JPS6177279A - 回路の接続部材 - Google Patents
回路の接続部材Info
- Publication number
- JPS6177279A JPS6177279A JP19924784A JP19924784A JPS6177279A JP S6177279 A JPS6177279 A JP S6177279A JP 19924784 A JP19924784 A JP 19924784A JP 19924784 A JP19924784 A JP 19924784A JP S6177279 A JPS6177279 A JP S6177279A
- Authority
- JP
- Japan
- Prior art keywords
- conductive particles
- connecting member
- circuit
- particles
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 claims description 90
- 230000001070 adhesive effect Effects 0.000 claims description 39
- 239000000853 adhesive Substances 0.000 claims description 34
- 238000002844 melting Methods 0.000 claims description 24
- 230000008018 melting Effects 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000011162 core material Substances 0.000 claims description 20
- 229920001169 thermoplastic Polymers 0.000 claims description 11
- 239000004416 thermosoftening plastic Substances 0.000 claims description 10
- 238000002834 transmittance Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 239000002904 solvent Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 238000009413 insulation Methods 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000002923 metal particle Substances 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 3
- 230000003712 anti-aging effect Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000007771 core particle Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 206010040844 Skin exfoliation Diseases 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002609 medium Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000013040 bath agent Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical class C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229920006228 ethylene acrylate copolymer Polymers 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000007757 hot melt coating Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000011197 physicochemical method Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19924784A JPS6177279A (ja) | 1984-09-21 | 1984-09-21 | 回路の接続部材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19924784A JPS6177279A (ja) | 1984-09-21 | 1984-09-21 | 回路の接続部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6177279A true JPS6177279A (ja) | 1986-04-19 |
| JPS6331906B2 JPS6331906B2 (enrdf_load_stackoverflow) | 1988-06-27 |
Family
ID=16404614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19924784A Granted JPS6177279A (ja) | 1984-09-21 | 1984-09-21 | 回路の接続部材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6177279A (enrdf_load_stackoverflow) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6177278A (ja) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | 回路の接続部材 |
| JPS6178069A (ja) * | 1984-09-26 | 1986-04-21 | 日立化成工業株式会社 | 回路の接続部材 |
| JPS61173471A (ja) * | 1985-01-28 | 1986-08-05 | シャープ株式会社 | 熱圧着コネクタ− |
| JPS62115679A (ja) * | 1985-11-15 | 1987-05-27 | 富士高分子工業株式会社 | 電気接続体 |
| JPS63301407A (ja) * | 1987-05-29 | 1988-12-08 | Hitachi Chem Co Ltd | 回路の接続部材 |
| JPS6447084U (enrdf_load_stackoverflow) * | 1987-09-16 | 1989-03-23 | ||
| JPH0521094A (ja) * | 1991-07-12 | 1993-01-29 | Hitachi Chem Co Ltd | 異方導電性接着剤 |
| JPH08249922A (ja) * | 1995-10-31 | 1996-09-27 | Hitachi Chem Co Ltd | 被覆粒子 |
| JP2002260446A (ja) * | 2001-02-27 | 2002-09-13 | Sekisui Chem Co Ltd | 導電性微粒子及び導電接続構造体 |
| JP2010182492A (ja) * | 2009-02-04 | 2010-08-19 | Hitachi Cable Ltd | 端子及び端子と電線の接続方法 |
| WO2011001961A1 (ja) * | 2009-06-30 | 2011-01-06 | Dic株式会社 | 透明導電層パターンの形成方法 |
| CN102386490A (zh) * | 2010-06-15 | 2012-03-21 | 罗伯特·博世有限公司 | 电连接装置 |
| JP5567834B2 (ja) * | 2007-12-20 | 2014-08-06 | 株式会社クラレ | 熱可塑性重合体組成物及びそれからなる成形品 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51135938A (en) * | 1975-05-21 | 1976-11-25 | Seiko Epson Corp | Anisotropic electroconductive adhesive |
| JPS5823174A (ja) * | 1981-07-31 | 1983-02-10 | 信越ポリマー株式会社 | 接続端子の電気接続方法 |
| JPS6084718A (ja) * | 1983-10-14 | 1985-05-14 | 日立化成工業株式会社 | 導電異方性接着シ−ト |
-
1984
- 1984-09-21 JP JP19924784A patent/JPS6177279A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51135938A (en) * | 1975-05-21 | 1976-11-25 | Seiko Epson Corp | Anisotropic electroconductive adhesive |
| JPS5823174A (ja) * | 1981-07-31 | 1983-02-10 | 信越ポリマー株式会社 | 接続端子の電気接続方法 |
| JPS6084718A (ja) * | 1983-10-14 | 1985-05-14 | 日立化成工業株式会社 | 導電異方性接着シ−ト |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6177278A (ja) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | 回路の接続部材 |
| JPS6178069A (ja) * | 1984-09-26 | 1986-04-21 | 日立化成工業株式会社 | 回路の接続部材 |
| JPS61173471A (ja) * | 1985-01-28 | 1986-08-05 | シャープ株式会社 | 熱圧着コネクタ− |
| JPS62115679A (ja) * | 1985-11-15 | 1987-05-27 | 富士高分子工業株式会社 | 電気接続体 |
| JPS63301407A (ja) * | 1987-05-29 | 1988-12-08 | Hitachi Chem Co Ltd | 回路の接続部材 |
| JPS6447084U (enrdf_load_stackoverflow) * | 1987-09-16 | 1989-03-23 | ||
| JPH0521094A (ja) * | 1991-07-12 | 1993-01-29 | Hitachi Chem Co Ltd | 異方導電性接着剤 |
| JPH08249922A (ja) * | 1995-10-31 | 1996-09-27 | Hitachi Chem Co Ltd | 被覆粒子 |
| JP2002260446A (ja) * | 2001-02-27 | 2002-09-13 | Sekisui Chem Co Ltd | 導電性微粒子及び導電接続構造体 |
| JP5567834B2 (ja) * | 2007-12-20 | 2014-08-06 | 株式会社クラレ | 熱可塑性重合体組成物及びそれからなる成形品 |
| JP2010182492A (ja) * | 2009-02-04 | 2010-08-19 | Hitachi Cable Ltd | 端子及び端子と電線の接続方法 |
| WO2011001961A1 (ja) * | 2009-06-30 | 2011-01-06 | Dic株式会社 | 透明導電層パターンの形成方法 |
| TWI412044B (zh) * | 2009-06-30 | 2013-10-11 | Dainippon Ink & Chemicals | 透明導電層圖案之形成方法 |
| US8647463B2 (en) | 2009-06-30 | 2014-02-11 | Dic Corporation | Method for forming transparent conductive layer pattern |
| CN102386490A (zh) * | 2010-06-15 | 2012-03-21 | 罗伯特·博世有限公司 | 电连接装置 |
| CN102386490B (zh) * | 2010-06-15 | 2016-01-20 | 罗伯特·博世有限公司 | 电连接装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6331906B2 (enrdf_load_stackoverflow) | 1988-06-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |