JPH0287523A - Method and equipment for bevelling semiconductor wafer notch - Google Patents

Abstract

PURPOSE:To obtain a semiconductor wafer wherein cutouts do not generate in a notch part formed on the external periphery by bevelling the upper and the lower peripheries of the notch part formed on a part of the external periphery of a semiconductor wafer. CONSTITUTION:When either one of a whetstone 89 and a wafer W is moved, bevelling surfaces W1, W2 of a wafer notch part Wa are turned into concaved surfaces whose curvatures are equal to that of the external periphery of the whetstone 89. When the wafer W is moved together with whetstone 89, the bevelling surfaces W1, W2 of the water notch part Wa can be made a flat surface. The semiconductor wafer W, whose notch part Wa is bevelled, is subjected to bevelling of the upper and the lower peripheral edges of the external periphery by an external periphery abrasion part. The semiconductor wafer, whose notch part is subjected to bevelling process in addition to the external peripheral edge, does not generated cutouts even when the notch part Wa is engaged with a positioning pin in the course of device manufacturing process of the like.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a semiconductor wafer having a notch formed on its outer periphery chamfered, and a method and a chamfering apparatus for chamfering the notch of the semiconductor wafer.

(Prior Art) Semiconductor wafers used as substrates for semiconductor electronic devices are produced by slicing a single crystal ingot of silicon or the like at approximately right angles to the rod axis direction, and then slicing the resulting thin disk-shaped wafer. It can be obtained by further processing such as lapping, etching, polishing, etc., but usually an orientation flat is formed on a part of the outer periphery to indicate the direction of crystallinity or to position an optical pattern. be done. This orientation flat is formed by cutting out part of the outer periphery of the semiconductor wafer in a straight line, so this cut out part cannot be used as a semiconductor device.
This results in a reduction in the effective number of chips produced on the wafer.

Therefore, as another method, a method has been proposed in which a small notch is formed in a part of the outer periphery of a semiconductor wafer and this notch is used as a reference for positioning an optical pattern, etc. (for example, Japanese Patent Laid-Open No. 62-239517 (see publication).

By the way, silicon, which is the material of conductor wafers,
GG, lithium tantalate, etc. are extremely hard and brittle, and
Since it is a single crystal, it is prone to cracking in specific crystal axis directions. or,
In recent years, automation has advanced in the wafer manufacturing process and device manufacturing process, and wafers are transported on the line many times during these processes. This causes deterioration of device characteristics and yield reduction in the same way as chipped silicon powder, dirt, and dust. For this reason, chamfering has conventionally been applied to the outer peripheral edge of a semiconductor wafer, including the orientation flat.

(Problem to be solved by the invention) However, in the semiconductor wafer according to the above proposal, that is, the semiconductor wafer having a notch formed on its outer periphery, the notch is not chamfered at all. When this notch portion is engaged with a positioning pin in a device manufacturing process or the like, chipping occurs in the notch portion, resulting in the above-mentioned problem.

The present invention has been made in view of the above-mentioned problems, and its object is to provide a semiconductor wafer in which no cracks or the like occur in the notch portion formed on the outer periphery.

Another object of the present invention is to provide a notch chamfering method and an apparatus therefor that can efficiently chamfer a notch formed on a semiconductor wafer at once.

(Means for Solving the Problems) In order to achieve the above object, the present invention is characterized in that the upper and lower peripheral edges of a notch portion formed in a part of the outer peripheral portion of a semiconductor wafer are chamfered.

The present invention also provides a grinding wheel having a protrusion having a cross-sectional shape corresponding to the shape of the notch on the center line of a notch formed on the outer periphery of a semiconductor wafer. While aligning the center lines of the directions, the center of rotation of the grindstone is positioned above or below the horizontal plane of the semiconductor wafer, and without rotating the grindstone, at least one of the grindstone or the semiconductor wafer is moved to rotate the grindstone. The notch part of the semiconductor wafer is brought into contact with the notch part, and the -
It is characterized in that the lower peripheral edge is chamfered.

Furthermore, the present invention provides a positioning means for positioning a notch formed on the outer periphery of a semiconductor wafer in a predetermined direction, a transport means for transporting the positioned semiconductor wafer to a processing position, and a transport means for transporting the positioned semiconductor wafer to a processing position. A moving means for holding and moving a semiconductor wafer, a grinding wheel provided with a convex portion having a cross-sectional shape corresponding to the shape of a notch portion of the semiconductor wafer, a driving means for rotationally driving the grinding wheel, and a grinding wheel or The notch chamfering apparatus is characterized in that it includes a moving means for moving at least one of the semiconductor wafers.

(Function) After the notch of the semiconductor wafer is positioned in a predetermined direction by the positioning means, if the semiconductor wafer is transported to the processing position by the transport means, the top of the protrusion of the grinding wheel will be placed on the center line of the notch of the semiconductor wafer. The center line passing through or coincides with. Then, the semiconductor wafer is held and moved by the moving means so that the center of rotation of the grindstone is positioned above the horizontal plane of the semiconductor wafer, and while the grindstone is rotated by the drive means, the grindstone or the wafer is moved by the moving means. When the grinding wheel is moved, the protrusion of the grindstone comes into contact with the notch of the wafer, and the upper peripheral edge of the notch is chamfered. On the other hand, if the center of rotation of the grindstone is positioned below the horizontal plane of the wafer and the same operation as described above is repeated, the lower peripheral edge of the notch portion will be chamfered. In this case, since the cross-sectional shape of the convex part of the grinding wheel corresponds to the shape of the notch part of the wafer, the convex part of the whetstone comes into contact with the upper and lower peripheral edges of the notch part, and the chamfering of the notch part can be efficiently done all at once. .

Note that if either the semiconductor wafer or the grinding wheel is kept stationary as described above and the other is moved, the chamfered surface of the wafer notch becomes a concave curved surface with a curvature equal to the curvature of the outer periphery of the grinding wheel, or the wafer and the grinding wheel are separated. If they are moved in the same plane, the chamfered surface of the waver notch can be made flat.

Therefore, in semiconductor wafers whose notches are also chamfered, no chips occur even when the notches are engaged with positioning pins during positioning, and the above-mentioned problem caused by chipping is solved. It will be resolved in

(Example) Embodiments of the present invention will be described below based on the accompanying drawings.

FIG. 1 is a plan view showing the overall configuration of a notch chamfering device according to the present invention, and the neck chamfering device includes a wafer loader part A, a thickness measuring part B, an input conveyor part C, a handsong arm part D, and a wafer alignment part. It consists of a section E, a grinding rope ink section F, a work table section G, a notch grinding section H, and an outer periphery grinding section I, or the wafer alignment section E, which constitutes the main parts of the neck removal device, and the grinding loading section. The details of the configurations of section F, work table section G, and notch grinding section H will be explained.

First, the configuration of the wafer alignment section E will be explained based on FIGS. 2 and 3. Fig. 2 is a plan view of the wafer alignment section E, and Fig. 3 is a side view of the same.
is attached to the top of the. 2 from the top of base 2
Wooden guide bars 3, 3 extend horizontally, into which a slider member 4 is inserted and held so as to be horizontally movable, and at the tip of the slider member 4 is a recess 5a. A sensor holding member 5 having a diameter is attached to the sensor holding member 5. Three elements (not shown) constituting a photoelectric sensor are arranged in the width direction and buried in the upper and lower parts of the recess 5a of the sensor holding member 5, and optical fibers 9... , 10... are derived.

Further, a bearing member 11 and a nut member 12 are connected to the slider member 4, and a base 2 is connected to the nut member 12.
A screw shaft 14 extending from a motor 13 attached to
The end of the screw shaft 14 is rotatably supported by the bearing member 11.

On the other hand, an alignment mechanism 20 is provided in the vicinity of the notch detection unit 1 described in -h, and the alignment mechanism 20 has alignment members 21 and 21 that move toward and away from each other by the same amount by a driving means (not shown) . Each alignment member 21 has an extension line thereof or a slope 21a that intersects each other at right angles,
21a on its inside, and its slopes 21a, 21
A plurality of rotatable rubber rollers 22 are provided near a.
They are attached so as to protrude somewhat from the slopes 21a, 21a.

Next, details of the grinding rope ink section F will be explained based on FIGS. 4 to 6. 4 is a plan view of the grinding loading portion F, FIG. 5 is a cross-sectional view taken along the line VV in FIG. 4, and FIG. 6 is a cross-sectional view taken along the line Vl-vryJ in FIG. 4.

