JPS6144637A - Manufacture of unsaturated polyester metallic-foil lined laminated board - Google Patents

Manufacture of unsaturated polyester metallic-foil lined laminated board

Info

Publication number
JPS6144637A
JPS6144637A JP59166779A JP16677984A JPS6144637A JP S6144637 A JPS6144637 A JP S6144637A JP 59166779 A JP59166779 A JP 59166779A JP 16677984 A JP16677984 A JP 16677984A JP S6144637 A JPS6144637 A JP S6144637A
Authority
JP
Japan
Prior art keywords
unsaturated polyester
polyester resin
base material
impregnation
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59166779A
Other languages
Japanese (ja)
Other versions
JPH0234310B2 (en
Inventor
誠一 森
八洲男 伏木
大泉 正征
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP59166779A priority Critical patent/JPS6144637A/en
Publication of JPS6144637A publication Critical patent/JPS6144637A/en
Publication of JPH0234310B2 publication Critical patent/JPH0234310B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 技1υ辷賄 本発明は印刷回路基板として使用する、不飽和ポリエス
テル樹脂を使用した金属箔張り積層板の製造法に関する
DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a method for manufacturing a metal foil laminate using unsaturated polyester resin for use as a printed circuit board.

宜量肢止友孟互1五立 紙やガラスクロ゛ス、ガラスペーパー等を基材とし、こ
れに樹脂液を含浸した複数枚の樹脂含浸基材を積層し、
硬化させてなる積層板、および該積層板の片面または両
面に金属箔を張り合わせてなる金属箔張り積層板は絶縁
板やプリント配線用基板として使用されている。
1. The base material is paper, glass cloth, glass paper, etc., and multiple sheets of resin-impregnated base material impregnated with resin liquid are laminated,
A hardened laminate and a metal foil-covered laminate formed by laminating metal foil on one or both sides of the laminate are used as insulating plates and printed wiring boards.

従来これら積層板は基材に樹脂ワニスを含浸し、乾燥し
て得られるブリプレノブを重ねてプレスで加圧加熱して
成形するバッチ式製造法によって製造されていたが、最
近長尺の基材を連続的に1股送しながら樹脂の含浸、積
層、硬化等を行う連続式方法が開発され、注目されてい
る一′例えば本出願人による特開昭55−4838、同
5s=9at36号等参照。
Conventionally, these laminates were manufactured using a batch method in which the base material was impregnated with resin varnish and dried, then the resulting briple knobs were layered and formed by pressurizing and heating in a press, but recently, long base materials have been A continuous method in which resin impregnation, lamination, curing, etc. are carried out while continuously transporting the resin in one step has been developed and is attracting attention. .

連続法によって製造した紙JJ5材不飽和ポリエスチル
樹脂銅張積層板は、本出願人によって「エフセライト」
なる商標名のちとに市販されており、従来の紙フエノー
ル樹脂銅張積層板に比較してすぐれた多数の特徴のため
に主として民生用電気製品に広く使用されている。
The paper JJ5 material unsaturated polyester resin copper clad laminate manufactured by the continuous method is named "Fcelite" by the applicant.
It is commercially available under the trade name ``Paper Phenolic Copper Clad Laminates'' and is widely used primarily in consumer electronics products due to its many superior features compared to conventional paper phenolic resin copper clad laminates.

近年これら民生用電気製品に使用する印刷回路基板は、
その加工工程の自動化および基板への部品挿入の自動化
の普及により、その反りに対する許容値の限界がますま
す厳しくなっており、より反り量の少ない製品を供給す
ることが望まれている。
In recent years, the printed circuit boards used in these consumer electronic products are
With the spread of automation of the processing process and the automation of parts insertion into the board, the limits of the allowable value for warpage are becoming increasingly strict, and it is desired to supply products with even less warpage.

本発明はこのような状況の中で、より改良された反り特
性を有する製品を提供するものである。
Under these circumstances, the present invention provides a product with improved warpage characteristics.

■次1跋 連続法によって製造された金属箔張り積層板の反りは、
含浸後硬化前の基材層中に存在する未硬化状態の不飽和
ポリエステル樹脂の含水率に関係があることがわかった
。すなわちこの時の樹脂の含水率が一定値以下であると
製品の反り量が増加し、またあまり過剰であると製品の
他の特性、例えば曲げ強度を低下させる。
■The warpage of metal foil-clad laminates manufactured by the following continuous method is as follows:
It was found that there is a relationship with the water content of the uncured unsaturated polyester resin present in the base material layer after impregnation and before curing. That is, if the water content of the resin at this time is below a certain value, the amount of warpage of the product will increase, and if it is too excessive, other properties of the product, such as bending strength, will be reduced.

従って本発明は、複数枚のシート状基材を連続的に搬送
しながら、該基材を液状不飽和ポリエステル樹脂で含浸
し、複数枚の含浸した基材を合体し、合体した基材の少
なくとも片面に金属箔をラミネートし、次いで全体を硬
化する連続工程を含む、金属箔張り積層板の連続製造法
において、含浸後硬化前の基材層にある不飽和ポリエス
テル樹脂の水分を200ないし2000ppmの範囲に
調節することを特徴とする。
Therefore, the present invention impregnates a plurality of sheet-like substrates with a liquid unsaturated polyester resin while continuously conveying the substrates, combines the plurality of impregnated substrates, and at least In a continuous manufacturing method for metal foil-clad laminates, which includes a continuous process of laminating metal foil on one side and then curing the entire board, the water content of the unsaturated polyester resin in the base material layer after impregnation and before curing is reduced to 200 to 2000 ppm. It is characterized by being adjustable within a range.

より好ましい前記水分範囲は、500ないし1000p
p+aの範囲である。
The moisture range is more preferably 500 to 1000p.
The range is p+a.

−しい  嘘 のB 図面は本発明方法を実施して片面金属箔張り積層板を製
造するための装置の一例の概略側面図である。
The drawing is a schematic side view of an example of an apparatus for manufacturing a single-sided metal foil-clad laminate by carrying out the method of the present invention.

ロール1に巻かれた基材、例え′1ヨセルロース繊維か
らなるクラフト紙2は連続的に搬送されて予備処理室3
に入る。図面では3枚の基材が同時に搬送されるように
示されているが、積層板の最終厚みに応じて基材の枚数
は適宜増減し得ることは勿論である。基材2は次に樹脂
液含浸室4へ入り、樹脂液を含浸され、一対のスクイ−
グロール5.5間を通過して合体される。その際ロール
7から繰り出された金属箔8が接着剤を塗布されて含浸
基材の積層物の上面にラミネートされ、また積層物の下
面にはロール9から繰り出されたキャリヤシート10、
例えばポリエステルフィルムがロール5によって張り合
わされる。このようにして得られる未硬化の状態にある
積層板は硬化炉12へ入り、その中を進行する間に加熱
されて硬化を受ける。硬化炉12を出た積層板14から
は下面のキャリヤシート10がロニル13によって剥離
され、ロール11として巻き取られる。次に積層板14
はロータリーカッター18によって両耳端部をトリミン
グされ、ギロチンカッター19によって所要長さに切断
される。この装置のこれまでの部分は先に引用した本出
願人の特開昭55−4838号、同56−98136号
に開示したものと実質的に同じである。
A base material 2, for example kraft paper 2 made of cellulose fiber, wound around a roll 1 is continuously conveyed to a pretreatment chamber 3.
to go into. In the drawing, three substrates are shown to be conveyed at the same time, but it goes without saying that the number of substrates can be increased or decreased as appropriate depending on the final thickness of the laminate. The base material 2 then enters the resin liquid impregnation chamber 4, where it is impregnated with resin liquid, and is placed between a pair of squeegees.
It passes between Growl 5.5 and is combined. At this time, the metal foil 8 fed out from the roll 7 is coated with adhesive and laminated on the top surface of the laminate of impregnated base materials, and the carrier sheet 10 fed out from the roll 9 is placed on the bottom surface of the laminate.
For example, polyester films are laminated together by rolls 5. The thus obtained uncured laminate enters the curing furnace 12, where it is heated and cured while traveling therein. The lower carrier sheet 10 is peeled off from the laminate 14 leaving the curing furnace 12 by a Ronil 13 and wound up as a roll 11. Next, the laminate 14
The ends of both ears are trimmed by a rotary cutter 18, and the cutter is cut to a required length by a guillotine cutter 19. The previous portions of this device are substantially the same as those disclosed in Japanese Patent Application Laid-Open Nos. 55-4838 and 56-98136, both of which were previously cited.

本発明でいう「含浸後硬化前の基材層」とは、図面では
含浸室4からロール5,5に至る間の搬送下にある基材
層2を指す。この間の基材層にある樹脂の水分を200
ないし2000ppm、好ましくは500ないし110
00ppの範囲内に調節するためには、含浸室4へ供給
させる樹脂液が既に持っている水分含量に応じ、含浸室
を給湿または除湿し、基材層が該室内を進行する間に該
室内の湿度と樹脂の含水率との間に平衡状態が確立され
るようにすればよい。
In the present invention, the term "substrate layer after impregnation and before curing" refers to the substrate layer 2 that is being transported from the impregnation chamber 4 to the rolls 5, 5 in the drawings. The moisture content of the resin in the base material layer between these layers is reduced to 200%.
from 2000 ppm, preferably from 500 to 110
In order to adjust the moisture content within the range of 0.00 pp, the impregnation chamber is humidified or dehumidified depending on the water content already contained in the resin liquid supplied to the impregnation chamber 4, and the moisture content is increased while the base material layer advances through the chamber. An equilibrium state may be established between the humidity in the room and the moisture content of the resin.

しかしながら一般には、本出願人の特開昭56−131
36号に開示されているように、含浸室へ供給される樹
脂液は製品中の微細な気泡の発生を排除するため減圧で
脱気処理されるから、溶存気体が除去されるのと同時に
水分も除去されている。従って含浸室4内を給湿し、含
浸直後の基材層にある樹脂液が水分を吸収し、菊記水分
範囲で平衡に達するように含浸室内の相対湿度を調節す
ればよい。これにより含浸室4からロール5,5まで進
行する間、基材層にある樹脂の含水量は実質上所望の範
囲に保たれる。
However, in general, the present applicant's Japanese Patent Application Laid-Open No. 56-131
As disclosed in No. 36, the resin liquid supplied to the impregnation chamber is degassed under reduced pressure to eliminate the generation of fine bubbles in the product, so dissolved gas is removed and moisture is removed at the same time. has also been removed. Therefore, the relative humidity in the impregnation chamber 4 may be adjusted so that the inside of the impregnation chamber 4 is humidified and the resin liquid in the base material layer immediately after impregnation absorbs moisture and reaches an equilibrium within the moisture range. As a result, the water content of the resin in the base layer is maintained substantially within the desired range during the progress from the impregnation chamber 4 to the rolls 5,5.

この時の樹脂の含水率があまり低ければ製品の反りが許
容値以上となり、反対に高過ぎると製品の強度に悪影響
があり、従って製品の反りを許容値以内とし、強度を低
下させないためには、前記含水率が前記範囲内になけれ
ばならないことがわかった。
If the moisture content of the resin is too low, the warpage of the product will exceed the allowable value; on the other hand, if it is too high, the strength of the product will be adversely affected. It has been found that the moisture content must be within the range.

実施例 市販不飽和ポリエステル(ポリマール3311.武田薬
品製)100重量部にクメンノ1イドロノく−オキサイ
ド1重量部、6%ナフテン酸コバルト0.2重量部から
なる不飽和ポリエステル樹脂液を調製した。
EXAMPLE An unsaturated polyester resin liquid was prepared consisting of 100 parts by weight of a commercially available unsaturated polyester (Polymer 3311, manufactured by Takeda Pharmaceutical Co., Ltd.), 1 part by weight of cumenohydronoxoxide, and 0.2 parts by weight of 6% cobalt naphthenate.

図面に示したような装置を用い、予備処理室3内におい
てメラミン樹脂で予備処理したクラスト紙(両隅国策パ
ルプZ13S−135,10ミル)5枚に上記樹脂液を
含浸室4内において含浸し、スクイ−グロール5,5間
に供給して合体し、同時にエポキシ系接着剤を塗布され
た銅箔を上面にラミネートし、下面にキャリアシートと
してポリエステルフィルムを張合わせ、硬化炉12内に
おいて110℃で30分間、さらに150℃で15分間
の硬化を行い、厚さ1.6111の片面銅箔張り積層板
を得た。
Using the apparatus shown in the drawing, five sheets of crust paper (Ryosumi Kokusaku Pulp Z13S-135, 10 mil), which had been pretreated with melamine resin in the pretreatment chamber 3, were impregnated with the resin liquid in the impregnation chamber 4. , a copper foil coated with an epoxy adhesive is laminated on the upper surface, a polyester film is laminated as a carrier sheet on the lower surface, and the mixture is heated in a curing furnace 12 at 110°C. The mixture was cured for 30 minutes at 150° C. and then for 15 minutes at 150° C. to obtain a single-sided copper foil-clad laminate having a thickness of 1.6111 mm.

その際含浸室4内を温度40℃、相対湿度95%に保ち
、含浸室を出た直後品基材層中の樹脂液の水分を800
ppmに調節した。
At this time, the temperature inside the impregnation chamber 4 is maintained at 40°C and the relative humidity is 95%, and the moisture content of the resin liquid in the product base material layer is reduced to 800% immediately after leaving the impregnation chamber.
Adjusted to ppm.

得られた積層板を縦300n、横240 m+*に切断
し、40℃で85%RHの恒温恒湿室内に4日間放置後
、凸面を下にして定盤上に置き、四隅の高さを測定し、
その平均値を反り量とした。
The obtained laminate was cut into a length of 300 nm and a width of 240 m+*, and after being left in a constant temperature and humidity room at 40°C and 85% RH for 4 days, it was placed on a surface plate with the convex side facing down, and the height of the four corners was adjusted. measure,
The average value was taken as the amount of warpage.

含浸後硬化前の基材層にある樹脂の水分が前記範囲内に
あるものの反り量は−1,5mm(金属箔面を内側にし
て凹)であるのに対し、該水分が200 ppm以下の
ものの反り量は−3,0mmであった。
When the moisture content of the resin in the base material layer after impregnation and before curing is within the above range, the amount of warpage is -1.5 mm (concave with the metal foil surface inside), whereas when the moisture content is 200 ppm or less, The amount of warpage of the product was -3.0 mm.

また本発明による前記積層板の曲げ強度は17に+r/
−であったが、前記水分が2QOOppm以上になると
、曲げ強度が14 kg / −′に低下し、また硬化
時水分の蒸発によって発生したものと思われる微細な気
泡を含んでいた。
Further, the bending strength of the laminate according to the present invention is 17+r/
- However, when the water content exceeded 2 QOOppm, the bending strength decreased to 14 kg/-' and contained fine bubbles, which were thought to be caused by evaporation of water during curing.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本発明を実施するための装置の概略図である。 2は基材、4は含浸室、5はラミネートロール、8は金
属箔、10はキャリヤシート、12は硬化室である。
The drawing is a schematic diagram of an apparatus for implementing the invention. 2 is a base material, 4 is an impregnating chamber, 5 is a laminating roll, 8 is a metal foil, 10 is a carrier sheet, and 12 is a curing chamber.

Claims (4)

【特許請求の範囲】[Claims] (1)複数枚のシート状基材を連続的に搬送しながら、
該基材を液状不飽和ポリエステル樹脂で含浸し、複数枚
の含浸した基材を合体し、合体した基材の少なくとも片
面に金属箔をラミネートし、次いで全体を硬化する連続
工程を含む、金属箔張り積層板の連続製造法において、
含浸後硬化前の基材層にある不飽和ポリエステル樹脂の
水分を200ないし2000ppmの範囲に調節するこ
とを特徴とする前記方法。
(1) While continuously conveying multiple sheet-like base materials,
A metal foil comprising a continuous process of impregnating the substrate with a liquid unsaturated polyester resin, combining a plurality of impregnated substrates, laminating a metal foil on at least one side of the combined substrate, and then curing the whole. In the continuous manufacturing method of stretched laminates,
The method described above is characterized in that the moisture content of the unsaturated polyester resin in the base material layer after impregnation and before curing is adjusted to a range of 200 to 2000 ppm.
(2)前記不飽和ポリエステル樹脂の水分が500ない
し1000ppmの範囲である第1項の方法。
(2) The method of item 1, wherein the moisture content of the unsaturated polyester resin is in the range of 500 to 1000 ppm.
(3)基材が紙である第1項の方法。(3) The method of item 1, wherein the base material is paper. (4)含浸前の不飽和ポリエステル樹脂が減圧処理され
ている第1項の方法。
(4) The method of item 1, wherein the unsaturated polyester resin is subjected to reduced pressure treatment before impregnation.
JP59166779A 1984-08-08 1984-08-08 Manufacture of unsaturated polyester metallic-foil lined laminated board Granted JPS6144637A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59166779A JPS6144637A (en) 1984-08-08 1984-08-08 Manufacture of unsaturated polyester metallic-foil lined laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59166779A JPS6144637A (en) 1984-08-08 1984-08-08 Manufacture of unsaturated polyester metallic-foil lined laminated board

Publications (2)

Publication Number Publication Date
JPS6144637A true JPS6144637A (en) 1986-03-04
JPH0234310B2 JPH0234310B2 (en) 1990-08-02

Family

ID=15837523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59166779A Granted JPS6144637A (en) 1984-08-08 1984-08-08 Manufacture of unsaturated polyester metallic-foil lined laminated board

Country Status (1)

Country Link
JP (1) JPS6144637A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0295296U (en) * 1989-01-17 1990-07-30
US4958099A (en) * 1987-09-03 1990-09-18 Canon Kabushiki Kaisha Brushless motor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036464A (en) * 1973-06-26 1975-04-05
JPS5613136A (en) * 1979-07-13 1981-02-09 Kanegafuchi Chem Ind Co Ltd Manufacture of laminated plate and apparatus for continuously manufacturing the same
JPS5698136A (en) * 1980-01-08 1981-08-07 Kanegafuchi Chem Ind Co Ltd Continuous manufacture of laminated substance

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036464A (en) * 1973-06-26 1975-04-05
JPS5613136A (en) * 1979-07-13 1981-02-09 Kanegafuchi Chem Ind Co Ltd Manufacture of laminated plate and apparatus for continuously manufacturing the same
JPS5698136A (en) * 1980-01-08 1981-08-07 Kanegafuchi Chem Ind Co Ltd Continuous manufacture of laminated substance

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4958099A (en) * 1987-09-03 1990-09-18 Canon Kabushiki Kaisha Brushless motor
JPH0295296U (en) * 1989-01-17 1990-07-30

Also Published As

Publication number Publication date
JPH0234310B2 (en) 1990-08-02

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