JPS6164754A - 無機充填樹脂組成物の製造方法 - Google Patents

無機充填樹脂組成物の製造方法

Info

Publication number
JPS6164754A
JPS6164754A JP18607384A JP18607384A JPS6164754A JP S6164754 A JPS6164754 A JP S6164754A JP 18607384 A JP18607384 A JP 18607384A JP 18607384 A JP18607384 A JP 18607384A JP S6164754 A JPS6164754 A JP S6164754A
Authority
JP
Japan
Prior art keywords
fused silica
resin
semi
silica particles
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18607384A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6241981B2 (https=
Inventor
Michio Ito
道生 伊藤
Yasuaki Shinohara
泰明 篠原
Yoshiaki Kurata
倉田　芳明
Sumikazu Murakami
村上　角一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harima Refractories Co Ltd
Nippon Steel Corp
Original Assignee
Harima Refractories Co Ltd
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harima Refractories Co Ltd, Nippon Steel Corp filed Critical Harima Refractories Co Ltd
Priority to JP18607384A priority Critical patent/JPS6164754A/ja
Publication of JPS6164754A publication Critical patent/JPS6164754A/ja
Publication of JPS6241981B2 publication Critical patent/JPS6241981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
JP18607384A 1984-09-05 1984-09-05 無機充填樹脂組成物の製造方法 Granted JPS6164754A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18607384A JPS6164754A (ja) 1984-09-05 1984-09-05 無機充填樹脂組成物の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18607384A JPS6164754A (ja) 1984-09-05 1984-09-05 無機充填樹脂組成物の製造方法

Publications (2)

Publication Number Publication Date
JPS6164754A true JPS6164754A (ja) 1986-04-03
JPS6241981B2 JPS6241981B2 (https=) 1987-09-05

Family

ID=16181909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18607384A Granted JPS6164754A (ja) 1984-09-05 1984-09-05 無機充填樹脂組成物の製造方法

Country Status (1)

Country Link
JP (1) JPS6164754A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6315449A (ja) * 1986-07-07 1988-01-22 Nitto Electric Ind Co Ltd 半導体装置
JP2008266378A (ja) * 2007-04-17 2008-11-06 Denki Kagaku Kogyo Kk 組成物、それを用いた金属ベース回路基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物
JPS58219242A (ja) * 1982-06-15 1983-12-20 Toshiba Ceramics Co Ltd Ｉｃプラスチツクパツケ−ジ用フイラ−材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物
JPS58219242A (ja) * 1982-06-15 1983-12-20 Toshiba Ceramics Co Ltd Ｉｃプラスチツクパツケ−ジ用フイラ−材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6315449A (ja) * 1986-07-07 1988-01-22 Nitto Electric Ind Co Ltd 半導体装置
JP2008266378A (ja) * 2007-04-17 2008-11-06 Denki Kagaku Kogyo Kk 組成物、それを用いた金属ベース回路基板

Also Published As

Publication number Publication date
JPS6241981B2 (https=) 1987-09-05

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