In the figure, reference numerals 30 and 30 indicate two mutually parallel rails laid toward the work table G (see FIG. A screw shaft 34 rotated by a motor 33 is threaded into a nut member 32 attached to the lower part of the conveying member 31 . Furthermore, this screw @
34 is disposed parallel to these in the middle of the rails 30.30, and one end thereof is connected to the output shaft 33a of the motor 33 via a coupling 35, which is connected via bearings 36, 36.37. It is rotatably supported by bearing members 38 and 39. Further, a disk-shaped work holding member 40 is held at the tip of the conveying member 31 so as to be horizontally rotatable via a bear link 41, and the upper surface of the work holding member 40 is provided with large and small circular grooves 40a, Four radial grooves 40c are formed to communicate the inner circular grooves 40b and the inner circular grooves 40a and 40b. And the circular groove 40
a, 40b and the radial grooves 40c... are communicated with a vacuum source (not shown).

Note that a pulley 45 is connected to the lower surface of the workpiece holding member 40.

Further, a protrusion 40e that integrally projects from the tip of the workpiece holding member 40 has three circular holes 46a.

46b, 46c are drilled, one circular hole 46
A positioning pin 47 is inserted and held in a.

On the other hand, a motor 48 is vertically fixed at the rear of the workpiece holding member 40, and the output of the motor 48 is
A belt 50 is wound around between the pulley 49 connected to a and the pulley 45 connected to the workpiece holding member 40. Incidentally, on the upper surface of the conveying member 31, linear grooves 40f, 40f are formed through which the belt 50 passes.

Next, the configuration of the workpiece holding/moving means provided on the workpiece platform G will be explained based on the side sectional view of FIG. 7.

That is, in FIG. 7, reference numerals 51 and 52 denote flange-shaped chuck jigs for holding the workpiece, and these chuck jigs 51 and 52 are respectively connected to the lower end of the shaft 53 and the upper end of the shaft 54. Grooves 51a and 52a for vacuum suction of the workpiece are formed on each opposing surface, and these grooves 51a and 52a are connected to air holes (not shown) through ventilation holes 55.56 formed in @53.54, respectively. It is connected to a vacuum source.

The shaft 53 is slidably inserted through the guide member 58 via bearings 57, 57, and its upper portion is rotatably held by the cylindrical member 60 via bear links 59, 59. The upper end of this shaft 53 is connected to an output shaft 61a of an encoder 61 housed within the cylindrical member 60.

Also, a nut member 63 fitted into the center of the flange member 62 fixed to the upper part of the cylindrical member 60 has a screw! !
+64 screw is inserted. This screw shaft 64 is rotatably supported by a support member 66 via bearings 65, 65, and its upper end is cupped to an output shaft 68a extending vertically downward of a motor 68 fixed to a frame 67. They are connected via a ring 69.

On the other hand, since the structure around the lower part of the shaft 54 is the same as that of the shaft 53, illustration and explanation thereof will be omitted, or since the means for vertically moving the shaft 54 is different, the structure of the moving means will be explained based on the drawings. I will explain. That is, 7 in FIG.
0 is a cylinder member that moves together with the shaft 54. A piston member 71 is fitted into the cylinder member 70 so as to be slidable up and down, and pins 72 and 72 project from the piston member 71 to the left and right. pass through oval guide grooves 70a, 70a formed in the cylinder member 70. A coil spring 74.74 is interposed between the pin 72.72 and a bolt member 73.73 screwed onto the lower end flange portion of the cylinder member 70.

Further, a rod 75a of an air cylinder 75 is fixedly attached to the piston member 71 below.

Finally, the details of the notch grinding portion H are shown in FIGS. 8 to 10.
This will be explained based on the diagram. 8 is a plan view of the notch grinding portion H, FIG. 9 is a view in the X direction of the arrow in FIG. 8, and FIG. 1O is a view in the Y direction of the arrow in FIG.

As shown in the figure, there are two wooden rails 81 on the fixed base 80.
．． 81 are laid parallel to each other.

A movable base 82 is movably mounted on these rails 81,81. A motor 83 and a grindstone head 84 are fixedly mounted on the movable base 82.
A pulley 85 and a grindstone head 8 connected to an output shaft 83a of No. 3
A belt 87 is wound around a pulley 86 connected to the input shaft 84a of No. 4. Further, a substantially cylindrical whetstone 89 is attached to the end of the spindle 88 which is the output shaft of the whetstone head 84.
or installed. Furthermore, an arm 90 extends parallel to the spindle 88 from the grinding wheel head 84, and a stopper 9 is fixed to the tip of the arm 90.

