JPS6169420A - 多段ホツトプレス - Google Patents

多段ホツトプレス

Info

Publication number
JPS6169420A
JPS6169420A JP19151484A JP19151484A JPS6169420A JP S6169420 A JPS6169420 A JP S6169420A JP 19151484 A JP19151484 A JP 19151484A JP 19151484 A JP19151484 A JP 19151484A JP S6169420 A JPS6169420 A JP S6169420A
Authority
JP
Japan
Prior art keywords
hot press
hot
hot plate
packing member
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19151484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0456728B2 (enrdf_load_stackoverflow
Inventor
Akemi Miyashita
宮下　明己
Kiyonori Furukawa
古川　清則
Masami Hirota
広田　政巳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP19151484A priority Critical patent/JPS6169420A/ja
Publication of JPS6169420A publication Critical patent/JPS6169420A/ja
Publication of JPH0456728B2 publication Critical patent/JPH0456728B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B7/00—Presses characterised by a particular arrangement of the pressing members
    • B30B7/02—Presses characterised by a particular arrangement of the pressing members having several platens arranged one above the other

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP19151484A 1984-09-14 1984-09-14 多段ホツトプレス Granted JPS6169420A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19151484A JPS6169420A (ja) 1984-09-14 1984-09-14 多段ホツトプレス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19151484A JPS6169420A (ja) 1984-09-14 1984-09-14 多段ホツトプレス

Publications (2)

Publication Number Publication Date
JPS6169420A true JPS6169420A (ja) 1986-04-10
JPH0456728B2 JPH0456728B2 (enrdf_load_stackoverflow) 1992-09-09

Family

ID=16275919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19151484A Granted JPS6169420A (ja) 1984-09-14 1984-09-14 多段ホツトプレス

Country Status (1)

Country Link
JP (1) JPS6169420A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6356608U (enrdf_load_stackoverflow) * 1986-09-30 1988-04-15
JPS6360311U (enrdf_load_stackoverflow) * 1986-10-03 1988-04-21
JPH01253426A (ja) * 1988-04-01 1989-10-09 Hitachi Techno Eng Co Ltd 多段ホットプレス
JPH04225182A (ja) * 1990-12-26 1992-08-14 Toshiba Corp 半導体記憶装置
CN104760314A (zh) * 2015-03-26 2015-07-08 成都扬中新能源科技有限公司 一种热压成形装置
US11044819B2 (en) * 2016-06-03 2021-06-22 International Business Machines Corporation Heating of printed circuit board core during laminate cure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710771U (enrdf_load_stackoverflow) * 1980-06-23 1982-01-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710771U (enrdf_load_stackoverflow) * 1980-06-23 1982-01-20

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6356608U (enrdf_load_stackoverflow) * 1986-09-30 1988-04-15
JPS6360311U (enrdf_load_stackoverflow) * 1986-10-03 1988-04-21
JPH01253426A (ja) * 1988-04-01 1989-10-09 Hitachi Techno Eng Co Ltd 多段ホットプレス
JPH04225182A (ja) * 1990-12-26 1992-08-14 Toshiba Corp 半導体記憶装置
CN104760314A (zh) * 2015-03-26 2015-07-08 成都扬中新能源科技有限公司 一种热压成形装置
US11044819B2 (en) * 2016-06-03 2021-06-22 International Business Machines Corporation Heating of printed circuit board core during laminate cure

Also Published As

Publication number Publication date
JPH0456728B2 (enrdf_load_stackoverflow) 1992-09-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees