JPS6125972Y2 - - Google Patents

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Publication number
JPS6125972Y2
JPS6125972Y2 JP6945984U JP6945984U JPS6125972Y2 JP S6125972 Y2 JPS6125972 Y2 JP S6125972Y2 JP 6945984 U JP6945984 U JP 6945984U JP 6945984 U JP6945984 U JP 6945984U JP S6125972 Y2 JPS6125972 Y2 JP S6125972Y2
Authority
JP
Japan
Prior art keywords
disk
polishing
polishing machine
conveyor
groove wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6945984U
Other languages
Japanese (ja)
Other versions
JPS60183147U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6945984U priority Critical patent/JPS60183147U/en
Publication of JPS60183147U publication Critical patent/JPS60183147U/en
Application granted granted Critical
Publication of JPS6125972Y2 publication Critical patent/JPS6125972Y2/ja
Granted legal-status Critical Current

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  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Description

【考案の詳細な説明】 産業上の利用分野: 本考案は、供給されたデイスク素材を、複数個
の懸架フツクにより各処理段階に応じた加工個所
に給送・適用し、所望の仕上げとなしつつ次段階
の工程へ送り出せるようにした研磨装置に係るも
のである。
[Detailed description of the invention] Industrial application field: This invention feeds and applies the supplied disk material to the processing location according to each processing stage using a plurality of hanging hooks, and achieves the desired finish. This relates to a polishing device that can be sent to the next stage of the process.

考案の背景: 電子機器類の関連要素を記録するのに用いるデ
イスクのように滑沢面を有するデイスクは、たと
えば円板形のアルミニウム素材より所要段階の研
磨を経て平滑な面に仕上げられており、研磨は相
対向する回転砥石の間に被研磨材たるデイスクを
挾み、押圧力を付加しつつ両砥石を回転させるよ
うにされている。同時にデイスクは両回転砥石と
の摩擦力により回転砥石と同じ向きに回動し、デ
イスク表裏の全面域にわたつて研磨が円滑に行わ
れるのである。従つて、デイスクは常に同一平面
内にあつて回動することが好ましいことはいうま
でもなく、このようなデイスクを未研磨状態より
平滑な仕上げ面に研磨する両面研磨装置は、回転
砥石部におけるデイスク保持機構が該部に送込ま
れるデイスクを確実に受取つてデイスクが回転砥
石の研磨面に密接した状態で回動自在に保持でき
ると共に、デイスクの材質と形状とに相応した付
加力を用いるのみで上記の状態が得られるように
回転砥石部へ給送でき、円滑に研磨されそして仕
上り面が損なわれることなく送りだされる搬送手
段が講ぜられるものでなければならない。
Background of the invention: A disk with a smooth surface, such as a disk used to record related elements of electronic equipment, is made of, for example, a disc-shaped aluminum material that has been polished to a smooth surface through the required stages. In the polishing process, a disc, which is a workpiece to be polished, is sandwiched between opposing rotating grindstones, and both grindstones are rotated while applying a pressing force. At the same time, the disk rotates in the same direction as the rotating grindstone due to the frictional force between the two rotating grindstones, and polishing is performed smoothly over the entire surface area of the front and back of the disk. Therefore, it goes without saying that it is preferable for the disk to always rotate within the same plane, and a double-sided polishing device that polishes such a disk to a smoother finished surface than the unpolished state requires The disk holding mechanism can reliably receive the disk sent into the part and rotatably hold the disk in close contact with the polishing surface of the rotary grindstone, and only uses an additional force that is appropriate to the material and shape of the disk. A conveying means must be provided that can feed the workpiece to the rotary grindstone so that the above-mentioned conditions can be obtained, the workpiece can be polished smoothly, and the workpiece can be sent out without damaging the finished surface.

考案の目的: 本考案は斯かる現況に鑑がみ、円板形のアルミ
ニウム素材より得られるデイスクが、その状態に
応じた研磨が施される研磨段階を複数有してお
り、これらの研磨段階へのデイスクの給送・取出
しを、デイスクの形状を損うことなく可能とした
搬送手段を伴つた研磨装置を提案せんとしてなさ
れたもので、デイスクに対する削圧研磨から滑沢
面仕上げに至るまでの両面研磨機構部を並列し、
これらに沿つて、デイスク面には一切接触するこ
となくしかも安定な状態で各段階の研磨機構に給
送し、そして以後の処理段階へ送り出すことがで
きる搬送手段を併せ有するデイスク両面研磨装置
の提供を目的としている。
Purpose of the invention: In view of the current situation, the present invention has multiple polishing stages in which a disc made of a disc-shaped aluminum material is polished according to its condition. This was developed with the aim of proposing a polishing device with a conveyance means that would allow disks to be fed and removed without damaging the shape of the disk, from pressure polishing to smooth surface finishing. The double-sided polishing mechanism parts are arranged in parallel,
In line with these, we provide a disk double-sided polishing device that also has a conveyance means that can feed the disk surface to the polishing mechanism at each stage in a stable state without contacting it at all, and then send it to the subsequent processing stage. It is an object.

考案の構成・実施例: 以下、本考案の1実施例を図面に基づき説明す
る。
Structure/Example of the invention: Hereinafter, one embodiment of the invention will be described based on the drawings.

第1図又は第2図に示すように構体壁1の1部
を切欠いて、この部分に研磨機2を設置する。本
考案装置に用いる研磨機2は、研磨面が互に対面
するような2個の回転砥石3,3を有し、両回転
砥石3,3間に被研磨デイスクを挾持し同じ向き
に回転するようにしたものであり、これら回転砥
石3,3の軸心が上記構体壁1面に直交するよう
になつている。この実施例では研磨機を2台設置
した場合で、未研磨のデイスク9が供給される前
位の研磨機2′では相対向する2つの回転砥石の
各研磨面を含む平面が常に平行であつて、デイス
ク9に対する削正研磨処理に適しており、その後
位の研磨機2では相対向する2つの回転砥石のう
ち、一の回転砥石の研磨面を含む平面が軸心に絶
えず直交しているが、他の回転砥石の研磨面は軸
心に対して揺動し、デイスク面への追随性を向上
させることにより滑沢な仕上り面が得易いように
設定する。
As shown in FIG. 1 or 2, a part of the structure wall 1 is cut out and a polishing machine 2 is installed in this part. The polishing machine 2 used in the device of the present invention has two rotating grindstones 3, 3 whose polishing surfaces face each other, and a disk to be polished is held between both the rotating grindstones 3, 3 and rotated in the same direction. The axes of these rotary grindstones 3, 3 are perpendicular to the surface of the structure wall 1. In this embodiment, two polishing machines are installed, and in the front polishing machine 2' to which the unpolished disk 9 is supplied, the planes containing the respective polishing surfaces of the two opposing rotating grindstones are always parallel. Therefore, it is suitable for cutting and polishing the disk 9, and in the polishing machine 2 located after it, the plane containing the polishing surface of one of the two rotating grindstones facing each other is always perpendicular to the axis. However, the polishing surfaces of the other rotary grindstones are set so as to be able to swing with respect to the axis to improve the ability to follow the disk surface, thereby making it easier to obtain a smooth finished surface.

各研磨機2又は2′の上方の構体壁1には、そ
れぞれ固定ブラケツト11を固着し、その先端に
は、軸心が上記回転砥石3の軸心と平行となるよ
うに固定溝車セツター12を付設する。また、流
体圧シリンダー及びスライダー等を含む昇降機構
15により作動する昇降ブラケツト13を、上記
固定ブラケツト11の両側に位置するように配設
し、これらの昇降ブラケツト13,13の先端に
は固定溝車セツター12の軸心と平行な軸心を有
する昇降溝車セツター14,14をそれぞれ付設
してデイスク保持部となすのである。
A fixed bracket 11 is fixed to the structure wall 1 above each polishing machine 2 or 2', and a fixed groove wheel setter 12 is attached to the tip of the bracket so that its axis is parallel to the axis of the rotary grindstone 3. Attached. Further, lifting brackets 13 operated by a lifting mechanism 15 including a hydraulic cylinder, a slider, etc. are arranged to be located on both sides of the fixed bracket 11, and fixed groove wheels are installed at the tips of these lifting brackets 13, 13. Elevating groove wheel setters 14, 14 each having an axis parallel to the axis of the setter 12 are attached to form a disk holding section.

さらに、固定ブラケツト11の構体壁1への取
付部の上下方に、構体壁1面に沿つて水平な搬送
レール22を架設し、この搬送レール22に案内
されて転動する従動コロ21をもつ搬送フツク2
0を複数個装架する。搬送レール22は並列する
水平部とその両端にあるターンホイールとからな
つており、総延長は各研磨機の回転砥石の軸心間
の距離の整数倍となし、この回転砥石の軸心間の
距離に等しい間隔で搬送フツク20を装架してチ
エン等で連結し、この間隔を1ピツチとして搬送
フツク20,20が移行するように駆動部(図示
省略)を設けたもので、デイスク研磨部、デイス
ク保持部、デイスク搬送部を要部として本考案の
両面研磨装置10が形成される。なお、搬送レー
ル22の搬送始端部下方には未研磨のデイスク9
を搬送フツク20に懸架するための昇降自在なデ
イスクローダ23を、同じく搬送終端部下方には
搬送フツク20からデイスク9を解説させ、同時
に洗浄又は表面保護等の次段工程に移行させるた
めの昇降自在な受支部24を併せ設置してある。
Furthermore, a horizontal conveyor rail 22 is installed above and below the attachment portion of the fixed bracket 11 to the structure wall 1 along the surface of the structure wall 1, and has driven rollers 21 that roll while being guided by the conveyor rail 22. Transport hook 2
Mount multiple 0s. The conveyor rail 22 consists of parallel horizontal parts and turn wheels at both ends, and the total length is an integral multiple of the distance between the axes of the rotary grinding wheels of each polishing machine. The conveyor hooks 20 are mounted at intervals equal to the distance and connected by a chain, etc., and a drive unit (not shown) is provided so that the conveyor hooks 20, 20 move with this interval as one pitch. The double-sided polishing apparatus 10 of the present invention is formed by using the main parts as , a disk holding section, and a disk transport section. Note that an unpolished disk 9 is located below the transport start end of the transport rail 22.
A disk loader 23 that can be raised and lowered to suspend the disks on the transport hook 20 is also installed below the end of the transport to move the discs 9 from the transport hook 20, and at the same time there is a disc loader 23 that can be raised and lowered to move the disc 9 from the transport hook 20 to the next step such as cleaning or surface protection. A flexible receiving section 24 is also installed.

考案の作用・効果: このような構成の両面研磨装置10の実際使用
時には、デイスクローダ23の進退及び昇降によ
り、未研磨のデイスク9を搬送フツク20にて懸
吊し、搬送レール22に案内される搬送フツク2
0の横動によつてデイスク9は前位の研磨機2′
に達する。ここで研磨機2′に対応する昇降ブラ
ケツト13が上昇するにつれ、2個の昇降溝車セ
ツター14がデイスク外周に接し、環状溝に周縁
部を嵌入させて上昇を続けると、デイスク内周縁
と搬送フツクとは離れ、ついで外周縁上端が固定
溝車セツター12の環状溝に嵌入した状態とな
り、2つの昇降溝車セツターと1つの固定溝車セ
ツターとにより回動自在に3点支持され、研磨機
2′の回転砥石3,3の研磨面に安定に挾持され
円滑に研磨される。この段階での研磨は、相対向
する各研磨砥石の研磨面を含む各平面が平行する
ように行れるので、デイスクの全面域にわたつて
均一の厚さに削正するのに貢献している。この段
階での研削・研磨が終ると回転砥石はデイスクか
ら離反・停止し、昇降ブラケツトを降下させると
デイスクは両昇降溝車セツターに預托されて降下
し、デイスク内周縁が搬送フツク20に当接する
と共に両昇降溝車セツターは降下し続けてデイス
クと離れ、デイスク9は搬送フツク20に再び懸
吊される。
Functions and effects of the invention: When the double-side polishing apparatus 10 having such a configuration is actually used, the unpolished disk 9 is suspended by the transport hook 20 and guided by the transport rail 22 by moving the disc loader 23 back and forth and moving up and down. transport hook 2
Due to the lateral movement of 0, the disk 9 moves to the front polishing machine 2'.
reach. As the elevating bracket 13 corresponding to the polishing machine 2' rises, the two elevating groove wheel setters 14 come into contact with the outer periphery of the disk, and when the periphery fits into the annular groove and continues to rise, the inner periphery of the disk and the conveyor It separates from the hook, and then the upper end of the outer periphery fits into the annular groove of the fixed groove wheel setter 12, and is rotatably supported at three points by two elevating groove wheel setters and one fixed groove wheel setter, and the polishing machine It is stably held between the polishing surfaces of the rotary grindstones 3, 2' and polished smoothly. Polishing at this stage can be performed so that the planes including the polishing surfaces of the opposing polishing wheels are parallel to each other, which contributes to polishing to a uniform thickness over the entire surface area of the disk. . When the grinding and polishing at this stage is completed, the rotary whetstone separates from the disk and stops, and when the elevating bracket is lowered, the disk is held by both elevating groove wheel setters and descends, and the inner peripheral edge of the disk touches the conveyor hook 20. As soon as they come into contact, both elevating groove pulley setters continue to descend and separate from the disk, and the disk 9 is suspended from the transport hook 20 again.

次に、搬送フツク20は後位の研磨機2の直上
に到達停止する。このときには、デイスローダー
23から後発のデイスクが後続の搬送フツク20
に懸吊され、前位の研磨機2′の直上に到達して
いる。後位の研磨機2の直上に達した先発のデイ
スク並びに前位の研磨機2′の直上に達した後発
のデイスクは、それぞれ同じ操作により同じよう
に挙動し、所要の研磨が施される。
Next, the transport hook 20 reaches and stops directly above the rear polishing machine 2. At this time, the subsequent disk from the disk loader 23 is transferred to the subsequent transport hook 20.
The machine is suspended from the machine and reaches directly above the polishing machine 2' in the front position. The first disc that has reached the position directly above the rear polishing machine 2 and the subsequent disc that has reached the position immediately above the front polishing machine 2' behave in the same manner by the same operation, and are polished as desired.

なお、後位の研磨機2は、相対向する回転砥石
3を前位のもののようにせず、片側の回転砥石の
研磨面を含む平面が軸心に対して揺動自在とする
ことによりデイスク面に対する追随性を向上させ
てあり、デイスク表裏面に精緻な研磨を行い、滑
沢な平面に仕上げることができるのである。
Note that the rear polishing machine 2 does not have the facing rotary whetstone 3 like the front one, but the plane containing the polishing surface of one of the rotary whetstones is swingable about the axis, so that the disc surface This improves the ability to follow the surface of the disk, and the front and back surfaces of the disk can be precisely polished to create a smooth, flat surface.

後位の研磨機2で精緻な仕上げ研磨をされたデ
イスクは上記と同様に搬送フツクに移行し、搬送
フツクの横動により受支部24直上に到達し、該
部においてたとえば洗浄等の処理を受た後、以後
の工程に送り出される。
The disk that has been finely polished by the rear polishing machine 2 is transferred to the transport hook in the same way as described above, and by the lateral movement of the transport hook, it reaches directly above the receiving part 24, where it is subjected to processing such as cleaning. After that, it is sent to the subsequent process.

そして、受支部24の進退・昇降により、デイ
スクを御した搬送フツクは、ターンホイールを旋
回し搬送レール22の上段を経て始端に回帰する
のであり、デイスクローダ、前位の研磨機、後位
の研磨機、受支部の各中心間距離並びにターンホ
イールの巻回長さはすべて同一に設定されている
ために、各段を通じて多数のデイスクが整然と移
動しつつ一連の研磨処理を受け、円板形の素材よ
り所定の表面状態となつたデイスクが連続的に得
られる。
Then, as the receiving part 24 advances and retreats and rises and falls, the transport hook that controls the disc turns the turn wheel and returns to the starting end via the upper stage of the transport rail 22, and the disc loader, the front polishing machine, and the rear Since the distance between the centers of the polishing machine and the receiving part as well as the winding length of the turnwheel are all set to be the same, a large number of discs move in an orderly manner through each stage and undergo a series of polishing processes, resulting in a disc shape. Discs with a predetermined surface condition can be continuously obtained from this material.