On the other hand, an air cylinder 92 is fixed between the rails 81.81 on the fixed base 80 in parallel to these rails 81.81, and the tip of the rod 92a of the air cylinder 92 The bracket 93 is connected to the bracket 93 .

The above is the configuration of the main part of the notch chamfering device.The semiconductor wafer W to be processed in this notch chamfering device is formed into a thin disk shape as shown in the plan view of No. A V-shaped notch portion Wa is formed in the portion.

The details of the notch portion Wa are shown in the enlarged view of FIG. 12, or in this embodiment, the notch angle O1 of the notch portion Wa is
is 0. =90', notch R dimension R, = 1.1mm
is set to . In addition, as shown in the figure, the grindstone 89
A mountain-shaped convex portion 89a having a V-shaped cross section corresponding to the shape of the notch portion Wa is integrally formed in the center portion over the entire circumference, and in this embodiment, the diameter d of the convex portion 89a is
is d=20mm, apex angle θ2 is θ2=140' radius of curvature R
2 is set to R2=1.1 mm. Note that this whetstone 89 is a diamond whetstone made of a sintered body of diamond.

Next, a notch chamfering process performed on a semiconductor wafer W using the notch chamfering apparatus and notch chamfering method according to the present invention will be described. In the notch removal apparatus shown in FIG. 1, semiconductor wafers W having a notch Wa formed on the outer periphery as shown in FIG. The material is transported to section B, where the thickness is measured using an instrument such as a contact thickness measuring device, and if the measured value is within the tolerance range,
It is conveyed to the entrance conveyor section C on the line, and if the measured value deviates from the allowable range, it is discharged to the side and removed from the line.

The wafer W that has reached the artificial conveyor section C is further transported and is waiting at the position a in the figure, where it is sucked and held by the handling arm 100 that constitutes the handling arm section and transported to the wafer alignment section E position. positioning is done here. That is, handling arm 1
The wafer W held at 00 is held by the workpiece holding member 40 of the grinding loading section F, which is located between the two open alignment members 21 and 21 as shown by the chain line in FIG.
placed on top. Next, as the alignment member 21.21 approaches the wafer W, a total of four
The rubber rollers 22 contact the outer periphery of the wafer W to center the wafer W. The 6 wafers W placed on the workpiece holding member 404 are placed in circular grooves 40a and 40b formed on one surface of the workpiece holding member 40.
and the radial grooves 40c... (see FIG. 4), and are suction-held onto the workpiece holding member 40 by vacuuming.

Then, the motor 13 of the punch detection section 1 shown in FIGS. 2 and 3 is driven, and the screw shaft 14 is rotated.
As a result, the slider member 4, which the nut member 2 is threadedly inserted into the screw shaft 14, moves toward the wafer W side, and as shown in the figure, the slider member 4 is inserted into the recess of the sensor retaining member 5 attached to the tip of the slider member 4. A part of the outer periphery of the wafer W enters into the wafer 5a.

In this state, the motor 48 of the grinding loading section F shown in FIGS. The wafer W held by suction is rotated. A notch W formed on the outer periphery of the wafer W by rotation of the wafer W.
When the notch Wa reaches the recess 5a of the sensor holding member 5, the notch Wa is detected by the upper and lower photoelectric sensors (in this embodiment, a pair of upper and lower photoelectric sensors located in the middle).

When the notch Wa is detected in this way, one wafer W is rotated approximately 906 degrees from that point so that the notch Wa is directed toward the engagement pin 47 (in the direction of the work table G).

As described above, when the notch Wa is detected and its direction is determined, the suction holding of the wafer W on the work holding member 40 is released and the first alignment member 21 is moved again.
．． 21 approaches the wafer W, and as shown by solid lines in FIGS. 1 and 2, a total of four rubber rollers 22 provided on the alignment member 21. Centering of the wafer W is performed based on the notch reference. When this centering is completed, the notch portion Wa of the wafer W engages with the positioning pin 47, and then the wafer W is held by suction on the workpiece holding member 40 again.

Next, the motor 33 shown in FIGS. 4 and 5 is driven and the screw shaft 34 is rotated, whereby the transport member 31 is sent in the direction of the work table G, and the wafer W is also sent in the same direction. It is placed between both chuck jigs 51 and 52 which are in the open state shown in FIG. Then, the motor 68 shown in FIG. 7 is driven and the screw shaft 64 is rotated, whereby the cylindrical member 60 and the shaft 53 are moved downward together, and the chuck jig 51 tied to the lower end of the shaft 53 is moved downward. The wafer W is vacuum-adsorbed by being in close contact with the upper surface of the wafer W. Thereafter, the suction holding of the wafer W on the work holding member 40 is released, the wafer W is suction held on the lower surface of the chuck jig 51, and the motor 68 is driven again to hold the screw shaft 6.
4 is reversed, the chuck jig 51 is moved upward, and when this upward movement is completed, the motor 33 shown in FIGS. 4 and 5 is driven again to reverse the screw shaft 34,
Transfer member 3 that transferred the wafer W to the chuck jig 5
1 or be forced to evacuate.

When the chuck jig 51 moves downward again, the air cylinder turf 5 shown in FIG. The chuck jig 52, which is tied to the upper end of the shaft 54, comes into close contact with the lower end of the wafer W. After the chuck jig 52 has come into close contact with the wafer W, when the piston member 71 is further moved upward a little, the chuck jig 52 receives the spring force of the coil springs 74 and 74 and presses the wafer W with a predetermined pressure. However, the wafer W is thus held between both chuck jigs 51 and 52.

As described above, when the setting of the wafer W on the work table G is completed, the motor 83 of the notch grinding section H shown in FIG. 8 is driven, and the air cylinder 92 is also driven. When the motor 83 is driven, its rotational power is transmitted to the spindle 88 via the pulley 85, belt 87, pulley 86, and input shaft 84a, thereby rotating the spindle 88 and the grindstone 89 attached thereto. Also, when the air cylinder 92 is driven and extends forward, the movable base 82
or move on the rail 81.81 in the direction of the arrow in Figure 8,
As a result, the rotating whetstone 89 approaches the wafer W side and comes into contact with the notch W a C''!3 of the wafer W to chamfer the notch Wa. Chuck jig 5 for stopper 91 shown in the figure
It is regulated by contact with 1. In this case, as shown in FIG.
The center line in the width direction passing through the top of the grinding wheel 9a coincides with the center line in the width direction, and as shown in FIG.
The wafer W is positioned above the horizontal plane of the wafer W. In this embodiment, as shown in FIG. 13, the center O of the grinding wheel 89 is y, =
r / r 2 = 7,07 mm (here r is the radius of the grinding wheel), and the angle α and distance 51 x 1 shown in the figure are α1 = 45°, XI = 7, respectively.
．． 07mm (=V+).

Since the cross-sectional shape of the convex portion 89a of the grindstone 89 corresponds to the shape of the notch portion Wa of the wafer W as described above, the convex portion 89a of the whetstone 89 is uniformly formed on the upper periphery of the notch portion Wa. As a result, as shown in FIG. 15, the upper peripheral edge of the notch portion Wa of the wafer W is efficiently chamfered at once.

In FIG. 15, the chamfered surface is indicated by W, or the width b1 of the chamfered surface W1 in this embodiment is b + = 20.
0 to 400 gm.

On the other hand, as shown in FIG. 14, if the rotation center 0 of the grindstone 89 is positioned below the horizontal plane of the wafer W and the same operation as described above is repeated, the lower peripheral edge of the notch portion Wa of the wafer W will be chamfered. . In this case, in the positional relationship of the center 0 of the grindstone 89, X2 + 3'2 + shown in Fig. 14
(E2 is x2=y2=7.07mm, α,=
It is set to 45'. In addition, in FIG. 15, the chamfered surface is indicated by W2, or in this embodiment, the width b2 of this chamfered surface W2 is the same as the width b1 of the chamfered surface WI on the upper periphery. be done.

However, in the embodiments described above, the required chamfering process is performed by keeping the wafer W, which is the workpiece, stationary and moving the grindstone 89 relative to the wafer W while rotating, or by moving the grindstone 89 relative to the wafer W while rotating the grindstone 89. Chamfering can be similarly performed by keeping the wafer W stationary and moving the wafer W relative to the grindstone 89. or,
The above has referred to the chamfering process for a V-shaped notch, but the same can be said for a notch having a semicircular or other arbitrary shape, if the cross-sectional shape of the convex part of the grindstone corresponds to the shape of the notch. It is possible to perform chamfering on the surface.

As mentioned above, grindstone 89. If only one of the wafers W is moved, the chamfered surfaces W, W2 of the wafer notch Wa will become a concave curved surface with a curvature equal to the curvature of the outer periphery of the grindstone 89, or the wafer W and the grindstone 89 will be moved together. By doing this, the chamfered surface W of the wafer notch Wa
, , W2 can be a plane. Further, by setting the relative movement between the wafer W and the grindstone 89 at an appropriate speed, a chamfered surface of any angle can be obtained, and by making each movement at an inconstant speed, a convex chamfering is also possible. Compositionally, the 8th I2
This problem can be solved by using a motor instead of the air cylinder 92 shown in Figures 11 and fJIJlo, and controlling the movement of the movable base 82 by turning the screw shaft with the motor.

Then, the semiconductor wafer W, which has been chamfered at the notch portion Wa, has its upper and lower outer periphery edges chamfered and polished by the outer periphery grinding section 2 shown in FIG.

In this way, the semiconductor wafer W, in which the notch Wa in addition to the outer periphery is chamfered, will not be chipped even when the notch Wa is engaged with a positioning pin in a device manufacturing process, etc., and will not be chipped. This effectively eliminates various problems that occur due to chips, such as silicon powder having an adverse effect on devices and crown development occurring when an epitaxial layer is grown on the wafer W.

(Effects of the Invention) As is clear from the above description, according to the present invention, it is possible to obtain a semiconductor wafer without any defects in the notch portion formed on the outer periphery.

Furthermore, according to the present invention, it is possible to efficiently chamfer the notches formed on the conductor wafer at one time.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing the overall configuration of the notch removal device according to the present invention, FIG. 2 is a top view of the wafer alignment section,
Fig. 3 is a side view of the same side, Fig. 4 is a plan view of the grinding rope ink section, Fig. 5 is a sectional view taken along the VV line in Fig. 4, and Fig. 6 is a sectional view taken along the VT-Vl line in Fig. 4. Fig. 7 is a side sectional view of the workpiece table, FIG. 8 is a plan view of the notch grinding section, and FIG. 9 is a view taken in the direction of arrow X in FIG.
10 is a view in the direction of the arrow Y in FIG. 8, FIG. 11 is a plan view of the semiconductor wafer, FIG. 12 is an enlarged plan view showing the relationship between the wafer notch and the grindstone, and FIGS. 1
FIG. 4 is a cutaway side view showing the positional relationship between the center of rotation of the grindstone and the semiconductor wafer W, and FIG. 15 is a perspective view of the chamfered wafer notch. E: Wafer alignment section, F: Grinding load ink section, G: Work table section, H: Notch grinding section, W: Semiconductor wafer, Wa: Notch section, Wl
. W2...notch part chamfered surface, l...notch detection part 2
0... Alignment mechanism, 51.52... Chuck jig, 68... Motor (moving means), 83... Motor (driving means), 89... Grinding stone, 89a... Convex of grinding wheel Section 92... Air cylinder (transportation means). Patent Applicant Shin-Etsu Semiconductor Co., Ltd. Agent Patent Attorney Ryo Yamashita (December 20, 1988) 6. “Brief explanation of drawings” column of the specification to be amended ゛”\ ’it1

Claims (4)

[Claims] (1) A semiconductor wafer which has a notch part on a part of its outer periphery, and the upper and lower peripheral edges of the notch part are chamfered. (2) A grinding wheel in which a convex portion having a cross-sectional shape corresponding to the shape of the notch portion is provided on the center line of a notch portion formed on the outer periphery of a semiconductor wafer, the width direction of the whetstone passing through the top of the convex portion While aligning the center lines, the center of rotation of the grindstone is positioned above or below the horizontal plane of the semiconductor wafer, and while rotating the grindstone, at least one of the grindstone or the semiconductor wafer is moved to rotate the grindstone to the semiconductor wafer. A method for chamfering a notch, characterized in that the upper and lower peripheral edges of the notch are chamfered by contacting the notch. (3) The notch chamfering method according to claim 2, characterized in that, without rotating the whetstone, both the whetstone and the semiconductor wafer are moved so that the chamfered surface of the notch portion of the semiconductor wafer becomes a flat surface. (4) a positioning means for positioning a notch formed on the outer periphery of a semiconductor wafer in a predetermined direction; a transport means for transporting the positioned semiconductor wafer to a processing position; and a transport means for transporting the semiconductor wafer transported to the processing position. A moving means for holding and moving the grinding wheel, a grinding wheel provided with a convex portion having a cross-sectional shape corresponding to the shape of the notch portion of the semiconductor wafer, a driving means for rotationally driving the grinding wheel, A notch chamfering device characterized by comprising a moving means for moving at least one side.