A JPS6182993 A JP S6182993A JP 20510984 A JP20510984 A JP 20510984A JP 20510984 A JP20510984 A JP 20510984A JP S6182993 A JPS6182993 A JP S6182993A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- brazing
- composite
- plate
- filler metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20510984A JPS6182993A (ja) | 1984-09-29 | 1984-09-29 | 複合ろう材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20510984A JPS6182993A (ja) | 1984-09-29 | 1984-09-29 | 複合ろう材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6182993A true JPS6182993A (ja) | 1986-04-26 |
JPH0433556B2 JPH0433556B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-06-03 |
Family
ID=16501567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20510984A Granted JPS6182993A (ja) | 1984-09-29 | 1984-09-29 | 複合ろう材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6182993A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6340775A (ja) * | 1986-08-07 | 1988-02-22 | セイコーインスツルメンツ株式会社 | 接合部材 |
JPH05163077A (ja) * | 1991-12-16 | 1993-06-29 | Denki Kagaku Kogyo Kk | セラミックス回路基板 |
CN103846570A (zh) * | 2014-03-06 | 2014-06-11 | 河南晶泰航空航天高新材料科技有限公司 | 一种钎焊高体积分数碳化硅颗粒增强铝基复合材料的银基钎料的制备方法 |
-
1984
- 1984-09-29 JP JP20510984A patent/JPS6182993A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6340775A (ja) * | 1986-08-07 | 1988-02-22 | セイコーインスツルメンツ株式会社 | 接合部材 |
JPH05163077A (ja) * | 1991-12-16 | 1993-06-29 | Denki Kagaku Kogyo Kk | セラミックス回路基板 |
CN103846570A (zh) * | 2014-03-06 | 2014-06-11 | 河南晶泰航空航天高新材料科技有限公司 | 一种钎焊高体积分数碳化硅颗粒增强铝基复合材料的银基钎料的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0433556B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-06-03 |