JP2003163187A - Method and machine for grinding edge of work - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To chamfer the edge of a very hard work susceptible to chipping or cracking, e.g. a wafer of new material such as sapphire, SiC, or the like, smoothly by sanding without causing a defect, e.g. a pit or chipping, and without sacrifice of the lifetime of a grinding wheel. <P>SOLUTION: The grinding machine comprises a spindle 2 having wheels 5 and 6 containing abrasives arranged to rotate in the direction perpendicular to the face of a thin planar work 8 and to traverse in the plane direction of the work 8, a floating mechanism 3 having a resilient body for pressing the wheels 5 and 6 lightly against the edge 8a of the work 8 and releasing them appropriately from the edge 8a, and a floating amount adjusting mechanism 4 having a stopper 40 stopping movements of the wheels 5 and 6 in the direction of the work 8 due to the recovery force of the resilient body 31 and arranged to adjust the position of the stopper by numerical control. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for polishing a work edge, and particularly, it is very hard such as a new material wafer such as sapphire or SiC used for a device of high frequency and the like, so that it is not damaged. The edge of the work that is easily cracked can be chamfered uniformly without causing defects such as pits and chipping, and without sacrificing the life of the wheel that is a grindstone. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a long-awaited method and apparatus for polishing a work edge.

[0002]

2. Description of the Related Art For high frequency devices, GaAs (gallium arsenide), GaP (gallium phosphide), InP (indium phosphide), quartz, sapphire, SiC (silicon carbide), LT (lithium tantalate), langasite, etc. Various materials have come to be used,
These materials are thinly cut into wafers, which are ground and polished using a planar technique.

However, some of these materials have properties of being extremely hard, easily chipped, and easily cracked, and fine cracks (pits) are generated at the edge of the wafer in the grinding and polishing steps, and the pits are formed. As a result, larger partial cracks (chipping) and wafer cracks occur,
In the subsequent etching process, there is a problem that the etching rate of these cracked portions becomes high.

For this reason, in the conventional polishing method in which the edge of the wafer is polished by a shaping wheel (for example, a metal bond grindstone), cooling water may not easily enter the polishing portion and heat may be easily generated. There is a problem that the life of the wheel is shortened because the portion of the wheel that has a large amount of abrasion wears quickly. For example, in the case of a sapphire wafer, one forming wheel has several hundreds of wheels. I could only polish. There is also a problem that when the wheel approaches the end of its life, chipping is more likely to occur.

As a countermeasure, first, it is possible to use a wheel having a large abrasive grain and a high abrasion resistance, for example, about # 200 to # 500, but there are drawbacks in that scratches such as chipping are deep and many are formed. there were.

It is also conceivable, for example, that after grinding with a # 400 wheel, finish grinding with a # 2000 wheel with small abrasive grains to remove chipping generated during grinding, but the wafer is a hard material. Since the grinding power of the wheel with fine abrasive grains was small, it was not possible to completely remove the chipping that had once adhered.

[0007] The applicant of the present invention has filed Japanese Patent Application Laid-Open No. 2000-5221.
No. 0, there is disclosed a work edge polishing device in which a floating mechanism is provided in a spindle part for rotating a rubber wheel in a direction perpendicular to the surface direction of the work and polishing can be performed with a light polishing force.

The applicant of the present invention has also filed Japanese Patent Application Laid-Open No. 2000-3177.
No. 87, there is disclosed a work edge polishing device that performs polishing while traversing the spindle portion in the surface direction of the work.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in order to eliminate the above-mentioned drawbacks of the prior art. The object of the present invention is to attach a thin plate-shaped work to a work mounting base to provide an abrasive. Is rotated in the direction perpendicular to the surface of the work, the work mounting base is moved to bring the work into contact with the wheel, at which time the wheel is traversed in the direction of the work surface, and the wheel escapes appropriately by the elastic body. In this way, the edge of the work piece is lightly contacted for polishing, and the relative position of the wheel and the work mount is determined by numerical control so as to prevent more than a predetermined amount of grinding. The purpose is to be able to polish the edges of workpieces such as new material wafers such as sapphire and SiC without causing defects. Together thereby prevented cracking or the like of the work is to ensure that the process after the etching can be performed without hindrance.

Another object of the present invention is to prevent the occurrence of chipping and the like by effectively rotating the wheel at a high speed in the above method and polishing so that the number of cuts during polishing will be very small. It is to be able to do.

Still another object is to determine the position of a stopper for stopping the wheel, which is going to move in the direction of the work in the direction of the work due to the restoring force of the elastic body at a predetermined position by numerical control, for wheel floating. It is to prevent the polishing of a predetermined amount or more due to the pressing biasing force of the elastic body so that the polishing amount can always be made uniform.

Still another object of the present invention is to perform rough polishing and finish polishing by polishing the edge of a work in the same step by using a wheel containing a coarse abrasive and a wheel containing a fine abrasive in this order. Both of them can be efficiently and accurately performed in the same process.

Still another object is to provide a spindle including a wheel containing an abrasive so as to rotate in a direction perpendicular to a surface of a thin plate-like work and to be traversable in a surface direction of the work, and to a work edge. A floating mechanism that has an elastic body that lightly presses and urges the wheel and appropriately escapes from the edge,
By providing a floating amount adjusting mechanism configured to be able to adjust the relative positions of the wheel and the work mount by numerical control so that a predetermined amount of polishing is not performed, without damaging the wheel, and Without causing defects such as pits and chipping on the polished surface,
It is to be able to polish the edge of the new material work.

Still another object is to provide a spindle having the above-mentioned floating mechanism with a stopper for stopping the movement of the wheel in the direction of the work due to the restoring force of the elastic body so that the position of the stopper can be adjusted by numerical control. By providing the above-mentioned floating amount adjusting mechanism, a polishing amount is predetermined and the polishing is prevented by a predetermined amount or more, and uniform polishing can be performed without unevenness. Further, by this, the OF (orientation flat) of the wafer can be improved. Even if it is a straight part like
It is to be able to polish while maintaining its linearity.

Still another object is to provide, in addition to the above-mentioned structure, a work mounting base for mounting a work and bringing the work into contact with or away from a wheel, and the work mounting base also has a floating mechanism similar to the above. By providing the same floating amount adjusting mechanism as described above, for example, two kinds of elastic bodies having different spring constants are made to have different specifications for the spring constants of the elastic bodies in the floating mechanism on the spindle side and the floating mechanism on the workpiece mounting table side. Every other time, the user can select the floating mechanism to which the elastic body having a spring constant suitable for the material of the work is attached so that the most efficient polishing can be performed.

[0016]

In summary, the method of the present invention (claim 1) is to mount a thin plate-shaped work on a work mounting base and rotate a wheel containing an abrasive in a direction perpendicular to the surface of the work. The work mount is moved to bring the work into contact with the wheel. At this time, the wheel is traversed in the surface direction of the work, and the wheel is appropriately escaped by an elastic body so that the work is lightly contacted with the edge of the work. The polishing is performed, and the relative positions of the wheel and the work mount are determined by numerical control so that the polishing is not performed for a predetermined amount or more.

According to the method of the present invention (claim 2), a thin plate-like work is attached to the work attachment base, and a wheel containing an abrasive is rotated at a high speed in a direction perpendicular to the surface of the work attachment to mount the work attachment base. The work is brought into contact with the wheel, the wheel is traversed in the surface direction of the work, and the wheel is floated by an elastic body so that the wheel escapes appropriately and the depth of cut is extremely reduced. The edge of the work is lightly contacted for polishing, and the position of the stopper for stopping the wheel, which is going to move in the direction of the work at a predetermined position due to the restoring force of the elastic body as the polishing progresses, is determined by numerical control. It is characterized by preventing polishing beyond a certain amount.

According to the method of the present invention (claim 3), a thin plate-like work is attached to a work attachment table whose feed amount is numerically controlled, and a wheel containing coarse abrasive is rapidly moved in a direction perpendicular to the surface of the work. Rotate, move the work mount to bring the work into contact with the wheel, at which time the wheel is traversed in the surface direction of the work, and the elastic body floats the wheel so that it can escape and the depth of cut. So that the amount is very small, the surface is lightly contacted with the edge of the work to perform rough polishing, and then the final polishing is performed by the same polishing using a wheel containing a fine abrasive, and the elastic body is restored as the polishing progresses. The position of the stopper for stopping the wheel, which is trying to move in the direction of the workpiece by force, at a predetermined position is determined by numerical control, and the same process is performed. It is characterized in that for performing both the coarse grinding and the finishing grinding.

Further, according to the present invention (claim 4), a wheel containing an abrasive is constructed so as to rotate in a direction perpendicular to a surface of a thin plate-like work, and a spindle configured to be traversable in the surface direction of the work. , A floating mechanism having an elastic body that presses the wheel lightly against the edge of the work and appropriately escapes from the edge, and the relative position of the wheel and the work mount so as not to carry out polishing more than a predetermined amount. And a floating amount adjusting mechanism configured to be adjustable by numerical control.

Further, according to the present invention (Claim 5), a plurality of wheels each containing an abrasive having a different particle size are constituted so as to rotate in a direction perpendicular to the surface of the thin plate-like work, and traverse in the surface direction of the work. And a floating mechanism having an elastic body for lightly pressing the wheel to the edge of the work and escaping it appropriately from the edge, and a restoring mechanism of the elastic body to move the wheel in the direction of the work. A floating amount adjusting mechanism which has a stopper for stopping the movement and which is capable of adjusting the position of the stopper by numerical control, and enables both rough polishing and finish polishing in one step. is there.

According to the present invention (claim 6), a wheel containing an abrasive is constituted so as to rotate in a direction at a right angle to the surface of the thin plate-like work, and is traversable in the surface direction of the work. It has a floating mechanism having an elastic body that urges the wheel lightly against the edge of the work and allows it to escape from the edge as appropriate, and a stopper that stops the movement of the wheel in the direction of the work due to the restoring force of the elastic body. A floating amount adjusting mechanism configured to adjust the position of the stopper by numerical control, and a work mount for attaching the work to bring the work into contact with or away from the wheel are provided. Also has a floating mechanism similar to the above and a floating amount adjusting mechanism similar to the above.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below with reference to the embodiments shown in the drawings. 1 to 3, the work edge polishing apparatus 1 according to the present invention includes a spindle 2, a floating mechanism 3, and a floating amount adjusting mechanism 4.

As shown in FIGS. 1 to 3, 9 and 10, the spindle 2 has a plurality of wheels 5 and 6 each containing an abrasive having a different particle size in a direction perpendicular to the surface of a thin plate-like work 8. Each of them is configured to rotate and traverses in the surface direction of the work 8.

The wheels 5 and 6 are vertically aligned and spaced apart from each other and are axially supported by bearings 7 in housings 9a and 9b. For example, the wheel 5 has an abrasive having a coarse particle size, and the wheel 6 has a fine particle size. Metal bond whetstone with abrasive,
Examples thereof include a resin bond grindstone, a resin metal grindstone, and a rubber wheel.

The wheels 5 and 6 are driven by one motor 11 as shown in FIGS. 1 to 6, and the motor 11 mounted in the case 12 is the shaft 1.
0 is rotated to rotate the pulley 13
3 is an upper and lower pulley 1 via winding transmission members 14 and 15.
6 and 18 are rotated, and the rotation of the pulleys 16 and 18 is performed by rotating the pulleys 19 and 20 coaxially mounted on the shafts of the wheels 5 and 6 via the winding transmission members 21 and 22, respectively. Pulley 2 attached to 23, 24
5 and 26 are transmitted to the wheels 5 and 6, respectively.

The shaft 10, which is directly driven by the motor 11, is axially supported on the housing 9 by a bearing 28, and the housing 9 is attached to the lower part of a vertical support column 29. The support column 29 is fixed to the floating plate 30 of the floating mechanism 3.

The floating mechanism 3, as shown in FIGS. 1 to 3 and 9, elastically urges the wheels 5 and 6 to the edge 8a of the work 8 by lightly pressing them and releases them from the edge 8a appropriately.
1, the floating plate 30 is slidably attached to the lower surface of the fixed plate 33 horizontally fixed to the column 32 via the linear guide 34 in the surface direction of the work 8.

As shown in FIG. 2, the elastic body 31 is, for example, a compression spring, and its rear end is fixed so as to be in contact with the column 32, and its front end moves the floating plate 30 forward through the receiving member 35, that is, the work 8. It is designed to be biased in the direction of.

As shown in FIGS. 1 to 3 and 7, the floating amount adjusting mechanism 4 stops the stopper 40 which stops the movement of the wheels 5 and 6 in the direction of the work 8 by the restoring force of the elastic body 31.
And the position of the stopper 40 can be adjusted by numerical control. For example, the rotation of the numerically controlled servo motor 41 is transmitted to the ball screw spline mechanism 43 via the winding transmission member 42. However, the movable range of the floating plate 30 can be adjusted by reciprocally moving the screw shaft 44, the tip of which serves as the stopper 40, in the floating direction of the floating plate 30.

The servo motor 41 is attached to, for example, a motor base 45 on a fixed plate 33, and a pulley 37 is fixed to its rotation shaft 41a, and the ball screw spline mechanism 43 is driven by the pulley. In addition, an encoder 27 directly connected to the rotary shaft 41a is provided. The ball screw spline mechanism 43 is attached to a housing 46 fixed to the lower surface of the fixed plate 33.

The ball screw spline mechanism 43 includes a nut 48 for linearly reciprocating the screw shaft 44, a spline nut 49 for preventing the screw shaft 44 from rotating and supporting the linear reciprocating motion, a spiral groove 44a and an axial direction. A linear groove 44b parallel to the screw shaft 44 formed on the outer peripheral surface,
A pulley 36 is attached to the nut 48, and the pulley 3
The 6 and the pulley 37 are wound around a positive-motion type winding transmission member (belt with belt) 42 that transmits the rotation of the servo motor 41 without slipping.

Incidentally, in the case where it is not necessary to float the spindle 2, a lock mechanism 50 capable of fixing the fixed plate 33 and the floating plate 30 is attached, and the upper member 38 attached to the floating plate 30 is attached. The fixed plate 33 and the floating plate 30 can be fixed by fitting the pin 47 slidably mounted in the vertical direction to the lower member 36 mounted on the fixed plate 33.

The servo motor 41, as shown in FIG.
The driver 52 is operated by a command from the NC device 51, and the drive amount is fed back to the computer 53 in the NC device 51 from the encoder 27. I am configuring. Then, in the computer 53, the contents of the program are read out to the memory 54, and the operation device 55 is used for the operation.

Work mount 60 for fixing the work 8
As shown in FIG. 8, the work 8 is brought into contact with or separated from the wheels 5 and 6, and, like the spindle 2, is provided with a floating mechanism 63, a floating amount adjusting mechanism 64 and a locking mechanism 65. ing.

A table 66 for sucking and fixing and rotating the work 8 is attached to a floating plate 68 of a floating mechanism 63, and the floating plate 68 can slide on a fixed plate 70 via a linear guide 69 in the directions of the wheels 5 and 6. Is attached to.

The fixed plate 70 is fixed on a bed 71, and the bed 71 is configured to be linearly reciprocable in the directions of the wheels 5 and 6 by driving a ball screw 72.

The floating amount adjusting mechanism 64, like the floating amount adjusting mechanism 4 described above, adjusts the floating amount by numerical control, but as shown in FIG. The meter head 74 may be attached, and the tip of the micrometer head 74 may be brought into contact with the floating plate 68 to manually adjust the floating amount.

Like the lock mechanism 50, the lock mechanism 65 is used when it is not necessary to float the table 66, and is attached to the upper bracket 76 attached to the bed 71 so as to be vertically slidable. Pin 7
By fitting the floating plate 68 to the floating plate 68, the floating plate 68 can be fixed to the fixed plate 70.

In the method of the present invention (claim 1), the thin plate-shaped work 8 is attached to the work mounting base 60, and the wheels 5 and 6 containing the abrasive are rotated in the direction perpendicular to the surface of the work 8 to The mounting base 60 is moved to bring the work 8 into contact with the wheels 5 and 6, and at this time, the wheels 5 and 6 are traversed in the surface direction of the work 8 and the elastic body 31 allows the wheels 5 and 6 to escape as appropriate. This is a method in which the edges 8a of 8 are lightly contacted with each other for polishing, and the relative positions of the wheels 5, 6 and the work mount 60 are determined by numerical control so that polishing of a predetermined amount or more is not performed.

In the method of the present invention (claim 2), the thin plate-shaped work 8 is attached to the work attachment base 60, and the wheels 5 and 6 containing the abrasive are rotated at a high speed in a direction perpendicular to the surface of the work 8. Move the work mount 60 to move the work 8
The wheels 5 and 6 and contact them at this time.
Is traversed in the surface direction of the work 8 and the elastic body 31
The wheels 5 and 6 are floated so that they can escape appropriately and the edge 8a of the work 8 is reduced so that the depth of cut is extremely small.
The surface of the stopper 40 for stopping at a predetermined position the wheels 5 and 6 which are going to move toward the work 8 by the restoring force of the elastic body 31 as the polishing progresses is determined by numerical control. This is a method of preventing polishing of a predetermined amount or more.

According to the method of the present invention (claim 3), the thin plate-shaped work 8 is mounted on the work mounting base 60 whose feed amount is numerically controlled.
And rotating the wheels 5 and 6 containing the coarse abrasive at a high speed in a direction perpendicular to the surface of the work 8 and moving the work mount 60 to bring the work 8 into contact with the wheels 5 and 6. , 6 are traversed in the surface direction of the work 8, and the wheels 5, 6 are floated by the elastic body 31 so as to escape appropriately, and are lightly contacted with the edge 8a of the work 8 so that the depth of cut is extremely small, and rough polishing is performed. Then, the final polishing is performed by the same polishing using the wheels 5 and 6 containing a fine abrasive, and the wheel 5, which tends to move toward the work 8 by the restoring force of the elastic body 31 as the polishing progresses. In this method, the position of the stopper 40 for stopping 6 at a predetermined position is determined by numerical control, and both rough polishing and finish polishing are performed in the same process.

The present invention is configured as described above,
The operation will be described below. In the floating amount adjusting mechanism 4, as shown in FIG. 9, when the servo motor 41 is rotated in the arrow A direction by numerical control, the nut 48 also rotates in the same direction, whereby the screw shaft 44 advances in the arrow C direction. The floating plate 30 is pushed by the screw shaft 44 and moves in the direction of arrow E. At this time, the elastic body 31 is also compressed and a restoring force is generated.

When the servomotor 41 is rotated in the direction of arrow B by numerical control, the nut 48 also rotates in the same direction, whereby the screw shaft 44 retracts in the direction of arrow D, and the restoring force of the elastic body 31 causes the screw shaft to rotate. The floating plate 30 moves in the direction of arrow F so as to follow 44. The position of the screw shaft 44 determines the position of the stopper 40 that is the tip of the screw shaft 44. Since the amount of movement of the stopper 40 is proportional to the amount of rotation of the rotary shaft 41a of the servo motor 41, this amount of rotation is detected by the encoder 27 and this detection signal is fed back to the computer 53, so that the stopper 40 moves. The position is precisely controlled numerically.

In the spindle 2, when the motor 11 is operated, the wheels 5 and 6 both rotate in the same direction. Then, when the edge 8a of the work 8 is brought into contact with the wheel 5 for polishing, the elastic force 31 is slightly deformed by the force of the work 8 being pressed against the wheel 5, and the floating plate 30 moves in the direction of arrow E. To float.

Since the wheel 5 is attached to the spindle 2 fixed to the floating plate 30, the wheel 5 escapes slightly in the direction of arrow E together with the floating plate 30 to prevent the wheel 5 and the work 8 from being damaged by an excessive polishing force. .

As the polishing progresses, the wheel 5 is abraded and the work 8 is abraded and reduced, so that the wheel 5 moves in the direction of arrow F, that is, the direction of the work 8 by the restoring force of the elastic body 31, When the floating plate 30 comes into contact with the stopper 40, the movement of the wheel 5 is stopped, and the polishing does not proceed any further. Since the position of the stopper 40 can be accurately determined by numerical control, it is possible to always polish by a necessary polishing amount.

Further, as the order of polishing, as shown in FIG. 10, the height of the work 8 is changed and the wheels 5 and 6 are used in this order to perform rough polishing and finish polishing in one step. it can.

The polishing of the edge 8a of the work 8 rotates the work 8 in the direction of arrow G at a low speed as shown in FIG. While traversing in the width direction of the wafer (reciprocating reciprocating motion) (traverse is not shown), as shown in FIGS. 8 and 10, the rotation of the work 8 is stopped for the straight portion 8g such as the OF of the wafer. Let's do it only with the traverse of wheels 5 and 6. At this time, the stopper 4
Since the amount of polishing is limited by 0, it is possible to perform polishing while maintaining the linearity of the linear portion 8g.

In the wheel 5, FIG. 11 and FIG.
As shown in FIG. 4, among the edges 8a of the work 8, first, the wheel 5 is rotated in the direction of arrow H and the upper surface 8b is polished by upcut, and then the wheel 5 is rotated in the direction of arrow I and upcut. The lower surface 8c is polished. Then, the wheel 5 is rotated in the direction of arrow H or I to polish the end surface 8d. Then, as shown in FIG. 14, the wheel 5 is rotated in the direction of the arrow H to move the upper corner 8e.
Finally, as shown in FIG. 15, the wheel 5 is rotated in the direction of arrow H to polish the lower corner portion 8f. The above-mentioned polishing with the wheel 5 is rough polishing. Further, the wheel 6 is also subjected to similar polishing, but this polishing is finish polishing.

By carrying out polishing in this manner, the edge 8a of the work 8 is very hard and is likely to be chipped or cracked, such as a new material wafer such as sapphire or SiC used for high frequency devices. Even so,
Chamfering can be carried out uniformly without causing defects such as pits and chipping, and without sacrificing the life of the wheels 5 and 6 which are grinding stones.

When the wheels 5 and 6 have elasticity, the upper corner 8e and the lower corner 8f are simultaneously ground when the upper surface 8b and the lower surface 8c are ground. The upper corner 8e and the lower corner 8 again.
It is not necessary to polish f.

When the wheels 5 and 6 are floated, the lock mechanism 6 of the work mounting base 60 in FIG. 8 is used.
It is necessary to prevent the table 66 to which the work 8 is attached from 5 from floating. On the contrary, when the work mount 60 is floated, the lock mechanism 50 is operated so that the wheels 5 and 6 do not float.

[0053]

As described above, according to the present invention, a thin plate-like work is attached to the work mount as described above, the wheel containing the abrasive is rotated in a direction perpendicular to the surface of the work, and the work mount is moved to move the work. To the wheel, traverse the wheel in the direction of the surface of the work, and allow the wheel to escape as appropriate by the elastic body so that it touches the edge of the work lightly and polish it to prevent more than a predetermined amount of grinding. Since the relative position of the wheel and the work mount is determined by numerical control, the edge of a work such as a new material wafer such as sapphire or SiC can be polished without causing defects such as pits and chipping. In addition, as a result, it is possible to prevent cracking of the work in advance and to perform post-processes such as etching without trouble. There is a result.

In the above method, the wheel is rotated at a high speed so that the number of cuts during polishing is reduced so that chipping and the like can be prevented more effectively and the wheel can be made to last longer. There is an effect that can be.

Further, since the position of the stopper for stopping the wheel, which is going to move in the direction of the work in the direction of the work due to the restoring force of the elastic body at a predetermined position with the progress of polishing, is determined by numerical control, the wheel for wheel floating is set. It is possible to prevent the polishing of a predetermined amount or more due to the pressing biasing force of the elastic body, and obtain the effect that the polishing amount can be made uniform at all times.

Further, in the above method, since the wheel containing the coarse abrasive and the wheel containing the fine abrasive are sequentially used to polish the edge of the work in the same step, both the rough polishing and the finish polishing are performed. There is an effect that it can be performed efficiently and accurately in the same process.

Further, a wheel containing an abrasive is constituted so as to rotate in a direction perpendicular to the surface of the thin plate-like work, and is traversable in the surface direction of the work, and the wheel is lightly moved to the edge of the work. A floating mechanism having an elastic body for pressing and urging it appropriately from the edge, and a floating amount capable of adjusting the relative position of the wheel and the work mount by numerical control so that polishing of a predetermined amount or more is not performed. Since it has an adjustment mechanism, it can polish the edge of a very hard new material such as sapphire without damaging the wheel and causing defects such as pits and chipping on the polishing surface. There is.

Further, in the spindle having the above floating mechanism,
Since a floating amount adjusting mechanism having a stopper for stopping the movement of the wheel in the direction of the work due to the restoring force of the elastic body and being capable of adjusting the position of the stopper by numerical control is provided, the polishing amount is predetermined. It can prevent polishing more than a certain amount,
There is an effect that uniform polishing can be performed without unevenness. As a result, even a linear portion such as OF (orientation flat) of the wafer can be polished while maintaining its linearity.

Further, in addition to the above-mentioned constitution, a work mounting base for mounting the work and bringing the work into contact with or away from the wheel is provided, and the work mounting base also has the same floating mechanism as the above and the same as the above. Since two types of elastic bodies having different spring constants are provided with different specifications for the spring constants of the respective elastic bodies in the floating mechanism on the spindle side and the floating mechanism on the work mount side, Since the user can select to float the floating mechanism to which the elastic body having the spring constant suitable for the material is attached, the effect of the most efficient polishing can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view of a polishing device for an edge of a work.

FIG. 2 is a partial vertical cross-sectional side view of a polishing device for an edge of a work.

FIG. 3 is a partial vertical sectional front view of a polishing device for an edge of a work.

FIG. 4 is a perspective view of a spindle.

FIG. 5 is a cross-sectional view of the spindle.

FIG. 6 is a partial side view of the spindle.

FIG. 7 is a side view of a polishing device for an edge of a work and a block diagram of a control system of a floating amount adjusting mechanism.

FIG. 8 is a perspective view of a work edge polishing device having a work mount.

FIG. 9 shows a state in which the polishing force and the floating amount are set in advance by the action of the floating amount adjusting mechanism, and when the work is polished, the wheels are floated so as to escape appropriately and the edge of the work is polished by the preset polishing force. It is a partial longitudinal cross-sectional side view of the polishing device of the edge of the work shown.

FIG. 10 is a perspective view of a work edge polishing device showing a state where two edges, a rough polishing wheel and a finish polishing wheel, are used to polish the edge of the workpiece.

FIG. 11 is a partially enlarged side view of the work and the wheel showing a state in which the upper surface side of the edge of the work is polished by the wheel.

FIG. 12 is a partially enlarged side view of the work and the wheel showing a state where the lower surface side of the edge of the work is polished by the wheel.

FIG. 13 is a partially enlarged side view of the work and the wheel showing a state where the end surface of the edge of the work is polished by the wheel.

FIG. 14 is a partially enlarged side view of the work and the wheel showing a state in which the wheel is used to polish the upper corner portion of the edge of the work.

FIG. 15 is a partially enlarged side view of the work and the wheel showing a state in which the wheel is used to polish the lower corner of the edge of the work.

FIG. 16 is a partial side view of the spindle and the work showing a state where the edge of the work is polished by using two wheels for rough polishing and finish polishing.

[Explanation of symbols]

1 Work edge polishing device 2 spindles 3 Floating mechanism 4 Floating amount adjustment mechanism 5 wheels 6 wheels 8 work 8a edge 31 Elastic body 40 stopper 60 Work mount 63 Floating mechanism 64 Floating amount adjustment mechanism

Claims (6)

[Claims] 1. A thin plate-shaped work is mounted on a work mounting base, a wheel containing an abrasive is rotated in a direction perpendicular to a surface of the work, and the work mounting base is moved to bring the work into contact with the wheel. At this time, the wheel is traversed in the surface direction of the work, and the wheel is lightly contacted with the edge of the work so that the wheel can be appropriately escaped by an elastic body to perform the polishing, and the polishing of a predetermined amount or more is not performed. As described above, the relative position of the wheel and the work mount is determined by numerical control, and a method of polishing a work edge. 2. A thin plate-shaped work is mounted on a work mounting base, a wheel containing an abrasive is rotated at a high speed in a direction perpendicular to the surface of the work, and the work mounting base is moved to place the work on the wheel. Contact, at this time, the wheel is traversed in the surface direction of the workpiece, and the wheel is floated by an elastic body so that the wheel escapes appropriately, and the edge of the workpiece is lightly contacted for polishing so that the depth of cut is extremely small As the polishing progresses, the position of the stopper for stopping the wheel, which is going to move in the direction of the work in the predetermined direction by the restoring force of the elastic body, at a predetermined position is determined by numerical control to prevent the polishing more than the predetermined amount. The method of polishing the edge of the featured work. 3. A thin plate-like work is attached to a work mount whose feed amount is numerically controlled, and a wheel containing a coarse abrasive is rotated at a high speed in a direction perpendicular to the surface of the work,
The work mount is moved to bring the work into contact with the wheel, at which time the wheel is traversed in the surface direction of the work, and the wheel is floated by an elastic body so that the wheel can escape appropriately and the depth of cut is extremely small. Coarse polishing is performed by lightly contacting the edge of the work so as to reduce the amount, and then final polishing is performed by the same polishing using a wheel containing a fine polishing agent. The position of a stopper for stopping the wheel that is moving in the direction of the work at a predetermined position is determined by numerical control, and both the rough polishing and the finish polishing are performed in the same step, and the edge polishing of the work is performed. Method. 4. A spindle comprising a wheel containing an abrasive, the spindle being configured to rotate in a direction perpendicular to the surface of the thin plate-like work, and being traversable in the surface direction of the work,
The relative position of the wheel and the work mount is set to a numerical value so that the wheel and the work mount are prevented from being polished by a floating mechanism that has an elastic body that presses the wheel lightly against the edge of the work and allows it to escape from the edge as appropriate. A workpiece edge polishing apparatus comprising a floating amount adjusting mechanism configured to be adjustable by control. 5. A spindle constituted by a plurality of wheels each containing an abrasive having a different particle size so as to rotate in a direction perpendicular to the surface of the thin plate-like work and traverseable in the surface direction of the work, A floating mechanism having an elastic body for lightly pressing the wheel against the edge of the work and appropriately releasing it from the edge; and a stopper for stopping the movement of the wheel in the direction of the work due to the restoring force of the elastic body, A work edge polishing device comprising a floating amount adjusting mechanism capable of adjusting the position of a stopper by numerical control, and performing both rough polishing and finish polishing in one step. 6. A spindle containing a polishing agent, the spindle configured to rotate in a direction perpendicular to the surface of the thin plate-like work, and traversable in the surface direction of the work, and the wheel to the edge of the work. A floating mechanism having an elastic body that is lightly pressed and urged to escape from the edge appropriately, and a stopper that stops the movement of the wheel in the direction of the work due to the restoring force of the elastic body, and the position of the stopper are numerically controlled. A floating amount adjusting mechanism configured to be adjustable, and a work mount for attaching the work to bring the work into contact with or away from the wheel, and the work mount having the same floating mechanism as described above. A work edge polishing apparatus comprising the same floating amount adjusting mechanism as described above.