JP2004174679A - Polishing and washing composite device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing and washing composite device which continuously polishes and washes processing bodies. <P>SOLUTION: A polishing device part 2 in this polishing and washing composite device holds and fixes the plurality of thin plate disc-shaped processing bodies 5 successively carried from a container 4 storing the processing bodies 5 in the vertical direction by a pair of cylindrical polishing tool 22, and performs polishing by making the pair of cylindrical polishing tools 22 perform rotary motions to pull up the processing bodies, while being rotated by a roller 21 for rotation. A washing device part 3 in the polishing and washing composite device successively holds the processing bodies 5 polished by the polishing device part 2 by a plurality of holding means 30 arranged in a circumferential shape in an annular carrying mechanism 10, moves the processing bodies 5 to prescribed positions, and successively washes the processing bodies 5 by a pair of washing tools 41 holding the processing bodies 5. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a combined polishing and cleaning apparatus for polishing and cleaning the surface of a thin disk-shaped object to be processed such as a magnetic disk substrate, a semiconductor wafer, a liquid crystal display glass substrate, and a photomask glass substrate.
[0002]
[Prior art]
Patent Literature 1 discloses a polishing apparatus that holds a carrier having holes for holding a plurality of objects to be polished between upper and lower platens and alternately rotates in revolving and forward and reverse directions to polish both surfaces of the plurality of objects to be polished. Disclose.
[0003]
Patent Document 2 discloses that in a polishing apparatus, for example, a step of polishing a surface of a wafer is performed in a plurality of polishing steps such as a rough polishing step, a precise polishing step, and a finishing polishing step in a plurality of steps. It is an object of the present invention to sufficiently remove slurry attached to a wafer when the wafer is moved between the wafers. For this reason, in the cleaning apparatus, it is disclosed that the wafer is cleaned while being held by the holding head and cleaning while being mounted on the holding pedestal, and the holding head is also independently cleaned. ing.
[0004]
[Patent Document 1]
JP 2002-254301 A [Patent Document 2]
JP 2001-144057 A
[Problems to be solved by the invention]
At present, it is required to polish a large amount of a thin disk-shaped workpiece such as a wafer, and conventionally, as disclosed in Patent Document 1, a plurality of carriers capable of receiving a plurality of workpieces. Has a polishing surface that rotates, and is rotated and revolved between an upper surface plate and a lower surface plate to which the slurry is supplied, thereby polishing a large number of workpieces at one time. In this case, when the object to be processed is taken out after the polishing is completed, the polishing surface changes due to the slurry attached to the object to be processed. Therefore, it is necessary to take out the object as soon as possible, and there is a problem that the quality changes depending on the order of taking out. .
[0006]
Further, as disclosed in Patent Document 2, it is desirable to remove the slurry by washing for each polishing step, but there is a disadvantage that the process becomes complicated.
[0007]
Therefore, an object of the present invention is to provide a combined polishing and cleaning apparatus capable of continuously polishing and cleaning an object to be processed.
[0008]
[Means for Solving the Problems]
Therefore, the present invention provides a polishing and cleaning combined apparatus in which a polishing apparatus section for polishing a thin disk-shaped object to be processed and a cleaning apparatus section for cleaning the object to be processed polished by the polishing apparatus are arranged in series. The polishing device section includes a pair of cylindrical polishing jigs on which a polishing cloth is disposed, and is disposed above the cylindrical polishing jig to restrict an upper position of the target object and rotate the target object. At least one rotating roller to be rotated, and the pair of cylindrical polishing jigs vertically clamps and fixes the workpieces sequentially conveyed from a container in which a plurality of workpieces are accommodated. Holding means, and polishing means for rotating the object to be processed held by the holding means by the rotation roller and rotating the pair of cylindrical polishing jigs so as to pull up the object to be processed. Some to at least provided.
[0009]
Further, the present invention provides a polishing and cleaning combined apparatus in which a polishing apparatus section for polishing a thin disk-shaped object to be processed and a cleaning apparatus section for cleaning the object polished by the polishing apparatus are arranged in series. The cleaning unit includes a holding unit that holds the workpieces sequentially transferred from the polishing unit, an annular transfer unit that evenly distributes the holding units in a circumferential shape, and the transfer unit rotates. A pair of cleaning jigs for holding the object to be processed when the object held by the holding means is moved to a predetermined position, rotating the pair of cleaning jigs, and Cleaning means for rotating the body.
[0010]
Further, the present invention provides a polishing and cleaning combined apparatus in which a polishing apparatus section for polishing a thin disk-shaped object to be processed and a cleaning apparatus section for cleaning the object polished by the polishing apparatus are arranged in series. The polishing device section includes a pair of cylindrical polishing jigs on which a polishing cloth is disposed, and is disposed above the cylindrical polishing jig to restrict an upper position of the target object and rotate the target object. At least one rotating roller to be rotated, and the pair of cylindrical polishing jigs vertically clamps and fixes the workpieces sequentially conveyed from a container in which a plurality of workpieces are accommodated. Holding means and polishing means for rotating the object to be processed held by the holding means by the rotation roller and rotating the pair of cylindrical polishing jigs so as to pull up the object to be processed. And a cleaning unit, a holding unit that holds the workpieces sequentially transferred from the polishing unit, an annular transfer unit that evenly distributes the holding unit in a circumferential shape, A pair of cleaning jigs for holding the object to be processed is provided when the object to be processed held by the holding means is moved to a predetermined position when the transfer means rotates, and the pair of cleaning jigs is rotated. Cleaning means for moving the object and rotating the object to be processed.
[0011]
Schematically, in the combined polishing and cleaning apparatus, the polishing apparatus section vertically moves the objects to be conveyed sequentially from a container containing a plurality of thin disk-shaped objects by a pair of cylindrical polishing jigs. The pair of cylindrical polishing jigs are rotated so as to pull up the object to be processed and polished while being pinched and fixed in the direction and rotated by a rotation roller. Then, the object to be polished by the polishing device is held by a plurality of holding means sequentially arranged in a circle, moved to a predetermined position, and a pair of cleaning jigs for clamping the object to be processed are held. Wash with utensil.
[0012]
Further, it is preferable that the holding means of the cleaning device section includes a plurality of rotation rollers which are in contact with a peripheral edge of the object to be processed.
[0013]
Furthermore, the pair of cylindrical polishing jigs are linearly parallel to the horizontal reference line at a predetermined value lower than a horizontal reference line passing through a center point of the target object. It is desirable to contact
[0014]
Further, the pair of cylindrical polishing jigs are inclined at a predetermined angle with respect to the horizontal reference line below the horizontal reference line passing through a center point of the object to be processed, and are disposed on the object to be processed. It may be one that makes linear contact. The predetermined angle is desirably in the range of 5 to 40 °, particularly desirably in the range of 10 to 20 °.
[0015]
At least one of the rotation rollers constituting the polishing apparatus moves (reciprocates) or moves the workpiece so that the center of the workpiece passes through the contact area of the cylindrical polishing jig. It is desirable to make a turning movement. Thereby, when the object to be processed is a thin disk and has no opening in the center, uniform polishing can be performed as a whole.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0017]
The combined polishing and cleaning apparatus 1 according to the embodiment of the present invention includes at least a polishing apparatus section 2 and a cleaning apparatus section 3.
[0018]
A thin disk-shaped workpiece 5 such as a magnetic disk substrate, a semiconductor wafer, a liquid crystal display glass substrate, or a photomask glass substrate mounted on the container 4 is gripped by the grip 6a of the lift mechanism 6, The container 4 is lifted upward. Then, when the carrier 7 moves and the primary holder 7a of the carrier 7 reaches the lower position, the grip 6a descends and the workpiece 5 is placed on the primary holder 7a of the carrier 7.
[0019]
When the object 5 is placed on the primary holder 7a, the carrier 7 moves laterally to a position where the primary holder 7a is located below the polishing mechanism 20, and then moves upward. The polishing mechanism 20 holds the workpiece 5 that has moved upward.
[0020]
As shown in FIGS. 2A and 2B, the polishing mechanism 20 restricts a position above the workpiece 5 and rotates a pair of rotation rollers 21 for rotating the workpiece 5; It is at least constituted by a pair of cylindrical polishing jigs 22 that hold and hold the object 5 and rotate in a direction to urge the object 5 upward. The cylindrical polishing jig 22 has a cylindrical shape, and a polishing cloth is mounted on an outer peripheral side surface thereof. In addition, the cylindrical polishing jig 22 moves the workpiece 5 at a linear contact position (S) below the center reference line M passing through the center point of the workpiece 5 by a predetermined value D. Contact on both sides. This makes it possible to improve the holding force of the target object 5 and improve the polishing state of the target object 5 as compared with the case where the linear contact position (S) is the same as the center reference line M. It can be further improved.
[0021]
With the above-described configuration, the cylindrical polishing jig 22 rotates in the direction of holding the processing target 5 at the reference line S and urging the processing target 5 upward, and rotating the rotation roller 21. By rotating the object 5, both surfaces of the object 5 can be polished. In this polishing step, a slurry having predetermined characteristics is supplied to the polishing cloth mounted on the side surface of the cylindrical polishing jig 22.
[0022]
When the polishing process is completed, the carrier 7 moves to the left in the drawing, and the primary holder 7a mounts a new workpiece 5, and at the same time, the secondary holder 7b of the carrier 7 is polished from the polishing mechanism 20 to the workpiece. 5, the carrier 7 moves rightward in the drawing. Then, the polished workpiece 5 is transported from the secondary holder 7b of the carrier 7 to the cleaning unit 3 by the grip 8a of the transport mechanism 8.
[0023]
The cleaning device unit 3 includes an annular transport mechanism 10 having a plurality of holding mechanisms 30 arranged at predetermined intervals on a peripheral edge, and at least one provided at a predetermined position of the annular transport mechanism 10 (this embodiment). In the embodiment, two) cleaning mechanisms 40 are provided. The annular transport mechanism 10 is configured in a substantially ferris wheel shape, and rotates the workpiece 5 gripped by the holding mechanism 30 every predetermined angle (45 ° in this embodiment). Then, after being moved to the cleaning mechanism 40 and washed, it is sequentially moved to the transport mechanism 9 while being dried.
[0024]
The holding mechanism 30 of the cleaning unit 3 includes three holding rollers 31 that hold the object 5 at at least three points. In this case, the holding force of the workpiece 5 can be improved by applying a rotational force so as to urge the holding rollers 31 located on both sides toward the holding roller 31 located in the middle.
[0025]
As shown in FIGS. 3A and 3B, the cleaning mechanism 40 drives a pair of cleaning jigs 41 that sandwich the workpiece 5 and rotate, and the holding roller 31 to drive the workpiece. A rotation mechanism for rotating the processing body 5 is configured. In the cleaning process using the cleaning jig 41, cleaning water is supplied to remove particles such as slurry adhered to the object 5 to be processed. In this embodiment, the mechanism for positively driving the holding roller 31 is used. However, the holding roller 31 is configured to be rotatable, so that the cleaning jig 41 rotates. The object to be processed 5 can rotate.
[0026]
The polished and washed workpiece 5 transported to a predetermined position by rotating the annular transport mechanism 10 is carried out of the holding mechanism 30 by the grip 9 a of the transport mechanism 9 and stored in the container 4. Is done.
[0027]
As described above, in the polishing and washing combined apparatus 1 of the present invention, the object 5 stored in the container 4 can be continuously polished, washed, and stored in the container 4, so that a certain quality is maintained. It is possible to improve productivity.
[0028]
A polishing mechanism 20 according to another embodiment shown in FIG. 4 is configured such that a linear contact position S ′ of a pair of cylindrical polishing jigs 22 is at a predetermined angle ( α) characterized by being inclined.
[0029]
For example, as shown in FIG. 5, in the above embodiment, the contact point between the rotation roller 21 and the object 5 and the contact line between the cylindrical polishing jig 22 and the object 5 are connected. In this case, the intersection point Ps is located on the vertical line ML passing through the rotation center Rs of the workpiece 5, but in this embodiment, the contact point between the rotation roller 21 and the workpiece 5 and the cylindrical polishing The intersection Ps ′ when the tool 22 and the contact line between the workpiece 5 are connected is located at a position shifted from the vertical line ML passing through the rotation center Rs of the workpiece 5. In addition, a triangle formed by connecting a contact point between one rotation roller 21 and the workpiece 5 and a contact line between the cylindrical polishing jig 22 and the workpiece 5 forms a triangle with the other rotation roller 21. It has a non-similar shape to a triangle formed by connecting the contact point with the workpiece 5 and the contact line between the cylindrical polishing jig 22 and the workpiece 5.
