JPS6149097B2 - - Google Patents
Info
- Publication number
- JPS6149097B2 JPS6149097B2 JP4524982A JP4524982A JPS6149097B2 JP S6149097 B2 JPS6149097 B2 JP S6149097B2 JP 4524982 A JP4524982 A JP 4524982A JP 4524982 A JP4524982 A JP 4524982A JP S6149097 B2 JPS6149097 B2 JP S6149097B2
- Authority
- JP
- Japan
- Prior art keywords
- polyamic acid
- bpda
- organic polar
- acid solution
- polar solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005575 poly(amic acid) Polymers 0.000 claims description 15
- 229920001721 polyimide Polymers 0.000 claims description 11
- 239000002798 polar solvent Substances 0.000 claims description 9
- 150000004984 aromatic diamines Chemical class 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 6
- 239000002243 precursor Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 claims description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 2
- 238000006358 imidation reaction Methods 0.000 claims 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 7
- -1 polyethylene Polymers 0.000 description 5
- 239000009719 polyimide resin Substances 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011162 core material Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- DZLUPKIRNOCKJB-UHFFFAOYSA-N 2-methoxy-n,n-dimethylacetamide Chemical compound COCC(=O)N(C)C DZLUPKIRNOCKJB-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- UDKYPBUWOIPGDY-UHFFFAOYSA-N 3-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=CC(N)=C1 UDKYPBUWOIPGDY-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- GOGZBMRXLADNEV-UHFFFAOYSA-N naphthalene-2,6-diamine Chemical compound C1=C(N)C=CC2=CC(N)=CC=C21 GOGZBMRXLADNEV-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Moulding By Coating Moulds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4524982A JPS58162635A (ja) | 1982-03-19 | 1982-03-19 | ポリイミドチユ−ブの製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4524982A JPS58162635A (ja) | 1982-03-19 | 1982-03-19 | ポリイミドチユ−ブの製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58162635A JPS58162635A (ja) | 1983-09-27 |
| JPS6149097B2 true JPS6149097B2 (enrdf_load_stackoverflow) | 1986-10-28 |
Family
ID=12713987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4524982A Granted JPS58162635A (ja) | 1982-03-19 | 1982-03-19 | ポリイミドチユ−ブの製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58162635A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS627733A (ja) * | 1985-03-10 | 1987-01-14 | Nitto Electric Ind Co Ltd | 無色透明なポリイミド成形体およびその製法 |
| JPH0694509B2 (ja) * | 1986-05-08 | 1994-11-24 | 宇部興産株式会社 | ポリイミド樹脂環状体 |
| JPH08225645A (ja) * | 1995-12-18 | 1996-09-03 | Nitto Denko Corp | 無色透明なポリイミド成形体およびその製法 |
| US20110124806A1 (en) * | 2009-11-20 | 2011-05-26 | E.I. Du Pont De Nemours And Company | Dimensionally stable polyimides, and methods relating thereto |
-
1982
- 1982-03-19 JP JP4524982A patent/JPS58162635A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58162635A (ja) | 1983-09-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6410716B2 (ja) | 絶縁被覆材料及びその利用 | |
| JP3968835B2 (ja) | シロキサンポリイミドを含有する耐熱性接着剤 | |
| JP6235787B2 (ja) | 高周波回路基板用カバーレイ | |
| US4381210A (en) | Process for producing polyimide tubes | |
| US4347286A (en) | Heat fusible polyimide compound films and process for producing the same | |
| JPS6149097B2 (enrdf_load_stackoverflow) | ||
| KR19980079256A (ko) | 폴리이미드 전구체 용액, 이의 제조방법, 이러한 용액으로부터 수득한 피막 또는 필름 및 필름의 제조방법 | |
| EP0456515A1 (en) | Polyimides and thermosetting resin compositions containing the same | |
| JP2023079202A (ja) | ポリイミド系樹脂前駆体 | |
| JPH1174066A (ja) | スパイラル管状ヒーターおよびその製造方法 | |
| JPS61273806A (ja) | 絶縁被覆電線 | |
| JP2938227B2 (ja) | ポリアミック酸樹脂 | |
| JPH08217877A (ja) | ポリイミド樹脂及びポリイミドフィルム | |
| JP3058198B2 (ja) | ポリイミド積層体 | |
| JP2000208563A (ja) | フィルムキャリアテ―プ | |
| JPS6253827A (ja) | 金属ベ−スプリント配線基板及びその製造方法 | |
| JP3714435B2 (ja) | 耐熱性樹脂組成物とそれを用いた接着シート | |
| JP2005146170A (ja) | 樹脂組成物及び金属積層体 | |
| JP2005146074A (ja) | ポリアミド酸、ポリアミド組成物及びポリイミド | |
| JP3758336B2 (ja) | スパイラル管状ヒ−タ− | |
| JP3090348B2 (ja) | テープ巻き絶縁電線の製造方法 | |
| JPH01309207A (ja) | 絶縁材被覆電線 | |
| JP4574160B2 (ja) | 接着性に優れたポリイミド及び高濃度ポリアミド酸組成物 | |
| JP2977958B2 (ja) | フレキシブルプリント基板用ポリアミック酸樹脂 | |
| JPH04351548A (ja) | ポリイミド積層体及び該積層体で絶縁されたケーブル |