JPS6152000A - フラットパッケージ形半導体素子のはんだ付け方法 - Google Patents
フラットパッケージ形半導体素子のはんだ付け方法Info
- Publication number
- JPS6152000A JPS6152000A JP17337484A JP17337484A JPS6152000A JP S6152000 A JPS6152000 A JP S6152000A JP 17337484 A JP17337484 A JP 17337484A JP 17337484 A JP17337484 A JP 17337484A JP S6152000 A JPS6152000 A JP S6152000A
- Authority
- JP
- Japan
- Prior art keywords
- flat package
- semiconductor element
- lead
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 18
- 239000004065 semiconductor Substances 0.000 title claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 13
- 230000004907 flux Effects 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 210000000078 claw Anatomy 0.000 description 11
- 238000003825 pressing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 235000014121 butter Nutrition 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17337484A JPS6152000A (ja) | 1984-08-22 | 1984-08-22 | フラットパッケージ形半導体素子のはんだ付け方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17337484A JPS6152000A (ja) | 1984-08-22 | 1984-08-22 | フラットパッケージ形半導体素子のはんだ付け方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6152000A true JPS6152000A (ja) | 1986-03-14 |
| JPH0423838B2 JPH0423838B2 (enrdf_load_stackoverflow) | 1992-04-23 |
Family
ID=15959203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17337484A Granted JPS6152000A (ja) | 1984-08-22 | 1984-08-22 | フラットパッケージ形半導体素子のはんだ付け方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6152000A (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5567190A (en) * | 1978-11-15 | 1980-05-21 | Matsushita Electric Works Ltd | Soldering method |
| JPS5983079U (ja) * | 1982-11-26 | 1984-06-05 | 株式会社東芝 | フラツトパツクｉｃリフロ−はんだ付装置 |
-
1984
- 1984-08-22 JP JP17337484A patent/JPS6152000A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5567190A (en) * | 1978-11-15 | 1980-05-21 | Matsushita Electric Works Ltd | Soldering method |
| JPS5983079U (ja) * | 1982-11-26 | 1984-06-05 | 株式会社東芝 | フラツトパツクｉｃリフロ−はんだ付装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423838B2 (enrdf_load_stackoverflow) | 1992-04-23 |
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