JP3796717B2 - Polishing and cleaning combined device - Google Patents

Description

[0001]
[Technical field to which the invention belongs]
The present invention relates to a polishing and cleaning composite apparatus that polishes and cleans the surface of a thin disk-shaped object such as a magnetic disk substrate, a semiconductor wafer, a liquid crystal display glass substrate, and a photomask glass substrate.
[0002]
[Prior art]
Patent Document 1 discloses a polishing apparatus that holds a carrier having a hole for holding a plurality of objects to be polished between upper and lower surface plates and alternately rotates in a revolving and forward / reverse direction to polish both surfaces of the objects to be polished. Disclose.
[0003]
Patent Document 2 discloses that in a polishing apparatus, for example, a process of polishing a surface of a wafer is performed in a plurality of stages by a plurality of polishing processes such as a rough polishing process, a precise polishing process, and a finishing polishing process. It is an object to sufficiently remove slurry adhering to the wafer when the wafer is moved between them. For this reason, in the cleaning apparatus, it is disclosed that the wafer is cleaned while being held by the holding head and cleaned while being placed on the holding base, and the holding head is also cleaned alone. ing.
[0004]
[Patent Document 1]
JP 2002-254301 A [Patent Document 2]
Japanese Patent Laid-Open No. 2001-144057
[Problems to be solved by the invention]
At present, it is required to polish a large amount of a thin disk-shaped object to be processed such as a wafer. Conventionally, as disclosed in Patent Document 1, a plurality of carriers capable of receiving a plurality of objects to be processed are disclosed. A large number of objects to be processed were polished once by rotating and revolving between an upper surface plate and a lower surface plate to which slurry is supplied and having a polishing surface that rotates. In this case, when the object to be processed is taken out after completion of polishing, the polishing surface changes due to the slurry adhering to the object to be processed, so it is necessary to take out as soon as possible, and there arises a problem that the quality changes depending on the order of extraction. .
[0006]
Moreover, as disclosed in Patent Document 2, it is desirable to remove the slurry by washing for each polishing process, but this causes a problem that the process becomes complicated.
[0007]
For this reason, this invention is providing the polishing washing | cleaning composite apparatus which can grind | polish and wash | clean a to-be-processed object continuously.
[0008]
[Means for Solving the Problems]
Accordingly, the present invention provides a polishing and cleaning composite apparatus in which a polishing apparatus unit for polishing a thin disk-shaped object to be processed and a cleaning device part for cleaning the object to be processed polished by the polishing apparatus are arranged in series. The polishing apparatus section is disposed above the cylindrical polishing jig and a pair of cylindrical polishing jigs on which polishing cloths are arranged, and restricts the upper position of the target object and rotates the target object. And at least one rotating roller to be rotated, and the pair of cylindrical polishing jigs hold and fix the objects to be sequentially conveyed from the container in which the plurality of objects to be processed are held in the vertical direction. A holding means and a polishing means for rotating the object to be processed held by the holding means by the rotation roller and rotating the pair of cylindrical polishing jigs to pull up the object to be processed. Some to at least provided.
[0009]
Further, the present invention relates to a polishing and cleaning composite apparatus in which a polishing unit for polishing a thin disk-shaped target object and a cleaning unit for cleaning the target object polished by the polishing apparatus are arranged in series. The cleaning unit includes a holding unit that holds the objects to be sequentially transferred from the polishing unit, an annular transfer unit that uniformly distributes the holding unit in a circumferential shape, and the transfer unit rotates. And a pair of cleaning jigs for sandwiching the object to be processed when the object to be processed held by the holding means moves to a predetermined position, rotating the pair of cleaning jigs and the object to be processed And a cleaning means for rotating the body.
[0010]
Furthermore, the present invention is a polishing and cleaning composite apparatus in which a polishing apparatus unit for polishing a thin disk-shaped object to be processed and a cleaning device part for cleaning the object to be processed polished by the polishing apparatus are arranged in series. The polishing apparatus section is disposed above the cylindrical polishing jig and a pair of cylindrical polishing jigs on which polishing cloths are arranged, and restricts the upper position of the target object and rotates the target object. And at least one rotating roller to be rotated, and the pair of cylindrical polishing jigs hold and fix the objects to be sequentially conveyed from the container in which the plurality of objects to be processed are held in the vertical direction. A holding means; and a polishing means for rotating the object to be processed held by the holding means by the rotation roller and rotating the pair of cylindrical polishing jigs to pull up the object to be processed. The cleaning device unit includes at least a holding unit that holds the objects to be sequentially transferred from the polishing device unit, an annular transfer unit that uniformly distributes the holding unit in a circumferential shape, When the conveying means rotates and the object to be processed held by the holding means moves to a predetermined position, the conveying means includes a pair of cleaning jigs that sandwich the object to be processed. And cleaning means for rotating the object to be processed.
[0011]
Schematically, in the polishing and cleaning composite apparatus, the polishing apparatus unit sequentially vertically moves the objects to be processed, which are sequentially conveyed from a container in which a plurality of thin disk-shaped objects to be processed are accommodated, by a pair of cylindrical polishing jigs. The pair of cylindrical polishing jigs are rotated and moved so as to pull up the object to be processed while being held and fixed in a direction and rotated by a rotation roller. Thus, a pair of cleaning treatments in which the object to be processed polished by the polishing apparatus unit is sequentially held by a plurality of holding means and moved to a predetermined position so as to sandwich the object to be processed. Wash with tools.
[0012]
Further, it is desirable that the holding means of the cleaning device section includes a plurality of rotation rollers that are in contact with the periphery of the object to be processed.
[0013]
Furthermore, the pair of cylindrical polishing jigs are linearly connected to the object to be processed in parallel to the horizontal reference line at a predetermined value below a horizontal reference line passing through the center point of the object to be processed. It is desirable to contact
[0014]
In addition, the pair of cylindrical polishing jigs are inclined by a predetermined angle with respect to the horizontal reference line below the horizontal reference line passing through the center point of the object to be processed. It may be in line contact. The predetermined angle is desirably within a range of 5 to 40 °, and particularly desirably within a range of 10 to 20 °.
[0015]
At least one of the rotation rollers constituting the polishing apparatus unit moves (reciprocates) the object to be processed so that the center of the object passes through a contact area of the cylindrical polishing jig, or an ellipse. It is desirable to make a swivel motion. As a result, when the object to be processed is a thin disk and does not have an opening at the center, uniform polishing can be achieved as a whole.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0017]
The polishing / cleaning composite apparatus 1 according to the embodiment of the present invention includes at least a polishing apparatus unit 2 and a cleaning apparatus unit 3.
[0018]
For example, a thin disk-shaped object 5 such as a magnetic disk substrate, a semiconductor wafer, a liquid crystal display glass substrate, or a photomask glass substrate mounted on the container 4 is gripped by a grip 6a of a lift mechanism 6. The container 4 is lifted upward. When the carrier 7 moves and the primary holder 7 a of the carrier 7 reaches the lower position, the grip 6 a is lowered and the object 5 is placed on the primary holder 7 a of the carrier 7.
[0019]
When the workpiece 5 is placed on the primary holder 7a, the carrier 7 moves laterally to a location where the primary holder 7a is located below the polishing mechanism 20, and then moves upward. The polishing mechanism 20 holds the workpiece 5 that has moved upward.
[0020]
As shown in FIGS. 2A and 2B, the polishing mechanism 20 includes a pair of rotation rollers 21 that limit the upper position of the object 5 and rotate the object 5; The workpiece 5 is sandwiched and held, and at least includes a pair of cylindrical polishing jigs 22 that rotate in a direction in which the workpiece 5 is urged upward. The cylindrical polishing jig 22 has a cylindrical shape, and a polishing cloth is attached to the outer peripheral side surface thereof. Further, the cylindrical polishing jig 22 has a linear contact position (S) that is lower than the center reference line M passing through the center point of the object 5 by a predetermined value D. Contact on both sides. Accordingly, the holding force of the object to be processed 5 can be improved and the polishing state of the object to be processed 5 can be improved as compared with the case where the linear contact position (S) is the same as the center reference line M. It can be further improved.
[0021]
With the above-described configuration, the cylindrical polishing jig 22 rotates in the direction in which the object to be processed 5 is clamped on the reference line S and urges the object to be processed 5 upward, and the rotation roller 21 is rotated. However, by rotating the object 5 to be processed, both surfaces of the object 5 can be polished. In this polishing step, slurry having predetermined characteristics is supplied to the polishing cloth attached to the side surface of the cylindrical polishing jig 22.
[0022]
When the polishing process is completed, the carrier 7 moves in the left direction of the drawing, and the primary holder 7a places a new object 5 to be processed. At the same time, the secondary holder 7b of the carrier 7 is polished from the polishing mechanism 20. 5 is received, and the carrier 7 moves to the right in the drawing. Then, the polished object 5 is transported from the secondary holder 7 b of the carrier 7 to the cleaning device unit 3 by the grip 8 a of the transport mechanism 8.
[0023]
The cleaning device section 3 includes an annular transport mechanism 10 having a plurality of holding mechanisms 30 arranged at predetermined intervals on the periphery, and at least one provided at a predetermined position of the annular transport mechanism 10 (this embodiment In the embodiment, two cleaning mechanisms 40 are provided. In addition, the annular transport mechanism 10 is configured in a substantially ferris wheel shape, and the object to be processed 5 gripped by the holding mechanism 30 is rotated every predetermined angle (45 ° in this embodiment). It is moved, transported to the cleaning mechanism 40, cleaned, and then sequentially moved to the transport mechanism 9 while being dried.
[0024]
The holding mechanism 30 of the cleaning device unit 3 includes three holding rollers 31 that hold the object 5 to be processed at at least three points. In this case, the holding force of the workpiece 5 can be improved by applying a rotational force so that the holding rollers 31 located on both sides are biased toward the holding roller 31 located in the middle.
[0025]
As shown in FIGS. 3A and 3B, the cleaning mechanism 40 drives a pair of cleaning jigs 41 that rotate while sandwiching the object to be processed 5 and the holding roller 31 to drive the object to be processed. It is comprised by the autorotation mechanism in which the process body 5 rotates. In the cleaning process using the cleaning jig 41, cleaning water is supplied to remove particles such as slurry adhering to the object 5 to be processed. In this embodiment, the mechanism for positively driving the holding roller 31 is used. However, by making the holding roller 31 rotatable, the cleaning jig 41 is rotated. The to-be-processed object 5 can perform a rotation motion.
[0026]
Then, the polished and cleaned object 5 that has been transported to a predetermined position by rotating the annular transport mechanism 10 is unloaded from the holding mechanism 30 by the grip 9 a of the transport mechanism 9 and stored in the container 4. Is done.
[0027]
As described above, in the polishing / cleaning composite apparatus 1 according to the present invention, the object 5 stored in the container 4 can be continuously polished, cleaned, and stored in the container 4, so that a certain quality is maintained. It is possible to improve productivity.
[0028]
The polishing mechanism 20 according to another embodiment shown in FIG. 4 has a predetermined angle (with respect to the above-described linear contact position S with respect to the linear contact position S ′ of the pair of cylindrical polishing jigs 22. α) It is characterized by being inclined.
[0029]
For example, as shown in FIG. 5, in the above embodiment, the contact point between the roller 21 for rotation and the object to be processed 5 and the contact line between the cylindrical polishing jig 22 and the object to be processed 5 are connected. In this embodiment, the intersection point Ps is located on the vertical line ML passing through the rotation center Rs of the object 5 to be processed. In this embodiment, the contact point between the rotation roller 21 and the object 5 and the cylindrical polishing treatment The intersection point Ps ′ when the contact line between the tool 22 and the object to be processed 5 is connected exists at a position shifted from the vertical line ML passing through the rotation center Rs of the object to be processed 5. Further, a triangle formed by connecting a contact point between one rotation roller 21 and the object to be processed 5 and a contact line between the cylindrical polishing jig 22 and the object to be processed 5 is connected to the other rotation roller 21. The contact point with the workpiece 5 and the triangle formed by connecting the contact line between the cylindrical polishing jig 22 and the workpiece 5 are not similar.
[0030]
Due to the above factors, the shake of the workpiece 5 can be prevented, so that the polishing accuracy can be further improved and the polishing performance can be stabilized as compared with the first embodiment described above. The angle α is preferably in the range of 5 to 40 °, and more preferably in the range of 10 to 20 °.
[0031]
Further, in the polishing mechanism 20 according to the third embodiment shown in FIGS. 6A and 6B, a part of the polishing mechanism 20 according to the first embodiment and the second embodiment is configured. At least one (one in this embodiment) rotating roller 21 is moved up and down (FIG. 6 (a)) or arcuately (FIG. 6 (b)) to move the object 5 to be processed. It moves (reciprocates) in an arc shape around the other rotation roller 21 and passes through the polishing region of a pair of cylindrical polishing jigs 22 that linearly contact the center of the object 5 to be processed. Thereby, for example, even when the object 5 is of a type that does not have an opening at the center, good polishing performance can be maintained.
[0032]
Further, in the polishing mechanism 20 according to the fourth embodiment shown in FIGS. 7A and 7B, a part of the polishing mechanism 20 according to the first embodiment and the second embodiment is configured. The rotating roller 21 is rotated in an elliptical manner, the processed object 5 is moved in an elliptical rotation, and the polishing area of a pair of cylindrical polishing jigs 22 that linearly contact the center of the processed object 5 is passed. is there. As a result, as in the third embodiment described above, good polishing performance can be maintained even when the object 5 is of a type that does not have an opening at the center. Further, the operation of the rotation roller 21 is not particularly limited as long as the center of the workpiece 5 moves through the polishing region of the cylindrical polishing jig 22.
[0033]
Further, the rotating roller 21 is moved downward so as to push down the workpiece 5 against the rotational force of the cylindrical polishing jig 22, and is moved so as to instantaneously return to the fixed position. Also, the center of the workpiece 5 can be passed through the polishing region of the cylindrical polishing jig 22. At this time, the object to be processed 5 instantaneously moves laterally, but this lateral movement of the object to be processed 5 can improve the polishing state near the center of the object to be processed 5.
[0034]
【The invention's effect】
As described above, according to the present invention, the polishing device unit and the cleaning device unit are continuously arranged, and the polishing process and the cleaning process are sequentially performed. It is possible to improve the quality and productivity of the processed body.
[0035]
Further, in the cleaning process, the front and back surfaces of the object to be polished are not held, but the periphery of the object to be processed is held with dots, so that the quality can be improved. is there.
[0036]
Further, in the polishing process, the object to be processed and the cylindrical polishing jig are in point contact, and continuous linear defects are prevented.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a polishing and cleaning composite apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic configuration diagram of a polishing mechanism according to a first embodiment, (a) is a schematic front view thereof, and (b) is a schematic side view thereof.
FIG. 3 is a schematic configuration diagram of a cleaning mechanism, (a) is a schematic front view thereof, and (b) is a schematic sectional view thereof.
FIG. 4 is a schematic front view of a polishing mechanism according to a second embodiment.
FIG. 5 is an explanatory diagram showing an operation state of a polishing mechanism according to a second embodiment.
6A and 6B show a polishing mechanism according to a third embodiment, where FIG. 6A shows a case where the rotation roller of the polishing mechanism according to the first embodiment is moved up and down, and FIG. The case where the rotation roller of the polishing mechanism according to the second embodiment is rotated with the other rotation roller as a fulcrum is shown.
7A and 7B show a polishing mechanism according to a fourth embodiment. FIG. 7A shows an elliptical swiveling motion of an object to be processed by causing the roller for rotation of the polishing mechanism according to the first embodiment to swivel. (B) shows the case where the roller for rotation of the polishing mechanism according to the second embodiment is caused to make an elliptical swiveling motion to cause the object to be processed to make an elliptical swiveling motion.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Polishing cleaning composite apparatus 2 Polishing apparatus part 3 Cleaning apparatus part 4 Container 5 To-be-processed object 10 Annular conveyance mechanism 20 Polishing mechanism 21 Rolling roller 22 Cylindrical polishing jig 30 Holding mechanism 31 Holding roller 40 Cleaning mechanism 41 Cleaning jig

Claims (5)

A polishing and cleaning composite apparatus in which a polishing apparatus unit for polishing a thin disk-shaped object to be processed and a cleaning device part for cleaning the object to be processed polished by the polishing apparatus are arranged in series ,
Rotating the polishing apparatus unit includes a pair of cylindrical polishing jig polishing cloth was arranged, is arranged above the said cylindrical polishing jig, the workpiece as well as limiting the upper position of the object to be processed in at least one abrasive cleaning composite apparatus that will be at least composed of a-rotating roller which,
The polishing apparatus unit linearly contacts the pair of cylindrical polishing jigs with the object to be processed at a predetermined value lower than a horizontal reference line passing through a center point of the object to be processed. The processing object is supported and fixed in a vertical direction and is rotated so as to lift the object to be processed, and at the same time, the object to be processed is polished by rotating the object to be processed by the rotation roller. Polishing and cleaning composite device. The cleaning unit includes a holding unit that holds the objects to be sequentially transferred from the polishing unit, an annular transfer unit that uniformly distributes the holding unit in a circumferential shape, and the transfer unit rotates. And a pair of cleaning jigs for sandwiching the object to be processed when the object to be processed held by the holding means moves to a predetermined position, rotating the pair of cleaning jigs and the object to be processed The polishing / cleaning composite apparatus according to claim 1 , further comprising cleaning means for rotating the body. 3. The polishing and cleaning composite apparatus according to claim 1, wherein the pair of cylindrical polishing jigs linearly contacts the object to be processed in parallel to the horizontal reference line. 3. The polishing and cleaning composite apparatus according to claim 1, wherein the pair of cylindrical jigs are linearly in contact with the object to be processed while being inclined at a predetermined angle with respect to the horizontal reference line. Rotating rollers constituting the polishing apparatus unit, the so that the center of the object crosses the line contact position of said cylindrical polishing jig, claim and performs elliptical linear motion 1-4 The polishing / cleaning composite apparatus according to any one of the above.

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