[0030]
Due to the above factors, the movement of the object 5 can be prevented, so that the polishing accuracy can be further improved and the polishing performance can be stabilized more than in the first embodiment. The angle α is preferably in the range of 5 to 40 °, and more preferably in the range of 10 to 20 °.
[0031]
The polishing mechanism 20 according to the third embodiment shown in FIGS. 6A and 6B constitutes a part of the polishing mechanism 20 according to the first and second embodiments. At least one (in this embodiment, one) rotation roller 21 is moved up and down (FIG. 6 (a)) or in an arc shape (FIG. 6 (b)) to move the object 5 to be processed. The workpiece is moved (reciprocated) in an arc with the other rotation roller 21 as a center, and passes through a polishing area of a pair of cylindrical polishing jigs 22 that linearly contact the center of the workpiece 5. Thereby, for example, even when the object 5 is a type having no opening in the center, good polishing performance can be maintained.
[0032]
Further, the polishing mechanism 20 according to the fourth embodiment shown in FIGS. 7A and 7B constitutes a part of the polishing mechanism 20 according to the first and second embodiments. The object to be processed 5 is caused to rotate in an elliptical manner by rotating the rotation roller 21 for elliptical rotation, and passes through the polishing area of a pair of cylindrical polishing jigs 22 that linearly contact the center of the object to be processed 5. is there. As a result, as in the third embodiment described above, good polishing performance can be maintained even when the processing target 5 is of a type having no opening at the center. The operation of the rotation roller 21 is not particularly limited as long as the center of the processing object 5 moves so as to pass through the polishing area of the cylindrical polishing jig 22.
[0033]
Further, the rotation roller 21 is moved downward so as to push down the workpiece 5 downward against the rotational force of the cylindrical polishing jig 22, and is moved so as to return to the home position instantaneously. This also allows the center of the workpiece 5 to pass through the polishing area of the cylindrical polishing jig 22. At this time, the workpiece 5 moves instantaneously in the lateral direction, and the lateral movement of the workpiece 5 can improve the polishing state near the center of the workpiece 5.
[0034]
【The invention's effect】
As described above, according to the present invention, the polishing device and the cleaning device are arranged continuously, and the polishing process and the cleaning process are sequentially performed sequentially. It is possible to improve the quality and productivity of the treated body.
[0035]
Further, in the cleaning step, instead of holding the front and back surfaces of the object to be polished, instead of holding the peripheral edge of the object at points, the quality can be improved. is there.
[0036]
Further, in the polishing step, the object to be processed and the cylindrical polishing jig come into point contact with each other, thereby preventing continuous linear defects.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a combined polishing and cleaning apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic configuration diagram of a polishing mechanism according to a first embodiment, (a) is a schematic front view thereof, and (b) is a schematic side view thereof.
FIG. 3 is a schematic configuration diagram of a cleaning mechanism, (a) is a schematic front view thereof, and (b) is a schematic cross-sectional view thereof.
FIG. 4 is a schematic front view of a polishing mechanism according to a second embodiment.
FIG. 5 is an explanatory diagram showing an operation state of a polishing mechanism according to a second embodiment.
6A and 6B show a polishing mechanism according to a third embodiment, in which FIG. 6A shows a case in which a rotation roller of the polishing mechanism according to the first embodiment is moved up and down, and FIG. This shows a case where the rotation roller of the polishing mechanism according to the second embodiment is rotated around the other rotation roller as a fulcrum.
7A and 7B show a polishing mechanism according to a fourth embodiment, and FIG. 7A shows an elliptical turning motion of a rotation roller of the polishing mechanism according to the first embodiment to move an object to be processed in an elliptical turning motion. (B) shows a case in which the rotation roller of the polishing mechanism according to the second embodiment is caused to perform an elliptical turning motion to cause an object to be processed to perform an elliptical turning motion.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Polishing / cleaning combined apparatus 2 Polishing unit 3 Cleaning unit 4 Container 5 Object to be processed 10 Annular transport mechanism 20 Polishing mechanism 21 Roller for rotation 22 Cylindrical polishing jig 30 Holding mechanism 31 Holding roller 40 Cleaning mechanism 41 Cleaning jig

Claims (9)

In a polishing and cleaning combined apparatus in which a polishing apparatus section for polishing a thin disk-shaped object to be processed and a cleaning apparatus section for cleaning the object to be polished by the polishing apparatus are arranged in series,
The polishing device section includes a pair of cylindrical polishing jigs on which a polishing cloth is disposed, and is disposed above the cylindrical polishing jig to restrict an upper position of the target object and rotate the target object. At least one rotating roller to be rotated, and the pair of cylindrical polishing jigs vertically clamps and fixes the workpieces sequentially conveyed from a container in which a plurality of workpieces are accommodated. Holding means, and at least polishing means for rotating the object to be processed held by the holding means by the rotation roller and rotating the pair of cylindrical polishing jigs so as to pull up the object to be processed. A combined polishing and cleaning apparatus, comprising: In a polishing and cleaning combined apparatus in which a polishing apparatus section for polishing a thin disk-shaped object to be processed and a cleaning apparatus section for cleaning the object to be polished by the polishing apparatus are arranged in series,
The cleaning unit includes a holding unit that holds the workpieces sequentially transferred from the polishing unit, an annular transfer unit that evenly distributes the holding units in a circumferential shape, and the transfer unit rotates. A pair of cleaning jigs for holding the object to be processed when the object held by the holding means is moved to a predetermined position, rotating the pair of cleaning jigs, and A polishing and washing combined apparatus comprising: a washing means for rotating a body. In a polishing and cleaning combined apparatus in which a polishing apparatus section for polishing a thin disk-shaped object to be processed and a cleaning apparatus section for cleaning the object to be polished by the polishing apparatus are arranged in series,
The polishing device section includes a pair of cylindrical polishing jigs on which a polishing cloth is disposed, and is disposed above the cylindrical polishing jig to restrict an upper position of the target object and rotate the target object. At least one rotating roller to be rotated, and the pair of cylindrical polishing jigs vertically clamps and fixes the workpieces sequentially conveyed from a container in which a plurality of workpieces are accommodated. Holding means, and at least polishing means for rotating the object to be processed held by the holding means by the rotation roller and rotating the pair of cylindrical polishing jigs so as to pull up the object to be processed. Have it,
The cleaning unit includes a holding unit that holds the workpieces sequentially transferred from the polishing unit, an annular transfer unit that evenly distributes the holding units in a circumferential shape, and the transfer unit rotates. A pair of cleaning jigs for holding the object to be processed when the object held by the holding means is moved to a predetermined position, rotating the pair of cleaning jigs, and A polishing and washing combined apparatus comprising: a washing means for rotating a body. The polishing / cleaning combined apparatus according to claim 2 or 3, wherein the holding means of the cleaning unit comprises a plurality of rotation rollers in contact with a peripheral edge of the object to be processed. The pair of cylindrical polishing jigs linearly contact the workpiece parallel to the horizontal reference line at a predetermined value lower than a horizontal reference line passing through a center point of the workpiece. The combined polishing and cleaning apparatus according to claim 1 or 3, wherein: The pair of cylindrical polishing jigs are inclined by a predetermined angle with respect to the horizontal reference line at a predetermined value lower than a horizontal reference line passing through a center point of the processing object, and are linearly aligned with the processing object. The polishing and washing combined apparatus according to claim 1 or 3, wherein the combined apparatus is in contact with. At least one of the rotation rollers constituting the polishing device moves the workpiece so that the center of the workpiece passes through a contact area of the cylindrical polishing jig. Item 7. The combined polishing and cleaning apparatus according to any one of Items 1 to 3 to 7. At least one of the rotation rollers constituting the polishing device moves the workpiece so that a center of the workpiece crosses a contact area of the cylindrical polishing jig. The combined polishing and cleaning apparatus according to any one of 1 to 3 to 7. The rotation roller constituting the polishing device portion performs an elliptical turning motion such that a center of the object to be processed crosses a contact region of the cylindrical polishing jig. The polishing and washing combined apparatus according to any one of the above.

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