JPS6151772U - - Google Patents
Info
- Publication number
- JPS6151772U JPS6151772U JP13530184U JP13530184U JPS6151772U JP S6151772 U JPS6151772 U JP S6151772U JP 13530184 U JP13530184 U JP 13530184U JP 13530184 U JP13530184 U JP 13530184U JP S6151772 U JPS6151772 U JP S6151772U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- hole
- solder
- connection structure
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000000295 complement effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を示す分解斜視図、
第２図は第１図のものを重合した場合を示す平面
図、第３図は第２図の−線に沿つた断面図、
第４図ないし第５図は各々本考案の使用例を示す
説明図である。
１，３１…一方のフレキシブル回路基板、２，
４１…他方の硬質回路基板、１１Ａ…ハンダ充填
用貫孔、１２…一方のフレキシブル回路基板にお
けるリードランド、２１Ａ…ガス逃げ用貫孔、２
２…他方のフレキシブル回路基板におけるリード
ランド、２２Ａ…ガス逃げ用ガイド溝。
FIG. 1 is an exploded perspective view showing an embodiment of the present invention;
FIG. 2 is a plan view showing the case of superimposing the one in FIG. 1, FIG. 3 is a cross-sectional view along the - line in FIG.
4 and 5 are explanatory diagrams each showing an example of use of the present invention. 1, 31... One flexible circuit board, 2,
41...Other rigid circuit board, 11A...Through hole for solder filling, 12...Lead land on one flexible circuit board, 21A...Through hole for gas escape, 2
2... Lead land on the other flexible circuit board, 22A... Guide groove for gas escape.
Claims (1)
もしくはフレキシブル回路基板にハンダ接続して
なる回路基板の接続構造において、 前記一方のフレキシブル回路基板におけるハン
ダ接続用リードランドの中央部に、ハンダ充填用
の貫孔を設け、これに対応する他方の回路基板の
ハンダ接続用リードランドには、中心部にガス逃
げ用の貫通を設けるとともに該貫孔から外方に向
けて放射状に補数のガス逃げ用ガイド溝を延設し
、 前記一方と他方の各リードランドを重合したの
ち各ハンダ用貫孔にハンダを充填し回路基板を相
互に接続したことを特徴とする回路基板の接続構
造。 (2) 前記一方と他方の各リードランドの形状を
角型に形成したことを特徴とする実用新案登録請
求の範囲第１項記載の回路基板の接続構造。 (3) 前記一方と他方の各リードランドの形状を
長円形状としたことを特徴とする実用新案登録請
求の範囲第１項記載の回路基板の接続構造。 (4) 前記一方と他方の各リードランドの組が千
鳥足状に複数組配列されていることを特徴とした
実用新案登録請求の範囲第１項記載の回路基板の
接続構造。[Claims for Utility Model Registration] (1) In a circuit board connection structure in which one flexible circuit board is soldered to another rigid or flexible circuit board, a lead land for solder connection on the one flexible circuit board A through hole for filling solder is provided in the center, and a corresponding lead land for solder connection on the other circuit board is provided with a through hole in the center for gas escape, and a through hole is provided outward from the through hole. A circuit board characterized in that complementary gas escape guide grooves are extended radially, and after each lead land on the one side and the other side are overlapped, each solder through hole is filled with solder to connect the circuit boards to each other. connection structure. (2) The circuit board connection structure according to claim 1, wherein each of the one and the other lead lands is formed into a square shape. (3) The circuit board connection structure according to claim 1, wherein each of the one and the other lead lands has an oval shape. (4) The circuit board connection structure according to claim 1, wherein a plurality of pairs of lead lands on the one side and the other side are arranged in a staggered pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13530184U JPS6151772U (en) | 1984-09-06 | 1984-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13530184U JPS6151772U (en) | 1984-09-06 | 1984-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6151772U true JPS6151772U (en) | 1986-04-07 |
Family
ID=30693794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13530184U Pending JPS6151772U (en) | 1984-09-06 | 1984-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6151772U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5783093A (en) * | 1980-11-12 | 1982-05-24 | Matsushita Electric Ind Co Ltd | Method of connecting flexible printed circit board |
| JPS5844607U (en) * | 1981-09-11 | 1983-03-25 | 名張近鉄ガス株式会社 | pressure control device |
| JPS5918469B2 (en) * | 1980-08-21 | 1984-04-27 | 株式会社神戸製鋼所 | Method for producing aluminum alloy plate with excellent bright alumite properties and strength |
-
1984
- 1984-09-06 JP JP13530184U patent/JPS6151772U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5918469B2 (en) * | 1980-08-21 | 1984-04-27 | 株式会社神戸製鋼所 | Method for producing aluminum alloy plate with excellent bright alumite properties and strength |
| JPS5783093A (en) * | 1980-11-12 | 1982-05-24 | Matsushita Electric Ind Co Ltd | Method of connecting flexible printed circit board |
| JPS5844607U (en) * | 1981-09-11 | 1983-03-25 | 名張近鉄ガス株式会社 | pressure control device |