JPS6171653A - リ−ドフレ−ムの打抜加工方法 - Google Patents

リ−ドフレ−ムの打抜加工方法

Info

Publication number
JPS6171653A
JPS6171653A JP19505684A JP19505684A JPS6171653A JP S6171653 A JPS6171653 A JP S6171653A JP 19505684 A JP19505684 A JP 19505684A JP 19505684 A JP19505684 A JP 19505684A JP S6171653 A JPS6171653 A JP S6171653A
Authority
JP
Japan
Prior art keywords
lead frame
metal ribbon
residual stress
punching
punching method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19505684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0510826B2 (enrdf_load_stackoverflow
Inventor
Teruo Watanabe
渡辺　輝夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP19505684A priority Critical patent/JPS6171653A/ja
Publication of JPS6171653A publication Critical patent/JPS6171653A/ja
Publication of JPH0510826B2 publication Critical patent/JPH0510826B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP19505684A 1984-09-17 1984-09-17 リ−ドフレ−ムの打抜加工方法 Granted JPS6171653A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19505684A JPS6171653A (ja) 1984-09-17 1984-09-17 リ−ドフレ−ムの打抜加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19505684A JPS6171653A (ja) 1984-09-17 1984-09-17 リ−ドフレ−ムの打抜加工方法

Publications (2)

Publication Number Publication Date
JPS6171653A true JPS6171653A (ja) 1986-04-12
JPH0510826B2 JPH0510826B2 (enrdf_load_stackoverflow) 1993-02-10

Family

ID=16334818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19505684A Granted JPS6171653A (ja) 1984-09-17 1984-09-17 リ−ドフレ−ムの打抜加工方法

Country Status (1)

Country Link
JP (1) JPS6171653A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0678626U (ja) * 1993-02-25 1994-11-04 日本トムソン株式会社 保持器付きころ
FR2901118B1 (fr) 2006-05-16 2009-04-03 France Etat Dispositif de mesure de temperature et/ou d'humidite et dispositif de mesure du climat sous-vestial et vetement associes.

Also Published As

Publication number Publication date
JPH0510826B2 (enrdf_load_stackoverflow) 1993-02-10

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