JPS6169420A - Multiple stage hot press - Google Patents
Multiple stage hot pressInfo
- Publication number
- JPS6169420A JPS6169420A JP19151484A JP19151484A JPS6169420A JP S6169420 A JPS6169420 A JP S6169420A JP 19151484 A JP19151484 A JP 19151484A JP 19151484 A JP19151484 A JP 19151484A JP S6169420 A JPS6169420 A JP S6169420A
- Authority
- JP
- Japan
- Prior art keywords
- hot plate
- packing member
- packing
- core frame
- vacuum deaeration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B7/00—Presses characterised by a particular arrangement of the pressing members
- B30B7/02—Presses characterised by a particular arrangement of the pressing members having several platens arranged one above the other
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はコンピュータなど各種電子機器の多層プリント
配線基板を接着する際に好適な多段ホットプレスに関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a multistage hot press suitable for bonding multilayer printed wiring boards of various electronic devices such as computers.
多層プリント配線基板の圧着用として使用される多段ホ
ットプレスは特開昭５９−８７８９４号公報などにより
開示されている。A multi-stage hot press used for crimping multilayer printed wiring boards is disclosed in Japanese Patent Application Laid-Open No. 87894/1983.
この種のホットプレスは、複数の熱板間に被接着物の多
層プリント配線基板を挿入し、各熱板間に加熱冷却装置
により成形エネルギーを与えると同時に、ラムシリンダ
ーに油圧を供給することにより加熱加圧して接着するよ
うに構成されている。This type of hot press involves inserting a multilayer printed wiring board to be bonded between multiple hot plates, applying forming energy between each hot plate using a heating and cooling device, and simultaneously supplying hydraulic pressure to a ram cylinder. It is configured to be bonded by applying heat and pressure.
前記熱板には真空脱気用パツキン部材を設けることによ
り、熱板間を真空状態にしてプリント配線基板を接着し
ている。このようにプリント配線基板を真空状態で接着
する理由は、基板を接着する接着剤から発生する気泡を
真空脱気装置で除去するものである。By providing a packing member for vacuum degassing on the hot plate, a vacuum state is created between the hot plates and the printed wiring board is bonded to the hot plate. The reason why printed wiring boards are bonded in a vacuum state in this way is that air bubbles generated from the adhesive used to bond the boards are removed by a vacuum degassing device.
ところで、前記真空脱気用パツキン部材は長時間の使用
に酎えることができないため、時々交換して使用してい
た。By the way, the vacuum degassing packing member cannot be used for a long period of time, so it has to be replaced from time to time.
しかしながら従来のパツキン部材は、熱板への取付が複
雑になっているため、１段の交換作業に１時間以上も要
し、多段（５段）の交換作業には長時間を費やすなどの
問題点を有していた。However, because conventional packing members are complicated to attach to the hot plate, it takes more than an hour to replace one stage, and it takes a long time to replace multiple stages (5 stages). It had a point.
本発明の目的は、真空脱気用パツキン部材の耐久性の向
上および交換作業の短縮を図るようにした多段ホットプ
レスを提供することにある。An object of the present invention is to provide a multi-stage hot press in which the durability of the vacuum degassing packing member is improved and the replacement work is shortened.
本発明の特徴は、高剛性の心枠上下面に、耐熱性のパツ
キン材を接合した真空脱気用パツキン部材を、熱板に取
付けたフックに取外し可能に支持するように構成したも
のである。A feature of the present invention is that a vacuum degassing packing member made by bonding a heat-resistant packing material to the upper and lower surfaces of a highly rigid core frame is configured to be removably supported by a hook attached to a hot plate. .
〔発明の実施例〕
以下本発明のプレスの一実施例を第１図〜第３図により
説明する。プレス下フレーム１に固定された主ラムシリ
ンダー２のラム３上には下ポルスｆ□′ タ
ー４が載置され、下ボルスタ−４上には下断熱板５を介
して下熱板６が固定されている。また、上熱板１２は上
断熱板１３により熱的に絶縁され、プレス下フレーム１
と支柱１４で連結された上ボルスタ−１５に固定されて
いる。さらに複数の中間熱板１ｏはカウンターシリンダ
ー１１により支持されている。７は前記中間熱板１ｏ、
上熱板１２の全側面に沿って設けられ、熱板間を真空状
態に保持する真空脱気用パツキン部材で、このパツキン
部材７は高剛性を有する鉄心などの心枠８と、この心枠
８の上、下面に接合される高耐熱性を有する発泡スチー
ルなどのパツキン材８ａ。[Embodiment of the Invention] An embodiment of the press of the present invention will be described below with reference to FIGS. 1 to 3. A lower porcelain cylinder 4 is placed on the ram 3 of the main ram cylinder 2 fixed to the lower press frame 1, and a lower heating plate 6 is fixed on the lower bolster 4 via a lower heat insulating plate 5. has been done. Further, the upper heating plate 12 is thermally insulated by the upper heat insulating plate 13, and the lower press frame 1
It is fixed to an upper bolster 15 connected by a support 14. Further, the plurality of intermediate hot plates 1o are supported by a counter cylinder 11. 7 is the intermediate hot plate 1o,
This is a vacuum degassing gasket member that is provided along all sides of the upper hot plate 12 and maintains a vacuum state between the hot plates. Packing material 8a such as foamed steel having high heat resistance is bonded to the upper and lower surfaces of 8.
８ｂと、このパツキン材の内側を心枠８を介して支持す
る内フランジ９などから成っている。１６は前記パツキ
ン部材７を取外し可能に支持するフックで、このフック
１６は熱板に支持されており。8b, and an inner flange 9 that supports the inside of this packing material via a core frame 8. Reference numeral 16 denotes a hook for removably supporting the packing member 7, and this hook 16 is supported by a hot plate.
このフック１６のガイド穴１６ａにパツキン部材７の心
枠８が挿入される。The core frame 8 of the packing member 7 is inserted into the guide hole 16a of the hook 16.
上記の構成において、下熱板６と中間熱板１０および中
間熱板１ｏと上熱板１２間に被接着物のプリント配線基
板１７を挿入し、各熱板に加熱冷却制御装［１８より成
形熱エネルギーを与えると同時に、主ラムシリンダー２
およびカウンターシリンダー１１に、油圧装置１９より
油圧を供給し、さらに下熱板６および中間熱板１０に形
成した真空脱気穴２０に接続された配管２１により真空
脱気装置２２で熱°板間を真空状態とし、プリント配線
基板１７を真空状態で加熱加圧して接着する。In the above configuration, the printed wiring board 17 to be bonded is inserted between the lower hot plate 6 and the intermediate hot plate 10, and between the intermediate hot plate 1o and the upper hot plate 12, and each hot plate is provided with a heating and cooling control device [formed from 18]. At the same time as providing thermal energy, the main ram cylinder 2
Hydraulic pressure is supplied from a hydraulic device 19 to the counter cylinder 11, and a vacuum deaeration device 22 is used to heat the space between the hot plates through a pipe 21 connected to vacuum deaeration holes 20 formed in the lower hot plate 6 and intermediate hot plate 10. is placed in a vacuum state, and the printed wiring board 17 is bonded by heating and pressing in a vacuum state.
このとき、中間熱板１０および上熱板１２に、フック１
６で吊り下げられた真空脱気用パツキン部材７は、油圧
装置！１９の油圧で上昇するラム３上の、下ボルスタ−
４、下断熱板５、下熱板６、中間熱板１０などの上昇に
より、熱板外周面で弾性支持され、熱板間を外気とシー
ルする。ところで。At this time, the hook 1 is attached to the intermediate hot plate 10 and the upper hot plate 12.
The vacuum deaeration packing member 7 suspended at 6 is a hydraulic device! The lower bolster on the ram 3 that rises with the hydraulic pressure of 19
4. By raising the lower heat insulating plate 5, the lower hot plate 6, the intermediate hot plate 10, etc., they are elastically supported on the outer peripheral surface of the hot plate, sealing the space between the hot plates from the outside air. by the way.
パツキン部材７は心枠８をパツキン材８ａ、８ｂの中央
に配置することにより最も変形しやすい部分を補強し、
心枠８の内側に取り付けた内フランジ９で外圧から耐え
られ一６構造になっており、しかもこのパツキン部材７
は熱板に取付けたフックに簡単に吊れ下げればよいため
、真空脱気用パツキン部材の交換取付作業が大幅に短縮
される。The packing member 7 reinforces the part that is most easily deformed by arranging the core frame 8 in the center of the packing materials 8a and 8b.
The inner flange 9 attached to the inside of the core frame 8 has a structure that can withstand external pressure, and this packing member 7
can be simply hung from a hook attached to the hot plate, which greatly shortens the work required to replace and install the vacuum degassing packing member.
ちなみに、従来の真空脱気用パツキン部材は第４図に示
す如く、パツキン部材２３は押え板２４と押えボルト２
５で締付けていたため、その交換作業に長時開票してい
た。By the way, as shown in FIG. 4, the conventional packing member for vacuum degassing is a packing member 23 that has a presser plate 24 and a presser bolt 2.
5, so it took a long time to replace it.
