JPS6161449A - マルチチップ集積回路パッケ−ジ - Google Patents

マルチチップ集積回路パッケ−ジ

Info

Publication number
JPS6161449A
JPS6161449A JP59182683A JP18268384A JPS6161449A JP S6161449 A JPS6161449 A JP S6161449A JP 59182683 A JP59182683 A JP 59182683A JP 18268384 A JP18268384 A JP 18268384A JP S6161449 A JPS6161449 A JP S6161449A
Authority
JP
Japan
Prior art keywords
chip
chips
heat
heat dissipation
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59182683A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0433137B2 (enExample
Inventor
Toshihiko Watari
渡里 俊彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP59182683A priority Critical patent/JPS6161449A/ja
Publication of JPS6161449A publication Critical patent/JPS6161449A/ja
Publication of JPH0433137B2 publication Critical patent/JPH0433137B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/40
    • H10W40/70
    • H10W72/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59182683A 1984-09-03 1984-09-03 マルチチップ集積回路パッケ−ジ Granted JPS6161449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59182683A JPS6161449A (ja) 1984-09-03 1984-09-03 マルチチップ集積回路パッケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59182683A JPS6161449A (ja) 1984-09-03 1984-09-03 マルチチップ集積回路パッケ−ジ

Publications (2)

Publication Number Publication Date
JPS6161449A true JPS6161449A (ja) 1986-03-29
JPH0433137B2 JPH0433137B2 (enExample) 1992-06-02

Family

ID=16122606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59182683A Granted JPS6161449A (ja) 1984-09-03 1984-09-03 マルチチップ集積回路パッケ−ジ

Country Status (1)

Country Link
JP (1) JPS6161449A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
WO2000004588A1 (de) * 1998-07-14 2000-01-27 Infineon Technologies Ag Elektrooptische baugruppe
US6295151B1 (en) 1997-05-13 2001-09-25 Nec Corporation Optical transmission and receiving equipment
JP2002343935A (ja) * 2001-05-11 2002-11-29 Sansha Electric Mfg Co Ltd 電力用半導体モジュール
JP2013073957A (ja) * 2011-09-26 2013-04-22 Diamond Electric Mfg Co Ltd 電動パワーステアリングコントロールユニット
US20140140011A1 (en) * 2012-11-16 2014-05-22 Hitachi Metals, Ltd. Signal Transmission Device
CN109860131A (zh) * 2019-03-22 2019-06-07 西安微电子技术研究所 一种具有内散热装置的系统级封装结构

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
US6295151B1 (en) 1997-05-13 2001-09-25 Nec Corporation Optical transmission and receiving equipment
WO2000004588A1 (de) * 1998-07-14 2000-01-27 Infineon Technologies Ag Elektrooptische baugruppe
JP2002343935A (ja) * 2001-05-11 2002-11-29 Sansha Electric Mfg Co Ltd 電力用半導体モジュール
JP2013073957A (ja) * 2011-09-26 2013-04-22 Diamond Electric Mfg Co Ltd 電動パワーステアリングコントロールユニット
US20140140011A1 (en) * 2012-11-16 2014-05-22 Hitachi Metals, Ltd. Signal Transmission Device
US9230882B2 (en) * 2012-11-16 2016-01-05 Hitachi Metals, Ltd. Signal transmission device
CN109860131A (zh) * 2019-03-22 2019-06-07 西安微电子技术研究所 一种具有内散热装置的系统级封装结构

Also Published As

Publication number Publication date
JPH0433137B2 (enExample) 1992-06-02

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees