JPS6164755A - バリが発生しない封止材用シリカ充填樹脂組成物 - Google Patents

バリが発生しない封止材用シリカ充填樹脂組成物

Info

Publication number
JPS6164755A
JPS6164755A JP18607484A JP18607484A JPS6164755A JP S6164755 A JPS6164755 A JP S6164755A JP 18607484 A JP18607484 A JP 18607484A JP 18607484 A JP18607484 A JP 18607484A JP S6164755 A JPS6164755 A JP S6164755A
Authority
JP
Japan
Prior art keywords
filler
resin
silica particles
obtd
silica
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18607484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0368067B2 (https=
Inventor
Michio Ito
道生 伊藤
Yasuaki Shinohara
泰明 篠原
Yoshiaki Kurata
倉田　芳明
Sumikazu Murakami
村上　角一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harima Refractories Co Ltd
Nippon Steel Corp
Original Assignee
Harima Refractories Co Ltd
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harima Refractories Co Ltd, Nippon Steel Corp filed Critical Harima Refractories Co Ltd
Priority to JP18607484A priority Critical patent/JPS6164755A/ja
Publication of JPS6164755A publication Critical patent/JPS6164755A/ja
Publication of JPH0368067B2 publication Critical patent/JPH0368067B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
JP18607484A 1984-09-05 1984-09-05 バリが発生しない封止材用シリカ充填樹脂組成物 Granted JPS6164755A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18607484A JPS6164755A (ja) 1984-09-05 1984-09-05 バリが発生しない封止材用シリカ充填樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18607484A JPS6164755A (ja) 1984-09-05 1984-09-05 バリが発生しない封止材用シリカ充填樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6164755A true JPS6164755A (ja) 1986-04-03
JPH0368067B2 JPH0368067B2 (https=) 1991-10-25

Family

ID=16181926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18607484A Granted JPS6164755A (ja) 1984-09-05 1984-09-05 バリが発生しない封止材用シリカ充填樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6164755A (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01204456A (ja) * 1988-02-09 1989-08-17 Nitto Denko Corp 半導体装置
JPH0299552A (ja) * 1988-10-06 1990-04-11 Toray Ind Inc 半導体封止用エポキシ樹脂組成物
JPH02158637A (ja) * 1988-12-09 1990-06-19 Nippon Chem Ind Co Ltd シリカフィラーおよびこれを用いた封止用樹脂組成物
JPH02247236A (ja) * 1989-03-20 1990-10-03 Nippon Chem Ind Co Ltd 微細溶融球状シリカ及びこれを用いた封止用樹脂組成物
JPH10245480A (ja) * 1997-03-04 1998-09-14 Showa Highpolymer Co Ltd 封止用樹脂組成物
JPH10265662A (ja) * 1997-03-25 1998-10-06 Showa Highpolymer Co Ltd 低熱膨張性硬化体のための樹脂組成物およびその複合体
JP2008266378A (ja) * 2007-04-17 2008-11-06 Denki Kagaku Kogyo Kk 組成物、それを用いた金属ベース回路基板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01204456A (ja) * 1988-02-09 1989-08-17 Nitto Denko Corp 半導体装置
JPH0299552A (ja) * 1988-10-06 1990-04-11 Toray Ind Inc 半導体封止用エポキシ樹脂組成物
JPH02158637A (ja) * 1988-12-09 1990-06-19 Nippon Chem Ind Co Ltd シリカフィラーおよびこれを用いた封止用樹脂組成物
JPH02247236A (ja) * 1989-03-20 1990-10-03 Nippon Chem Ind Co Ltd 微細溶融球状シリカ及びこれを用いた封止用樹脂組成物
JPH10245480A (ja) * 1997-03-04 1998-09-14 Showa Highpolymer Co Ltd 封止用樹脂組成物
JPH10265662A (ja) * 1997-03-25 1998-10-06 Showa Highpolymer Co Ltd 低熱膨張性硬化体のための樹脂組成物およびその複合体
JP2008266378A (ja) * 2007-04-17 2008-11-06 Denki Kagaku Kogyo Kk 組成物、それを用いた金属ベース回路基板

Also Published As

Publication number Publication date
JPH0368067B2 (https=) 1991-10-25

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