JPH0429560Y2 - - Google Patents

Info

Publication number
JPH0429560Y2
JPH0429560Y2 JP1985078205U JP7820585U JPH0429560Y2 JP H0429560 Y2 JPH0429560 Y2 JP H0429560Y2 JP 1985078205 U JP1985078205 U JP 1985078205U JP 7820585 U JP7820585 U JP 7820585U JP H0429560 Y2 JPH0429560 Y2 JP H0429560Y2
Authority
JP
Japan
Prior art keywords
bonding tool
tool head
bonding
prevention member
deformation prevention
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985078205U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61195057U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985078205U priority Critical patent/JPH0429560Y2/ja
Publication of JPS61195057U publication Critical patent/JPS61195057U/ja
Application granted granted Critical
Publication of JPH0429560Y2 publication Critical patent/JPH0429560Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP1985078205U 1985-05-25 1985-05-25 Expired JPH0429560Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985078205U JPH0429560Y2 (enrdf_load_stackoverflow) 1985-05-25 1985-05-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985078205U JPH0429560Y2 (enrdf_load_stackoverflow) 1985-05-25 1985-05-25

Publications (2)

Publication Number Publication Date
JPS61195057U JPS61195057U (enrdf_load_stackoverflow) 1986-12-04
JPH0429560Y2 true JPH0429560Y2 (enrdf_load_stackoverflow) 1992-07-17

Family

ID=30621976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985078205U Expired JPH0429560Y2 (enrdf_load_stackoverflow) 1985-05-25 1985-05-25

Country Status (1)

Country Link
JP (1) JPH0429560Y2 (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60213037A (ja) * 1984-04-09 1985-10-25 Matsushita Electric Ind Co Ltd ボンデイングツ−ル

Also Published As

Publication number Publication date
JPS61195057U (enrdf_load_stackoverflow) 1986-12-04

Similar Documents

Publication Publication Date Title
JPS61294778A (ja) 自己溶融性のフレキシブルコネクタ
JP4988607B2 (ja) ヒータチップ及び接合装置及び接合方法
JPH04185455A (ja) 定着用加熱体、定着装置および画像形成装置
JPH0429560Y2 (enrdf_load_stackoverflow)
JP2581592B2 (ja) フレキシブルピンキャリア及びそれを使用した半導体装置
JP2012114318A (ja) 太陽電池セルへのタブリードのハンダ付け装置及びハンダ付け方法
JP3977965B2 (ja) ヒータ装置
JP2847954B2 (ja) 半導体装置の製造方法
JP2728230B2 (ja) リードの接合法
JP2580220B2 (ja) フレキシブル回路基板用パレット
JPH0654837B2 (ja) 回路基板の固定方法
JPS621279B2 (enrdf_load_stackoverflow)
JPH083018Y2 (ja) 半導体パッケージ用連結型リードフレーム
JPH0630447Y2 (ja) 光プリンタヘッド
JPS61238463A (ja) はんだ付装置およびそのはんだ付方法
JPS6356705B2 (enrdf_load_stackoverflow)
JPH06291152A (ja) 半導体装置用リードフレーム
JP2865788B2 (ja) サーマルヘッドの製造方法
JP2929934B2 (ja) リードの熱圧着ヘッド
JPH06342829A (ja) ボンディングツール
KR950006316Y1 (ko) 자기헤드용 코어 블록의 갭형성치구
JP4091687B2 (ja) セラミック基板の電極接続構造
JPS63281436A (ja) 半導体装置
JPH0119418Y2 (enrdf_load_stackoverflow)
JPH01305592A (ja) 多層プリント配線板