JPS614255A - 集積回路パツケ−ジ - Google Patents

集積回路パツケ−ジ

Info

Publication number
JPS614255A
JPS614255A JP59124460A JP12446084A JPS614255A JP S614255 A JPS614255 A JP S614255A JP 59124460 A JP59124460 A JP 59124460A JP 12446084 A JP12446084 A JP 12446084A JP S614255 A JPS614255 A JP S614255A
Authority
JP
Japan
Prior art keywords
chip
heat
heat sink
chip carriers
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59124460A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0326543B2 (enExample
Inventor
Toshihiko Watari
渡里　俊彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP59124460A priority Critical patent/JPS614255A/ja
Publication of JPS614255A publication Critical patent/JPS614255A/ja
Publication of JPH0326543B2 publication Critical patent/JPH0326543B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/77—
    • H10W40/257—
    • H10W72/877—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59124460A 1984-06-19 1984-06-19 集積回路パツケ−ジ Granted JPS614255A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59124460A JPS614255A (ja) 1984-06-19 1984-06-19 集積回路パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59124460A JPS614255A (ja) 1984-06-19 1984-06-19 集積回路パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS614255A true JPS614255A (ja) 1986-01-10
JPH0326543B2 JPH0326543B2 (enExample) 1991-04-11

Family

ID=14886066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59124460A Granted JPS614255A (ja) 1984-06-19 1984-06-19 集積回路パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS614255A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02501178A (ja) * 1988-03-01 1990-04-19 ディジタル　イクイプメント　コーポレーション 集積回路チップをパッケージ化及び冷却する方法及び装置
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
USH1699H (en) * 1995-10-31 1997-12-02 The United States Of America As Represented By The Secretary Of The Navy Thermal bond system
US7608324B2 (en) 2001-05-30 2009-10-27 Honeywell International Inc. Interface materials and methods of production and use thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02501178A (ja) * 1988-03-01 1990-04-19 ディジタル　イクイプメント　コーポレーション 集積回路チップをパッケージ化及び冷却する方法及び装置
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
USH1699H (en) * 1995-10-31 1997-12-02 The United States Of America As Represented By The Secretary Of The Navy Thermal bond system
US7608324B2 (en) 2001-05-30 2009-10-27 Honeywell International Inc. Interface materials and methods of production and use thereof

Also Published As

Publication number Publication date
JPH0326543B2 (enExample) 1991-04-11

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees