JPS6145716B2 - - Google Patents
Info
- Publication number
- JPS6145716B2 JPS6145716B2 JP20503681A JP20503681A JPS6145716B2 JP S6145716 B2 JPS6145716 B2 JP S6145716B2 JP 20503681 A JP20503681 A JP 20503681A JP 20503681 A JP20503681 A JP 20503681A JP S6145716 B2 JPS6145716 B2 JP S6145716B2
- Authority
- JP
- Japan
- Prior art keywords
- flow rate
- plating
- plating liquid
- nozzle
- flow path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 104
- 239000007788 liquid Substances 0.000 claims description 57
- 239000000463 material Substances 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 3
- 238000012545 processing Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20503681A JPS58107493A (ja) | 1981-12-18 | 1981-12-18 | メツキ液流速調整式部分メツキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20503681A JPS58107493A (ja) | 1981-12-18 | 1981-12-18 | メツキ液流速調整式部分メツキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58107493A JPS58107493A (ja) | 1983-06-27 |
| JPS6145716B2 true JPS6145716B2 (enExample) | 1986-10-09 |
Family
ID=16500377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20503681A Granted JPS58107493A (ja) | 1981-12-18 | 1981-12-18 | メツキ液流速調整式部分メツキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58107493A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6331008A (ja) * | 1986-07-25 | 1988-02-09 | Canon Inc | 磁気ヘツド |
-
1981
- 1981-12-18 JP JP20503681A patent/JPS58107493A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6331008A (ja) * | 1986-07-25 | 1988-02-09 | Canon Inc | 磁気ヘツド |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58107493A (ja) | 1983-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4348267A (en) | Plating means | |
| JPS6145716B2 (enExample) | ||
| US4483749A (en) | Method and apparatus for plating minute parts | |
| JP3278664B2 (ja) | カーテンファイバー状スプレー塗布装置における塗布ノズル装置 | |
| US5211339A (en) | Apparatus for dispersing and directing dye onto a substrate | |
| JP2002129381A (ja) | メッキ装置の流量調整可能なメッキ液噴出ノズルシステム | |
| JPH01242796A (ja) | 特定ゾーン・メッキのための選択メッキ装置及び方法 | |
| EP0055316B1 (en) | A plating apparatus | |
| CN212270255U (zh) | 一种旋转轮、电镀喷药水机构及旋转电镀装置 | |
| KR101420780B1 (ko) | 드럼 회전방식을 이용한 커넥터핀의 도금회수용 박리액 분사장치 및 박리액 분사방법 | |
| JPS6214235B2 (enExample) | ||
| KR101362265B1 (ko) | 드럼 회전방식을 이용한 입체형 커넥터핀의 부분 전기 도금장치 | |
| JPS61104625A (ja) | プラズマ処理装置 | |
| JP3468164B2 (ja) | フープ材の部分メッキ装置 | |
| KR200155950Y1 (ko) | 스트립 냉각 장치와 일체화된 스트리퍼 베이스 | |
| CN221626376U (zh) | 一种ald设备的载具结构 | |
| JP2006225677A (ja) | 連続部分めっき装置 | |
| JPS6145161Y2 (enExample) | ||
| JPS596918B2 (ja) | 部分メッキ装置 | |
| JPH0466691A (ja) | 両面部分メッキ装置 | |
| JPH03134196A (ja) | リードフレームのめっき装置 | |
| JP2844054B2 (ja) | ノズル体 | |
| JPH0248129A (ja) | 加工装置 | |
| JP3339927B2 (ja) | 部分めっき装置 | |
| JPS596920B2 (ja) | マルチ方式の部分メッキ装置 |