JPS6178592A - 銀ろう材 - Google Patents
銀ろう材Info
- Publication number
- JPS6178592A JPS6178592A JP19861484A JP19861484A JPS6178592A JP S6178592 A JPS6178592 A JP S6178592A JP 19861484 A JP19861484 A JP 19861484A JP 19861484 A JP19861484 A JP 19861484A JP S6178592 A JPS6178592 A JP S6178592A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- melting point
- added
- alloy
- effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Contacts (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19861484A JPS6178592A (ja) | 1984-09-25 | 1984-09-25 | 銀ろう材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19861484A JPS6178592A (ja) | 1984-09-25 | 1984-09-25 | 銀ろう材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6178592A true JPS6178592A (ja) | 1986-04-22 |
JPH0438519B2 JPH0438519B2 (enrdf_load_stackoverflow) | 1992-06-24 |
Family
ID=16394116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19861484A Granted JPS6178592A (ja) | 1984-09-25 | 1984-09-25 | 銀ろう材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6178592A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG135164A1 (en) * | 2006-03-03 | 2007-09-28 | Electroplating Eng | Electronic part |
-
1984
- 1984-09-25 JP JP19861484A patent/JPS6178592A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG135164A1 (en) * | 2006-03-03 | 2007-09-28 | Electroplating Eng | Electronic part |
JP2007266582A (ja) * | 2006-03-03 | 2007-10-11 | Electroplating Eng Of Japan Co | 電子部品 |
Also Published As
Publication number | Publication date |
---|---|
JPH0438519B2 (enrdf_load_stackoverflow) | 1992-06-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2885773B2 (ja) | 半田付け用無鉛合金 | |
US6180055B1 (en) | Lead-free solder alloy | |
US6296722B1 (en) | Lead-free solder alloy | |
JP2000094181A (ja) | はんだ合金組成物 | |
JP2807008B2 (ja) | 熱疲労特性に優れたPb合金ろう | |
JP3850135B2 (ja) | 高温はんだ付用Zn合金 | |
CA2340393A1 (en) | Lead-free solder | |
EP3707285B1 (en) | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications | |
US6361626B1 (en) | Solder alloy and soldered bond | |
JP4282482B2 (ja) | はんだ合金およびはんだ接合部 | |
JPH10328880A (ja) | 錫−銀系無鉛半田合金 | |
JP3386009B2 (ja) | はんだ合金 | |
CN113385853A (zh) | 一种低银高可靠无铅软钎料及其制备方法、应用 | |
EP3707286B1 (en) | High reliability lead-free solder alloy for electronic applications in extreme environments | |
Maalekian et al. | Efect of Bi content on properties of low silver SAC solder | |
JPS6178592A (ja) | 銀ろう材 | |
JPS6178590A (ja) | 銀ろう材 | |
JP2001047276A (ja) | はんだ材料 | |
JPS6178591A (ja) | 銀ろう材 | |
JPS596753B2 (ja) | 銀ろう合金 | |
JPS61242787A (ja) | 銀ろう材 | |
JPH05228687A (ja) | 金属接合用Zn基合金 | |
JPH02179385A (ja) | 低融点Agはんだ | |
KR100320545B1 (ko) | Sn계저융점땜납재 | |
JPH02179386A (ja) | 低融点Agはんだ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |