JPH0234310B2 - - Google Patents
Info
- Publication number
- JPH0234310B2 JPH0234310B2 JP59166779A JP16677984A JPH0234310B2 JP H0234310 B2 JPH0234310 B2 JP H0234310B2 JP 59166779 A JP59166779 A JP 59166779A JP 16677984 A JP16677984 A JP 16677984A JP H0234310 B2 JPH0234310 B2 JP H0234310B2
- Authority
- JP
- Japan
- Prior art keywords
- impregnation
- base material
- unsaturated polyester
- resin
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 25
- 238000005470 impregnation Methods 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000000123 paper Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000011437 continuous method Methods 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】
技術分野
本発明は印刷回路基板として使用する、不飽和
ポリエステル樹脂を使用した金属箔張り積層板の
製造法に関する。DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD The present invention relates to a method for manufacturing metal foil laminates using unsaturated polyester resins for use as printed circuit boards.
背景技術および問題点
紙やガラスクロス、ガラスペーパー等を基材と
し、これに樹脂液を含浸した複数枚の樹脂含浸基
材を積層し、硬化させてなる積層板、および該積
層板の片面または両面に金属箔を張り合わせてな
る金属箔張り積層板は絶縁板やプリント配線用基
板として使用されている。BACKGROUND TECHNOLOGY AND PROBLEMS A laminate made of paper, glass cloth, glass paper, etc. as a base material, laminated with a plurality of resin-impregnated base materials impregnated with a resin liquid, and cured; Metal foil laminates, which are made by laminating metal foils on both sides, are used as insulating boards and printed wiring boards.
従来これら積層板は基材に樹脂ワニスを含浸
し、乾燥して得られるプリプレツグを重ねてプレ
スで加圧加熱して成形するバツチ式製造法によつ
て製造されていたが、最近長尺の基材を連続的に
搬送しながら樹脂の含浸、積層、硬化等を行う連
続式方法が開発され、注目されている。例えば本
出願人による特開昭55−4838、同56−98136号等
参照。 Conventionally, these laminates were manufactured using a batch method in which prepregs obtained by impregnating the base material with resin varnish and drying were stacked and molded by pressurizing and heating. A continuous method has been developed that performs resin impregnation, lamination, curing, etc. while continuously conveying materials, and is attracting attention. For example, see Japanese Patent Laid-open Nos. 55-4838 and 56-98136 by the present applicant.
連続法によつて製造した紙基材不飽和ポリエス
テル樹脂銅張積層板は、本出願人によつて「エク
セライト」なる商標名のもとに市販されており、
従来の紙フエノール樹脂銅張積層板に比較してす
ぐれた多数の特徴のために主として民生用電気製
品に広く使用されている。 A paper-based unsaturated polyester resin copper-clad laminate manufactured by a continuous process is commercially available under the trade name "Excelite" by the applicant.
It is widely used primarily in consumer electronics products due to a number of superior features compared to traditional paper phenolic resin copper clad laminates.
近年これら民生用電気製品に使用する印刷回路
基板は、その加工工程の自動化および基板への部
品挿入の自動化の普及により、その反りに対する
許容値の限界がますます厳しくなつており、より
反り量の少ない製品を供給することが望まれてい
る。 In recent years, the tolerance limits for printed circuit boards used in consumer electronic products have become increasingly strict due to the spread of automation in the processing process and the automation of parts insertion into the board, and the amount of warpage has become more and more limited. It is desired to supply fewer products.
本発明はこのような状況の下で、より改良され
た反り特性を有する製品を提供するものである。 Under these circumstances, the present invention provides a product with improved warpage characteristics.
解決方法
連続法によつて製造された金属箔張り積層板の
反りは、含浸後硬化前の基材層中に存在する未硬
化状態の不飽和ポリエステル樹脂の含水率に関係
があることがわかつた。すなわちこの時の樹脂の
含水率が一定値以下であると製品の反り量が増加
し、またあまり過剰であると製品の他の特性、例
えば曲げ強度を低下させる。Solution It was found that the warpage of metal foil-clad laminates manufactured by the continuous method is related to the moisture content of the uncured unsaturated polyester resin present in the base material layer after impregnation and before curing. . That is, if the water content of the resin at this time is below a certain value, the amount of warpage of the product will increase, and if it is too excessive, other properties of the product, such as bending strength, will be reduced.
