JPS62151779U - - Google Patents
Info
- Publication number
- JPS62151779U JPS62151779U JP4004886U JP4004886U JPS62151779U JP S62151779 U JPS62151779 U JP S62151779U JP 4004886 U JP4004886 U JP 4004886U JP 4004886 U JP4004886 U JP 4004886U JP S62151779 U JPS62151779 U JP S62151779U
- Authority
- JP
- Japan
- Prior art keywords
- board
- soldering
- holes
- lands
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 12
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案による基板の接続構造の接続前
の上面図、第２図は接続直前の接続部の斜視図、
第３図は接続後の接続部の断面図、第４図は従来
の方法で接続されたＰＷＢの斜視図である。
１，３……リジツトＰＷＢ、２……可撓性ＰＷ
Ｂ、４……半田付け用ランド、５……半田付け孔
、６……リード端子、７，７′……半田付け、８
……リード端子固定用テープ。
FIG. 1 is a top view of the board connection structure according to the present invention before connection, FIG. 2 is a perspective view of the connection part immediately before connection,
FIG. 3 is a sectional view of the connecting portion after connection, and FIG. 4 is a perspective view of the PWB connected by the conventional method. 1, 3...Rigid PWB, 2...Flexible PW
B, 4... Soldering land, 5... Soldering hole, 6... Lead terminal, 7, 7'... Soldering, 8
...Tape for fixing lead terminals.
Claims (1)
された複数の半田付け孔を有する第１の基板、 (b) 該第１の基板と同数の複数の半田付け孔を
有し、該半田付け孔を第１の基板の半田付け孔に
重ね合せ、それらが互いに合致する状態に配置さ
れる第２の基板、および (c) 上記第１の基板の半田付け孔および第２の
基板の半田付け孔に挿入され、上記第１の基板の
ランドおよび第２の基板のランドに半田付けで固
定される複数のリード端子。 を含むことを特徴とする基板の接続構造。[Claims for Utility Model Registration] (a) A first board having a plurality of soldering holes arranged in parallel at the end and having soldering lands formed therein; (b) A plurality of the same number as the first board. (c) a second board having a soldering hole of the first board, the soldering hole of the first board overlapping the soldering hole of the first board, and arranged so that the soldering holes of the first board match each other; A plurality of lead terminals are inserted into the soldering holes and the soldering holes of the second board, and are fixed to the lands of the first board and the lands of the second board by soldering. A board connection structure characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4004886U JPS62151779U (en) | 1986-03-18 | 1986-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4004886U JPS62151779U (en) | 1986-03-18 | 1986-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62151779U true JPS62151779U (en) | 1987-09-26 |
Family
ID=30853786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4004886U Pending JPS62151779U (en) | 1986-03-18 | 1986-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62151779U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003100108A (en) * | 2001-09-20 | 2003-04-04 | Matsushita Electric Ind Co Ltd | Light emitting unit, structural body combined with it, and lighting system |
-
1986
- 1986-03-18 JP JP4004886U patent/JPS62151779U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003100108A (en) * | 2001-09-20 | 2003-04-04 | Matsushita Electric Ind Co Ltd | Light emitting unit, structural body combined with it, and lighting system |