JPS6173355A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6173355A
JPS6173355A JP59194644A JP19464484A JPS6173355A JP S6173355 A JPS6173355 A JP S6173355A JP 59194644 A JP59194644 A JP 59194644A JP 19464484 A JP19464484 A JP 19464484A JP S6173355 A JPS6173355 A JP S6173355A
Authority
JP
Japan
Prior art keywords
leads
row
resin
lower row
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59194644A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0469431B2 (https=
Inventor
Tomio Yamada
富男 山田
Koichiro Satonaka
里中　孝一郎
Akiro Hoshi
星　彰郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59194644A priority Critical patent/JPS6173355A/ja
Publication of JPS6173355A publication Critical patent/JPS6173355A/ja
Publication of JPH0469431B2 publication Critical patent/JPH0469431B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP59194644A 1984-09-19 1984-09-19 半導体装置 Granted JPS6173355A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59194644A JPS6173355A (ja) 1984-09-19 1984-09-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59194644A JPS6173355A (ja) 1984-09-19 1984-09-19 半導体装置

Publications (2)

Publication Number Publication Date
JPS6173355A true JPS6173355A (ja) 1986-04-15
JPH0469431B2 JPH0469431B2 (https=) 1992-11-06

Family

ID=16327938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59194644A Granted JPS6173355A (ja) 1984-09-19 1984-09-19 半導体装置

Country Status (1)

Country Link
JP (1) JPS6173355A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09214120A (ja) * 1997-01-27 1997-08-15 Canon Inc 電子部品の半田付け方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5609574B2 (ja) * 2010-11-12 2014-10-22 三菱電機株式会社 方向性結合器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947567U (https=) * 1972-08-02 1974-04-25
JPS55156459U (https=) * 1980-02-20 1980-11-11
JPS58298U (ja) * 1981-06-24 1983-01-05 株式会社椿本チエイン 傘乾燥機

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947567U (https=) * 1972-08-02 1974-04-25
JPS55156459U (https=) * 1980-02-20 1980-11-11
JPS58298U (ja) * 1981-06-24 1983-01-05 株式会社椿本チエイン 傘乾燥機

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09214120A (ja) * 1997-01-27 1997-08-15 Canon Inc 電子部品の半田付け方法

Also Published As

Publication number Publication date
JPH0469431B2 (https=) 1992-11-06

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