JPH0326543B2 - - Google Patents

Info

Publication number
JPH0326543B2
JPH0326543B2 JP59124460A JP12446084A JPH0326543B2 JP H0326543 B2 JPH0326543 B2 JP H0326543B2 JP 59124460 A JP59124460 A JP 59124460A JP 12446084 A JP12446084 A JP 12446084A JP H0326543 B2 JPH0326543 B2 JP H0326543B2
Authority
JP
Japan
Prior art keywords
chip
heat sink
chips
heat
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59124460A
Other languages
English (en)
Japanese (ja)
Other versions
JPS614255A (ja
Inventor
Toshihiko Watari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP59124460A priority Critical patent/JPS614255A/ja
Publication of JPS614255A publication Critical patent/JPS614255A/ja
Publication of JPH0326543B2 publication Critical patent/JPH0326543B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/77—
    • H10W40/257—
    • H10W72/877—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59124460A 1984-06-19 1984-06-19 集積回路パツケ−ジ Granted JPS614255A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59124460A JPS614255A (ja) 1984-06-19 1984-06-19 集積回路パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59124460A JPS614255A (ja) 1984-06-19 1984-06-19 集積回路パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS614255A JPS614255A (ja) 1986-01-10
JPH0326543B2 true JPH0326543B2 (enExample) 1991-04-11

Family

ID=14886066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59124460A Granted JPS614255A (ja) 1984-06-19 1984-06-19 集積回路パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS614255A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
WO1989008327A1 (en) * 1988-03-01 1989-09-08 Digital Equipment Corporation Method and apparatus for packaging and cooling integrated circuit chips
USH1699H (en) * 1995-10-31 1997-12-02 The United States Of America As Represented By The Secretary Of The Navy Thermal bond system
US7608324B2 (en) 2001-05-30 2009-10-27 Honeywell International Inc. Interface materials and methods of production and use thereof

Also Published As

Publication number Publication date
JPS614255A (ja) 1986-01-10

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Legal Events

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