JPS6180896A - 多層配線基板 - Google Patents

多層配線基板

Info

Publication number
JPS6180896A
JPS6180896A JP59201934A JP20193484A JPS6180896A JP S6180896 A JPS6180896 A JP S6180896A JP 59201934 A JP59201934 A JP 59201934A JP 20193484 A JP20193484 A JP 20193484A JP S6180896 A JPS6180896 A JP S6180896A
Authority
JP
Japan
Prior art keywords
multilayer wiring
wiring board
layer
multilayer
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59201934A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0434838B2 (cs
Inventor
昭雄 高橋
捷夫 菅原
正博 小野
信宏 佐藤
晃 永井
和嶋　元世
奈良原　俊和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59201934A priority Critical patent/JPS6180896A/ja
Publication of JPS6180896A publication Critical patent/JPS6180896A/ja
Publication of JPH0434838B2 publication Critical patent/JPH0434838B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP59201934A 1984-09-28 1984-09-28 多層配線基板 Granted JPS6180896A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59201934A JPS6180896A (ja) 1984-09-28 1984-09-28 多層配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59201934A JPS6180896A (ja) 1984-09-28 1984-09-28 多層配線基板

Publications (2)

Publication Number Publication Date
JPS6180896A true JPS6180896A (ja) 1986-04-24
JPH0434838B2 JPH0434838B2 (cs) 1992-06-09

Family

ID=16449207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59201934A Granted JPS6180896A (ja) 1984-09-28 1984-09-28 多層配線基板

Country Status (1)

Country Link
JP (1) JPS6180896A (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6324696A (ja) * 1986-07-17 1988-02-02 日本電気株式会社 高多層配線基板
JPH01262696A (ja) * 1988-03-11 1989-10-19 Internatl Business Mach Corp <Ibm> 絶縁性基板を製造する方法
JP2021077758A (ja) * 2019-11-08 2021-05-20 日本特殊陶業株式会社 多層配線基板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365975A (en) * 1976-11-25 1978-06-12 Fujitsu Ltd Method of producing multilayer printed circuit board
JPS53122765A (en) * 1977-03-31 1978-10-26 Matsushita Electric Works Ltd Multilayer printed circuit board
JPS5641198A (en) * 1979-09-12 1981-04-17 Showa Hikouki Kogyo Kk Operating device for bottom valve in tank truck

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365975A (en) * 1976-11-25 1978-06-12 Fujitsu Ltd Method of producing multilayer printed circuit board
JPS53122765A (en) * 1977-03-31 1978-10-26 Matsushita Electric Works Ltd Multilayer printed circuit board
JPS5641198A (en) * 1979-09-12 1981-04-17 Showa Hikouki Kogyo Kk Operating device for bottom valve in tank truck

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6324696A (ja) * 1986-07-17 1988-02-02 日本電気株式会社 高多層配線基板
JPH01262696A (ja) * 1988-03-11 1989-10-19 Internatl Business Mach Corp <Ibm> 絶縁性基板を製造する方法
JP2021077758A (ja) * 2019-11-08 2021-05-20 日本特殊陶業株式会社 多層配線基板

Also Published As

Publication number Publication date
JPH0434838B2 (cs) 1992-06-09

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