JPS6178592A - 銀ろう材 - Google Patents

銀ろう材

Info

Publication number
JPS6178592A
JPS6178592A JP19861484A JP19861484A JPS6178592A JP S6178592 A JPS6178592 A JP S6178592A JP 19861484 A JP19861484 A JP 19861484A JP 19861484 A JP19861484 A JP 19861484A JP S6178592 A JPS6178592 A JP S6178592A
Authority
JP
Japan
Prior art keywords
brazing
melting point
added
alloy
effect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19861484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0438519B2 (enrdf_load_stackoverflow
Inventor
Yoshihiro Hosoi
義博 細井
Hiroto Daigo
醍醐 裕人
Minobu Kunitomo
国友 美信
Takashi Nara
奈良 喬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Tokuriki Honten Co Ltd
Original Assignee
Kyocera Corp
Tokuriki Honten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp, Tokuriki Honten Co Ltd filed Critical Kyocera Corp
Priority to JP19861484A priority Critical patent/JPS6178592A/ja
Publication of JPS6178592A publication Critical patent/JPS6178592A/ja
Publication of JPH0438519B2 publication Critical patent/JPH0438519B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Contacts (AREA)
  • Ceramic Products (AREA)
JP19861484A 1984-09-25 1984-09-25 銀ろう材 Granted JPS6178592A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19861484A JPS6178592A (ja) 1984-09-25 1984-09-25 銀ろう材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19861484A JPS6178592A (ja) 1984-09-25 1984-09-25 銀ろう材

Publications (2)

Publication Number Publication Date
JPS6178592A true JPS6178592A (ja) 1986-04-22
JPH0438519B2 JPH0438519B2 (enrdf_load_stackoverflow) 1992-06-24

Family

ID=16394116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19861484A Granted JPS6178592A (ja) 1984-09-25 1984-09-25 銀ろう材

Country Status (1)

Country Link
JP (1) JPS6178592A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG135164A1 (en) * 2006-03-03 2007-09-28 Electroplating Eng Electronic part

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG135164A1 (en) * 2006-03-03 2007-09-28 Electroplating Eng Electronic part
JP2007266582A (ja) * 2006-03-03 2007-10-11 Electroplating Eng Of Japan Co 電子部品

Also Published As

Publication number Publication date
JPH0438519B2 (enrdf_load_stackoverflow) 1992-06-24

Similar Documents

Publication Publication Date Title
JP2885773B2 (ja) 半田付け用無鉛合金
US6180055B1 (en) Lead-free solder alloy
US6296722B1 (en) Lead-free solder alloy
JP2000094181A (ja) はんだ合金組成物
JP2807008B2 (ja) 熱疲労特性に優れたPb合金ろう
JP3850135B2 (ja) 高温はんだ付用Zn合金
CA2340393A1 (en) Lead-free solder
EP3707285B1 (en) Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications
US6361626B1 (en) Solder alloy and soldered bond
JP4282482B2 (ja) はんだ合金およびはんだ接合部
JPH10328880A (ja) 錫−銀系無鉛半田合金
JP3386009B2 (ja) はんだ合金
CN113385853A (zh) 一种低银高可靠无铅软钎料及其制备方法、应用
EP3707286B1 (en) High reliability lead-free solder alloy for electronic applications in extreme environments
Maalekian et al. Efect of Bi content on properties of low silver SAC solder
JPS6178592A (ja) 銀ろう材
JPS6178590A (ja) 銀ろう材
JP2001047276A (ja) はんだ材料
JPS6178591A (ja) 銀ろう材
JPS596753B2 (ja) 銀ろう合金
JPS61242787A (ja) 銀ろう材
JPH05228687A (ja) 金属接合用Zn基合金
JPH02179385A (ja) 低融点Agはんだ
KR100320545B1 (ko) Sn계저융점땜납재
JPH02179386A (ja) 低融点Agはんだ

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term