従つて本発明は、複数枚のシート状基材を連続
的に搬送しながら、該基材を液状不飽和ポリエス
テル樹脂で含浸し、複数枚の含浸した基材を合体
し、合体した基材の少なくとも片面に金属箔をラ
ミネートし、次いで全体を硬化する連続工程を含
む、金属箔張り積層板の連続製造法において、含
浸後硬化前の基材層にある不飽和ポリエステル樹
脂の水分を500ないし2000ppmの範囲に調節する
ことを特徴とする。 Therefore, the present invention involves impregnating a plurality of sheet-like base materials with a liquid unsaturated polyester resin while continuously conveying the base materials, combining the plurality of impregnated base materials, and dissolving the combined base materials. In a continuous manufacturing method for metal foil-clad laminates, which includes a continuous process of laminating metal foil on at least one side and then curing the entire board, the water content of the unsaturated polyester resin in the base material layer after impregnation and before curing is reduced to 500 to 2000 ppm. It is characterized by being adjustable within the range of .
好ましい実施態様の説明
図面は本発明方法を実施して片面金属箔張り積
層板を製造するための装置の一例の概略側面図で
ある。DESCRIPTION OF THE PREFERRED EMBODIMENTS The drawing is a schematic side view of an example of an apparatus for carrying out the method of the invention to produce single-sided metal foil-clad laminates.
ロール1に巻かれた基材、例えばセルロース繊
維からなるクラフト紙2は連続的に搬送されて予
備処理室3に入る。図面では3枚の基材が同時に
搬送されるように示されているが、積層板の最終
厚みに応じて基材の枚数は適宜増減し得ることは
勿論である。基材2は次に樹脂液含浸室4へ入
り、樹脂液を含浸され、一対のスクイーズロール
5,5間を通過して合体される。その際ロール7
から繰り出された金属箔8が接着剤を塗布されて
含浸基材の積層物の上面にラミネートされ、また
積層物の下面にはロール9から繰り出されたキヤ
リヤシート10、例えばポリエステルフイルムが
ロール5によつて張り合わされる。このようにし
て得られる未硬化の状態にある積層板は硬化炉1
2へ入り、その中を進行する間に加熱されて硬化
を受ける。硬化炉12を出た積層板14からは下
面のキヤリヤシート10がロール13によつて剥
離され、ロール11として巻き取られる。次に積
層板14はロータリーカツター18によつて両耳
端部をトリミングされ、ギロチンカツター19に
よつて所要長さに切断される。この装置のこれま
での部分は先に引用した本出願人の特開昭55−
4838号、同56−98136号に開示したものと実質的
に同じである。 A base material, for example kraft paper 2 made of cellulose fibers, wound around a roll 1 is continuously conveyed and enters a pretreatment chamber 3 . In the drawing, three substrates are shown to be conveyed at the same time, but it goes without saying that the number of substrates can be increased or decreased as appropriate depending on the final thickness of the laminate. The base material 2 then enters the resin liquid impregnation chamber 4, is impregnated with the resin liquid, passes between a pair of squeeze rolls 5, and is combined. At that time, roll 7
A metal foil 8 fed out from the roll 9 is coated with an adhesive and laminated on the top surface of the laminate of impregnated base materials, and a carrier sheet 10, such as a polyester film, fed out from the roll 9 is placed on the bottom surface of the laminate onto the roll 5. It is twisted and pasted together. The uncured laminate thus obtained is placed in a curing furnace 1.
2, and as it travels through it, it is heated and hardened. The lower carrier sheet 10 is peeled off from the laminate 14 leaving the curing furnace 12 by a roll 13 and wound up as a roll 11. Next, the laminated plate 14 is trimmed at both end portions by a rotary cutter 18, and cut to a required length by a guillotine cutter 19. The previous part of this device was published in Japanese Patent Application Laid-Open No. 1983-1999 by the applicant, as cited above.
No. 4838 and No. 56-98136.
本発明でいう「含浸後硬化前の基材層」とは、
図面では含浸室4からロール5,5に至る間の搬
送下にある基材層2を指す。この間の基材層にあ
る樹脂の水分を500ないし2000ppm、好ましくは
500ないし1000ppmの範囲内に調節するためには、
含浸室4へ供給させる樹脂液が既に持つている水
分含量に応じ、含浸室を給湿または除湿し、基材
層が該室内を進行する間に該室内の湿度と樹脂の
含水率との間に平衡状態が確立されるようにすれ
ばよい。 In the present invention, the "substrate layer after impregnation and before curing" means:
In the drawing, reference is made to the base material layer 2 being conveyed from the impregnation chamber 4 to the rolls 5, 5. The moisture content of the resin in the base material layer between these layers is reduced to 500 to 2000 ppm, preferably
To adjust within the range of 500 to 1000ppm,
The impregnation chamber is humidified or dehumidified depending on the moisture content already contained in the resin liquid to be supplied to the impregnation chamber 4, and while the base material layer advances through the chamber, the humidity in the chamber and the moisture content of the resin are maintained. It is sufficient that an equilibrium state is established.
しかしながら一般には、本出願人の特開昭56−
13136号に開示されているように、含浸室へ供給
される樹脂液は製品中の微細な気泡の発生を排除
するため減圧で脱気処理されるから、溶存気体が
除去されるのと同時に水分も除去されている。従
つて含浸室4内を給湿し、含浸直後の基材層にあ
る樹脂液が水分を吸収し、前記水分範囲で平衡に
達するように含浸室内の相対湿度を調節すればよ
い。これにより含浸室4からロール5,5まで進
行する際、基材層にある樹脂の含水量は実質上所
望の範囲に保たれる。 However, in general, the applicant's JP-A-56-
As disclosed in No. 13136, the resin liquid supplied to the impregnation chamber is degassed under reduced pressure to eliminate the formation of fine bubbles in the product, so dissolved gas is removed and moisture is removed at the same time. has also been removed. Therefore, the relative humidity in the impregnation chamber 4 may be adjusted so that the inside of the impregnation chamber 4 is humidified and the resin liquid in the base material layer immediately after impregnation absorbs moisture and reaches an equilibrium within the above-mentioned moisture range. As a result, the water content of the resin in the base layer is maintained substantially within the desired range as it progresses from the impregnation chamber 4 to the rolls 5,5.
この時の樹脂の含水率があまり低ければ製品の
反りが許容値以上となり、反対に高過ぎると製品
の強度に悪影響があり、従つて製品の反りを許容
値以内とし、強度を低下させないためには、前記
含水率が前記範囲内にならなければならないこと
がわかつた。 If the moisture content of the resin is too low, the warpage of the product will exceed the allowable value; on the other hand, if it is too high, the strength of the product will be adversely affected. It was found that the moisture content must be within the range.
実施例
市販不飽和ポリエステル(ポリマール3311、武
田薬品製)100重量部にクメンハイドロパーオキ
サイド1重量部、6%ナフテン酸コバルト0.2重
量部からなる不飽和ポリエステル樹脂液を調製し
た。Example An unsaturated polyester resin liquid was prepared consisting of 100 parts by weight of a commercially available unsaturated polyester (Polymer 3311, manufactured by Takeda Pharmaceutical Co., Ltd.), 1 part by weight of cumene hydroperoxide, and 0.2 parts by weight of 6% cobalt naphthenate.
図面に示すような装置を用い、予備処理室3内
においてメラミン樹脂で予備処理したクラスト紙
(山陽国策パルプZBS−135、10ミル)5枚に上記
樹脂液を含浸室4内において含浸し、スクイーズ
ロール5,5間に供給して合体し、同時にエポキ
シ系接着剤を塗布された銅箔を上面にラミネート
し、下面にキヤリアシートとしてポリエステルフ
イルムを張合わせ、硬化炉12内において110℃
で30分間、さらに150℃で15分間の硬化を行い、
厚さ1.6mmの片面銅箔張り積層板を得た。 Using the apparatus shown in the drawing, five sheets of crust paper (Sanyo Kokusaku Pulp ZBS-135, 10 mil) pretreated with melamine resin in the pretreatment chamber 3 were impregnated with the resin liquid in the impregnation chamber 4, and then squeezed. Copper foil coated with epoxy adhesive is laminated on the upper surface, a polyester film is laminated as a carrier sheet on the lower surface, and heated at 110°C in a curing furnace 12.
curing for 30 minutes at 150°C for 15 minutes.
A single-sided copper foil-clad laminate with a thickness of 1.6 mm was obtained.
その際含浸室4内を温度40℃、相対湿度95%に
保ち、含浸室を出た直後の基材層中の樹脂液の水
分を800ppmに調節した。 At this time, the temperature inside the impregnation chamber 4 was maintained at 40° C. and the relative humidity was 95%, and the water content of the resin liquid in the base material layer immediately after leaving the impregnation chamber was adjusted to 800 ppm.
得られた積層板を縦300mm、横240mmに切断し、
40℃で85%RHの恒温恒湿室内に4日間放置後、
凸面を下にして定盤上に置き、四隅の高さを測定
し、その平均値を反り量とした。 The obtained laminate was cut into pieces of 300 mm in length and 240 mm in width.
After leaving it in a constant temperature and humidity room at 40℃ and 85%RH for 4 days,
It was placed on a surface plate with the convex side facing down, the heights of the four corners were measured, and the average value was taken as the amount of warpage.
含浸後硬化前の基材層にある樹脂の水分が前記
範囲内にあるものの反り量は−1.5mm(金属箔面
を内側にして凹)であるのに対し、該水分が
200ppm以下のものの反り量は−3.0mmであつた。 When the moisture content of the resin in the base material layer after impregnation and before curing is within the above range, the amount of warpage is -1.5 mm (concave with the metal foil surface inside);
The amount of warpage for those with 200 ppm or less was -3.0 mm.
また本発明による前記積層板の曲げ強度は17
Kg/mm2であつたが、前記水分が2000ppm以上にな
ると、曲げ強度が14Kg/mm2に低下し、また硬化時
水分の蒸発によつて発生したものと思われる微細
な気泡を含んでいた。 Further, the bending strength of the laminate according to the present invention is 17
Kg/mm 2 , but when the water content exceeded 2000 ppm, the bending strength decreased to 14 Kg/mm 2 , and it also contained fine air bubbles, which were thought to be caused by evaporation of water during curing. .
図面は本発明を実施するための装置の概略図で
ある。
2は基材、4は含浸室、5はラミネートロー
ル、8は金属箔、10はキヤリヤシート、12は
硬化室である。
The drawing is a schematic diagram of an apparatus for implementing the invention. 2 is a base material, 4 is an impregnating chamber, 5 is a laminating roll, 8 is a metal foil, 10 is a carrier sheet, and 12 is a curing chamber.
Claims (1)
ら、該基材を液状不飽和ポリエステル樹脂で含浸
し、複数枚の含浸した基材を合体し、合体した基
材の少なくとも片面に金属箔をラミネートし、次
いで全体を硬化する連続工程を含む、金属箔張り
積層板の連続製造方法において、含浸後硬化前の
基材層が通過する雰囲気を調湿し、該基材層にあ
る不飽和ポリエステル樹脂の水分を該雰囲気の湿
度と平衡させることによつて500ないし2000ppm
の範囲に調節することを特徴とする前記方法。 2 基材が紙である第1項の方法。 3 含浸前の不飽和ポリエステル樹脂が減圧処理
されている第1項の方法。[Scope of Claims] 1 A plurality of sheet-like base materials are impregnated with a liquid unsaturated polyester resin while being conveyed continuously, and the plurality of impregnated base materials are combined to form a combined base material. In a continuous manufacturing method of a metal foil-clad laminate, which includes a continuous step of laminating metal foil on at least one side of the substrate and then curing the entire substrate, the atmosphere through which the substrate layer passes after impregnation and before curing is controlled to control the humidity of the atmosphere through which the substrate layer passes through, and 500 to 2000 ppm by balancing the moisture content of the unsaturated polyester resin in the material layer with the humidity of the atmosphere.
The above method, characterized in that the adjustment is made within the range of . 2. The method of item 1, wherein the base material is paper. 3. The method of item 1, wherein the unsaturated polyester resin is subjected to reduced pressure treatment before impregnation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59166779A JPS6144637A (en) | 1984-08-08 | 1984-08-08 | Manufacture of unsaturated polyester metallic-foil lined laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59166779A JPS6144637A (en) | 1984-08-08 | 1984-08-08 | Manufacture of unsaturated polyester metallic-foil lined laminated board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6144637A JPS6144637A (en) | 1986-03-04 |
JPH0234310B2 true JPH0234310B2 (en) | 1990-08-02 |
Family
ID=15837523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59166779A Granted JPS6144637A (en) | 1984-08-08 | 1984-08-08 | Manufacture of unsaturated polyester metallic-foil lined laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6144637A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4958099A (en) * | 1987-09-03 | 1990-09-18 | Canon Kabushiki Kaisha | Brushless motor |
JPH0651030Y2 (en) * | 1989-01-17 | 1994-12-21 | ローム株式会社 | Adsorption device for multiple small parts |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5036464A (en) * | 1973-06-26 | 1975-04-05 | ||
JPS5613136A (en) * | 1979-07-13 | 1981-02-09 | Kanegafuchi Chem Ind Co Ltd | Manufacture of laminated plate and apparatus for continuously manufacturing the same |
JPS5698136A (en) * | 1980-01-08 | 1981-08-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminated substance |
-
1984
- 1984-08-08 JP JP59166779A patent/JPS6144637A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5036464A (en) * | 1973-06-26 | 1975-04-05 | ||
JPS5613136A (en) * | 1979-07-13 | 1981-02-09 | Kanegafuchi Chem Ind Co Ltd | Manufacture of laminated plate and apparatus for continuously manufacturing the same |
JPS5698136A (en) * | 1980-01-08 | 1981-08-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminated substance |
Also Published As
Publication number | Publication date |
---|---|
JPS6144637A (en) | 1986-03-04 |
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