JPS6182448A - 半導体パツケ−ジ - Google Patents

半導体パツケ−ジ

Info

Publication number
JPS6182448A
JPS6182448A JP59204549A JP20454984A JPS6182448A JP S6182448 A JPS6182448 A JP S6182448A JP 59204549 A JP59204549 A JP 59204549A JP 20454984 A JP20454984 A JP 20454984A JP S6182448 A JPS6182448 A JP S6182448A
Authority
JP
Japan
Prior art keywords
metal layer
semiconductor element
semiconductor package
solder
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59204549A
Other languages
English (en)
Japanese (ja)
Other versions
JPH043666B2 (index.php
Inventor
Hiroshi Matsumoto
弘 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP59204549A priority Critical patent/JPS6182448A/ja
Publication of JPS6182448A publication Critical patent/JPS6182448A/ja
Publication of JPH043666B2 publication Critical patent/JPH043666B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W95/00—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
JP59204549A 1984-09-29 1984-09-29 半導体パツケ−ジ Granted JPS6182448A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59204549A JPS6182448A (ja) 1984-09-29 1984-09-29 半導体パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59204549A JPS6182448A (ja) 1984-09-29 1984-09-29 半導体パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6182448A true JPS6182448A (ja) 1986-04-26
JPH043666B2 JPH043666B2 (index.php) 1992-01-23

Family

ID=16492343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59204549A Granted JPS6182448A (ja) 1984-09-29 1984-09-29 半導体パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6182448A (index.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5760466A (en) * 1995-04-20 1998-06-02 Kyocera Corporation Semiconductor device having improved heat resistance

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5760466A (en) * 1995-04-20 1998-06-02 Kyocera Corporation Semiconductor device having improved heat resistance

Also Published As

Publication number Publication date
JPH043666B2 (index.php) 1992-01-23

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term