本発明の多段ホットプレスによれば、真空脱気用パツキ
ン部材の耐久性が向上すると共に交換作業の大幅な短縮
を図ることができるなどの効果を有する。According to the multi-stage hot press of the present invention, the durability of the vacuum degassing packing member is improved, and the replacement work can be significantly shortened.
第１図は本発明の多段ホットプレスの構造を示す正面図
、第２図は本発明における真空脱気用パツキン部材を熱
板に取付けた平面図、第３図は第２図の■−■線矢視断
面図、第４図は従来の真空脱気用パツキン部材の取付状
態を示す図である。
１・・・プレス下フレーム、２・・・主ラムシリンダー
。Fig. 1 is a front view showing the structure of the multi-stage hot press of the present invention, Fig. 2 is a plan view of the vacuum degassing packing member of the present invention attached to a hot plate, and Fig. 3 is a diagram showing ■-■ in Fig. 2. FIG. 4, a cross-sectional view taken along the line, is a diagram showing a state in which a conventional vacuum degassing packing member is attached. 1...Press lower frame, 2...Main ram cylinder.
Claims (1)
して被接着物を加圧する加圧機構などを備える多段ホッ
トプレスにおいて、前記熱板の全側面に、高剛性の心枠
の上下面に高耐熱性のパッキン材を接合した真空脱気用
パッキン部材を取外し可能に設けたことを特徴とする多
段ホットプレス。 ２、前記真空脱気用パッキン部材の心枠を、熱板側面に
取付けたフックのガイド穴に挿入するように構成したこ
とを特徴とする特許請求の範囲第１項記載の多段ホット
プレス。 ３、前記パッキン材は、発泡シリコンゴムで形成したこ
とを特徴とする特許請求の範囲第１項記載の多段ホット
プレス。[Claims] 1. In a multi-stage hot press equipped with a plurality of hot plates that heat objects to be bonded and a pressure mechanism that presses the objects to be bonded via these hot plates, all sides of the hot plates are heated. , a multi-stage hot press characterized by a removable vacuum degassing packing member in which a highly heat-resistant packing material is bonded to the upper and lower surfaces of a highly rigid core frame. 2. The multi-stage hot press according to claim 1, wherein the core frame of the vacuum degassing packing member is inserted into a guide hole of a hook attached to a side surface of the hot plate. 3. The multi-stage hot press according to claim 1, wherein the packing material is made of foamed silicone rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19151484A JPS6169420A (en) | 1984-09-14 | 1984-09-14 | Multiple stage hot press |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19151484A JPS6169420A (en) | 1984-09-14 | 1984-09-14 | Multiple stage hot press |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6169420A true JPS6169420A (en) | 1986-04-10 |
| JPH0456728B2 JPH0456728B2 (en) | 1992-09-09 |
Family
ID=16275919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19151484A Granted JPS6169420A (en) | 1984-09-14 | 1984-09-14 | Multiple stage hot press |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6169420A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6356608U (en) * | 1986-09-30 | 1988-04-15 | ||
| JPS6360311U (en) * | 1986-10-03 | 1988-04-21 | ||
| JPH01253426A (en) * | 1988-04-01 | 1989-10-09 | Hitachi Techno Eng Co Ltd | Multistage hot press |
| JPH04225182A (en) * | 1990-12-26 | 1992-08-14 | Toshiba Corp | Semiconductor memory |
| CN104760314A (en) * | 2015-03-26 | 2015-07-08 | 成都扬中新能源科技有限公司 | Thermoforming device |
| US11044819B2 (en) * | 2016-06-03 | 2021-06-22 | International Business Machines Corporation | Heating of printed circuit board core during laminate cure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5710771U (en) * | 1980-06-23 | 1982-01-20 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51143568A (en) * | 1975-06-05 | 1976-12-09 | Asahi Glass Co Ltd | A process for removing nitrogen oxides from exhaust combustion gas and a reactor for it |
-
1984
- 1984-09-14 JP JP19151484A patent/JPS6169420A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5710771U (en) * | 1980-06-23 | 1982-01-20 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6356608U (en) * | 1986-09-30 | 1988-04-15 | ||
| JPS6360311U (en) * | 1986-10-03 | 1988-04-21 | ||
| JPH01253426A (en) * | 1988-04-01 | 1989-10-09 | Hitachi Techno Eng Co Ltd | Multistage hot press |
| JPH04225182A (en) * | 1990-12-26 | 1992-08-14 | Toshiba Corp | Semiconductor memory |
| CN104760314A (en) * | 2015-03-26 | 2015-07-08 | 成都扬中新能源科技有限公司 | Thermoforming device |
| US11044819B2 (en) * | 2016-06-03 | 2021-06-22 | International Business Machines Corporation | Heating of printed circuit board core during laminate cure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0456728B2 (en) | 1992-09-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |