JPS6171959A - Continuous grinding method - Google Patents

Abstract

PURPOSE:To lessen man-hours and reduce processing stages with high precision secured by holding a work with one of the grinding tools facing each other, allowing this tool to be transported together with the work continuously, and thereby grinding both sides simultaneously. CONSTITUTION:A work 26 is fitted on a carrier 25 of a lower surface reference plate 23, and pinched by this and an upper surface reference plate 21 with the aid of a collet chuck 27. The two surface reference plates are rotated in the opposite directions, and processing is carried out while a grinding agent 29 is poured on. After a certain while of processing, the work 26 and lower plate 23 are sunk through the action of collet chuck 27, and the lower plate 23 is released from the collet chuck 27 and transported to the processing place as subsequent stage placed upon a conveying means 28. In this place, the lower plate 23 is raised by the collet chuck 27 in said place in the same manner as described above, and the work 26 is pinched by this and the upper surface reference plate 21 as subsequent stage to be followed by repeated processing procedure as above. This facilitates removal of warp or waving, so that lessening of the man-hours and reduction of processing stages can be done with high precision.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a continuous polishing method for polishing a workpiece, particularly an optical element, with high efficiency.

<Prior Art> Conventionally, an apparatus for polishing parallel planes of optical elements, such as glass, performs badge processing using a double-sided lapping machine as shown in FIG.

That is, the upper surface plate 1 and the lower surface plate 2, which hold the polishing root 6 on opposing surfaces, are rotated in opposite directions, and the sun gear 3 is rotated in a fixed direction around the center of rotation. The workpiece 8 is fitted into the carrier 4 which has a hole of the same shape as the outer shape of the workpiece 8 between the carrier 5 and the carrier 4.
The upper and lower surfaces of the workpiece 8 are machined at the same time by inserting the workpiece with the lower surface plates 1 and 2 and supplying the abrasive material 7.

In addition, as shown in FIG. 5, there is a device called a through-feed grinding machine, but in this device, a workpiece 15 is placed on a belt 12 that moves on a magnetic chuck 14 by a drive pulley 13, and while the workpiece 15 is conveyed, the The upper surface of the workpiece 15 is continuously ground by rotating a cylindrical grinding wheel 11 and supplying a grinding fluid 16.

<Problems to be solved by the invention> By the way, in the apparatus shown in FIG.
The disadvantage is that it is not possible to take out the workpieces continuously from 2 to 3, and that loading and unloading the workpieces requires manpower, making it difficult to increase efficiency.

Still, the apparatus shown in FIG. 5 cannot process both sides of the workpiece 150 at the same time, and after processing one side, the workpiece 150 cannot process the opposite side.
This has the disadvantage of requiring the same processing steps to be reversed, making the work cumbersome.

The present invention relates to a polishing method that can simultaneously polish both sides of a workpiece, particularly an optical element, efficiently and with high precision.

<Means for solving the problem> The present invention uses an apparatus for machining a workpiece with abrasive tools that rotate in opposite directions (and that face each other), holds the workpiece in one of the abrasive tools, and This is a method in which the tool is conveyed together with the workpiece to the tool position of an adjacent next-stage processing machine and polished continuously.

<Description of Examples> The present invention will be described with reference to FIGS. 1 and 2 regarding examples.

FIG. 1(a) is a longitudinal sectional view of a polishing device (processing machine) to which the present invention is applied, FIG. 1(b) is a top view of the lower surface plate, and FIG. 2 is the operation of the polishing device of FIG. 1. It is an explanatory diagram.

In the figure, 21 is an upper surface plate that holds an abrasive sheet 22 on its lower surface, 23 is a lower surface plate that holds an abrasive sheet 24 on its upper surface, supports a carrier 25 that holds a workpiece 26, and a measuring plate 21. 23 rotate in opposite directions.

The carrier 25 holds the workpiece 26 by inserting it into a hole slightly wider than the workpiece 26, with the workpiece 26 slightly eccentric with respect to the rotating shaft of the lower surface plate 23. Reference numeral 27 denotes a collet chuck that supports the lower surface plate 23 together with its rotating shaft, and is configured to allow the lower surface plate 23 to move up and down.

Reference numeral 28 denotes a conveying means disposed below the lower surface plate 23, which is used to transport the same type of processing machine (polishing device) at the next stage as shown in FIG.
As shown in b), the lower surface plate 23 is conveyed together with the workpiece 26. Note that 29 is an abrasive applied to the workpiece 26.

Next, its effect will be explained.

First, the workpiece 26 is mounted on the carrier 25 of the lower surface plate 23,
The lower surface plate 23 is moved upward via the collet chuck 27 as shown in FIG. 2(a), and the workpiece 26 is moved onto the upper surface plate 2.
1 and the lower surface plate 23, the measuring plates 21 and 23 are rotated in opposite directions, and processing is performed while pouring the abrasive 29.

In this case, the rotational speeds of the measuring plates 21 and 23 are set to have a slight difference in rotational speed in order to give rotation to the workpiece 26.

However, in the actual machining, as shown in Fig. 1(a), machining is also carried out at the same time in the polishing devices at adjacent positions, and after a certain machining time, the workpiece 26 and the lower surface plate 23 are 2(b), the lower surface plate 23 is released from the collet chuck 27 and placed on the conveying means 28, as shown in FIG. 1(b). The lower surface plate 23 is held in the collet chuck 27 of the next stage (polishing device) shown by the adjacent two-dot chain line. 23 is raised, the workpiece 26 is held between it and the upper surface plate 21 of the next stage, and the machining operation is repeated again. ” In this way, the workpiece is polished continuously on both sides.

In the above embodiment, the workpiece 26 is held on the lower surface plate 23, and the lower surface plate 23 is placed in the upper row to apply pressure.

After descending, the work was moved to the next stage of processing, but the work was moved to the upper surface plate 2.
The upper surface plate 21 may be moved, lowered, or pressurized while being held at 1 by vacuum suction or other means.

Further, in the embodiment, the lower surface plate 23 supports the carrier 25, but the upper surface plate 21 may support the carrier, or the carrier may be forcibly rotated from the outside at the processing location. When the carrier is forcibly rotated from the outside, the difference in the rotational speed of the upper and T measuring plates can be infinitely selected, making it possible to further improve the machining quality.

Further, in this embodiment, the workpiece has a parallel plane shape, but the workpiece may have a spherical or aspherical shape on one or both sides.

FIG. 3 shows another embodiment of the present invention, in which the abrasive tool and the workpiece are conveyed intermittently in the previous embodiment, but they are continuously conveyed one after another without stopping the conveyance. (a) is a longitudinal cross-sectional view, (b) is a cross-sectional view, and (c) is a plan view viewed from the A-A line in (a) downward.

In the figure, a plurality of upper surface plates 31 holding abrasive sheets 32 are arranged along a guide rail 37.
A workpiece 36 is supported by a carrier 35 on a lower surface plate 33 holding an abrasive sheet 34, and the delimiting surfaces 31 and 33 rotate in opposite directions. The lower surface plate 3
3 is supported so as to be guided on a guide rail 37,
A gear 33a is provided at the bottom thereof, and the gear 33a meshes with chains 38 and 38' which move along the guide rail 37 and in the same direction with a speed difference.

In this embodiment with the configuration described below, the lower surface plate 33 holding the workpiece 36 is guided by the guide rail 37, and the gear 33 is guided by the guide rail 37.
The workpiece 36 is continuously conveyed while rotating due to the speed difference between the chains 38 and 38' meshing with the upper surface plate 31, and both sides of the workpiece 36 are continuously processed while being held between the pressurized upper surface plates 31.

<Effects of the Invention> As explained above, the present invention holds a workpiece on one side of the polishing tools facing each other, continuously transports the one tool together with the workpiece, and does not use means for transporting only the workpiece. Continuous polishing has the following effects.

■ Since there is no need to perform badge processing on the workpiece, highly efficient polishing processing can be performed without manual intervention.

■ Since both sides can be polished at the same time, ridges and warpage can be easily removed, resulting in high precision and process reduction.

Processing with reduced man-hours is possible.

■ Processing machines can be manufactured easily and at low cost since there is no need for a means of transporting only the workpieces.

[Brief explanation of the drawing]

1 and 2 show an embodiment of a processing machine using the present invention, FIG. 1(a) is a side sectional view of the processing machine in adjacent positions, and FIG. 1(b) is a conveyance of a tool supporting a workpiece. state plan,
FIG. 2(a) is a cross-sectional view of the processing machine in the machining state, FIG. 2(b) is a cross-sectional view of the tool supporting the work after machining is moved, and FIG. 3 is another embodiment of the present invention. a) is a longitudinal cross-sectional view, (b)
) is a cross-sectional opening, (c) is a plan view taken from the line A-A in (a) when viewed from below, FIG. 4 is a sectional view of a conventional double-sided lapping processing machine, and FIG. 5 is a conventional FIG. 2 is a cross-sectional view of an example processing machine for through-feed processing. 21...Upper surface plate, 22.24...Abrasive sheet, 23
... lower surface plate, 25 ... carrier, 26 ... workpiece, 27 ... collet chuck, 28 ... conveyance means, 2
9... Abrasive. Figure 1 Figure 2 (a) (b) Figure 3 (c) Figure 4 Fifth cause procedural amendment dated 10/3/1985

Claims (1)

[Claims] 1. In processing using a device that processes a workpiece with abrasive tools that rotate in opposite directions and face each other, the workpiece is held on one of the abrasive tools, and the tool is placed adjacent to the workpiece. A continuous polishing method characterized by conveying the tool to the next processing machine's position and processing it one after another. 2. The continuous polishing method according to claim 1, wherein said one polishing tool is processed one after another while being continuously conveyed together with said workpiece.