以上の説明にみるごとく、本考案のデイスク両
面研磨装置は均質な表面処理が連続して効率よく
行えるのであつて、産業上の利用性は著大であ
る。
As can be seen from the above explanation, the disk double-side polishing apparatus of the present invention can perform homogeneous surface treatment continuously and efficiently, and has great industrial applicability.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の1実施例の正面図、第2図は
第1図の−視側面図である。 1……構体壁、2,2′……研磨機、3……回
転砥石、9……デイスク、10……両面研磨装
置、11……固定ブラケツト、12……固定溝車
セツター、13……昇降ブラケツト、14……昇
降溝車セツター、15……昇降機構、20……搬
送フツク、21……従動コロ、22……搬送レー
ル、23……デイスクローダー、24……受支
部。
FIG. 1 is a front view of one embodiment of the present invention, and FIG. 2 is a side view of FIG. 1... Structure wall, 2, 2'... Polishing machine, 3... Rotating grindstone, 9... Disk, 10... Double side polishing device, 11... Fixed bracket, 12... Fixed groove wheel setter, 13... Elevating bracket, 14... Elevating groove wheel setter, 15... Elevating mechanism, 20... Conveying hook, 21... Driven roller, 22... Conveying rail, 23... Disc loader, 24... Receiving section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 構体壁を切欠いた部分に、研磨面が相対向する
2個の回転砥石を備えた研磨機を複数台設置し、
各研磨機の上方の構体壁にはそれぞれ固定溝車セ
ツターを付着した固定ブラケツトを固着し、固定
溝車セツターの下方の対称位置には昇降自在な昇
降ブラケツトに付着した昇降溝車セツターを設
け、さらに各研磨機の上方には構体壁面に沿つて
エンドレス状の搬送レールを水平に架設し、この
搬送レールに案内されて横動する搬送フツクを複
数附装架し、上記搬送レールの始端部下方にはデ
イスクローダーを、又終端部下方には受支部をそ
れぞれ設け、デイスクローダー、各研磨機及び受
支部の各中心間距離をそれぞれ等しくすると共に
複数の搬送フツクの間隔もこれと等しい長さとし
た構造であつて、デイスクローダーから搬送され
るデイスクが各研磨機で順次研磨仕上げされて受
支部に到る構成としたことを特徴とするデイスク
両面研磨装置。
A plurality of polishing machines equipped with two rotating grindstones with polishing surfaces facing each other are installed in the cutout of the structure wall.
A fixed bracket with a fixed groove wheel setter attached thereto is fixed to the upper structure wall of each polishing machine, and an elevating groove wheel setter attached to a lifting bracket that can be raised and lowered is provided at a symmetrical position below the fixed groove wheel setter. Furthermore, an endless conveyor rail is installed horizontally above each polishing machine along the structure wall surface, and a plurality of conveyor hooks that move laterally while being guided by the conveyor rail are attached to the bottom of the starting end of the conveyor rail. A disk loader was installed at the bottom, and a receiving section was installed below the end, and the distances between the centers of the disk loader, each polishing machine, and the receiving section were made equal, and the intervals between the plurality of conveyor hooks were also made to have the same length. 1. A disk double-sided polishing apparatus characterized in that a disk transported from a disk loader is sequentially polished by each polishing machine and reaches a receiving part.
JP6945984U 1984-05-11 1984-05-11 Disc double-sided polishing device Granted JPS60183147U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6945984U JPS60183147U (en) 1984-05-11 1984-05-11 Disc double-sided polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6945984U JPS60183147U (en) 1984-05-11 1984-05-11 Disc double-sided polishing device

Publications (2)

Publication Number Publication Date
JPS60183147U JPS60183147U (en) 1985-12-05
JPS6125972Y2 true JPS6125972Y2 (en) 1986-08-05

Family

ID=30605152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6945984U Granted JPS60183147U (en) 1984-05-11 1984-05-11 Disc double-sided polishing device

Country Status (1)

Country Link
JP (1) JPS60183147U (en)

Also Published As

Publication number Publication date
JPS60183147U (en) 1985-12-05

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