JPS6153851B2 - - Google Patents

Info

Publication number
JPS6153851B2
JPS6153851B2 JP54013354A JP1335479A JPS6153851B2 JP S6153851 B2 JPS6153851 B2 JP S6153851B2 JP 54013354 A JP54013354 A JP 54013354A JP 1335479 A JP1335479 A JP 1335479A JP S6153851 B2 JPS6153851 B2 JP S6153851B2
Authority
JP
Japan
Prior art keywords
film
bonding
frame
semiconductor
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54013354A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55107238A (en
Inventor
Hiroshi Kato
Masamichi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1335479A priority Critical patent/JPS55107238A/ja
Publication of JPS55107238A publication Critical patent/JPS55107238A/ja
Publication of JPS6153851B2 publication Critical patent/JPS6153851B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W20/40—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/07336—
    • H10W72/322—
    • H10W72/352—
    • H10W72/59—
    • H10W90/736—

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP1335479A 1979-02-09 1979-02-09 Semiconductor device and method of manufacturing the same Granted JPS55107238A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1335479A JPS55107238A (en) 1979-02-09 1979-02-09 Semiconductor device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1335479A JPS55107238A (en) 1979-02-09 1979-02-09 Semiconductor device and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPS55107238A JPS55107238A (en) 1980-08-16
JPS6153851B2 true JPS6153851B2 (cg-RX-API-DMAC10.html) 1986-11-19

Family

ID=11830759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1335479A Granted JPS55107238A (en) 1979-02-09 1979-02-09 Semiconductor device and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JPS55107238A (cg-RX-API-DMAC10.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768040A (en) * 1980-10-15 1982-04-26 Hitachi Ltd Electrode structure for semiconductor device
JPS57210637A (en) * 1981-06-18 1982-12-24 Mitsubishi Electric Corp Semiconductor device
JPS59193036A (ja) * 1983-04-16 1984-11-01 Toshiba Corp 半導体装置の製造方法
US5288456A (en) * 1993-02-23 1994-02-22 International Business Machines Corporation Compound with room temperature electrical resistivity comparable to that of elemental copper
JP2007109829A (ja) * 2005-10-12 2007-04-26 Dowa Holdings Co Ltd 半田接合形成方法
US9214442B2 (en) * 2007-03-19 2015-12-15 Infineon Technologies Ag Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip
JP6046010B2 (ja) * 2013-09-09 2016-12-14 株式会社東芝 半導体装置及びその製造方法
JP6477517B2 (ja) * 2016-01-20 2019-03-06 トヨタ自動車株式会社 半導体装置の製造方法
JP6507120B2 (ja) * 2016-03-31 2019-04-24 Ｊｘ金属株式会社 基材との接合面が表面処理された半導体、および銅粉ペーストによる接合方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS527675A (en) * 1975-07-09 1977-01-20 Hitachi Ltd Semiconductor device
JPS5353256A (en) * 1976-10-25 1978-05-15 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
JPS55107238A (en) 1980-08-16

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