JPS6144637A - 不飽和ポリエステル金属箔張り積層板の製造法 - Google Patents
不飽和ポリエステル金属箔張り積層板の製造法Info
- Publication number
- JPS6144637A JPS6144637A JP59166779A JP16677984A JPS6144637A JP S6144637 A JPS6144637 A JP S6144637A JP 59166779 A JP59166779 A JP 59166779A JP 16677984 A JP16677984 A JP 16677984A JP S6144637 A JPS6144637 A JP S6144637A
- Authority
- JP
- Japan
- Prior art keywords
- unsaturated polyester
- polyester resin
- base material
- impregnation
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229920006305 unsaturated polyester Polymers 0.000 title description 2
- 238000005470 impregnation Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 4
- 238000010924 continuous production Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000123 paper Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000011437 continuous method Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59166779A JPS6144637A (ja) | 1984-08-08 | 1984-08-08 | 不飽和ポリエステル金属箔張り積層板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59166779A JPS6144637A (ja) | 1984-08-08 | 1984-08-08 | 不飽和ポリエステル金属箔張り積層板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6144637A true JPS6144637A (ja) | 1986-03-04 |
| JPH0234310B2 JPH0234310B2 (enrdf_load_stackoverflow) | 1990-08-02 |
Family
ID=15837523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59166779A Granted JPS6144637A (ja) | 1984-08-08 | 1984-08-08 | 不飽和ポリエステル金属箔張り積層板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144637A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0295296U (enrdf_load_stackoverflow) * | 1989-01-17 | 1990-07-30 | ||
| US4958099A (en) * | 1987-09-03 | 1990-09-18 | Canon Kabushiki Kaisha | Brushless motor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5036464A (enrdf_load_stackoverflow) * | 1973-06-26 | 1975-04-05 | ||
| JPS5613136A (en) * | 1979-07-13 | 1981-02-09 | Kanegafuchi Chem Ind Co Ltd | Manufacture of laminated plate and apparatus for continuously manufacturing the same |
| JPS5698136A (en) * | 1980-01-08 | 1981-08-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminated substance |
-
1984
- 1984-08-08 JP JP59166779A patent/JPS6144637A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5036464A (enrdf_load_stackoverflow) * | 1973-06-26 | 1975-04-05 | ||
| JPS5613136A (en) * | 1979-07-13 | 1981-02-09 | Kanegafuchi Chem Ind Co Ltd | Manufacture of laminated plate and apparatus for continuously manufacturing the same |
| JPS5698136A (en) * | 1980-01-08 | 1981-08-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminated substance |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4958099A (en) * | 1987-09-03 | 1990-09-18 | Canon Kabushiki Kaisha | Brushless motor |
| JPH0295296U (enrdf_load_stackoverflow) * | 1989-01-17 | 1990-07-30 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0234310B2 (enrdf_load_stackoverflow) | 1990-08-02 |
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