JPS6142865B2 - - Google Patents

Info

Publication number
JPS6142865B2
JPS6142865B2 JP54073181A JP7318179A JPS6142865B2 JP S6142865 B2 JPS6142865 B2 JP S6142865B2 JP 54073181 A JP54073181 A JP 54073181A JP 7318179 A JP7318179 A JP 7318179A JP S6142865 B2 JPS6142865 B2 JP S6142865B2
Authority
JP
Japan
Prior art keywords
chip carrier
wiring board
hole
semiconductor element
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54073181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55165659A (en
Inventor
Norio Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7318179A priority Critical patent/JPS55165659A/ja
Publication of JPS55165659A publication Critical patent/JPS55165659A/ja
Publication of JPS6142865B2 publication Critical patent/JPS6142865B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP7318179A 1979-06-11 1979-06-11 Semiconductor device Granted JPS55165659A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7318179A JPS55165659A (en) 1979-06-11 1979-06-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7318179A JPS55165659A (en) 1979-06-11 1979-06-11 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55165659A JPS55165659A (en) 1980-12-24
JPS6142865B2 true JPS6142865B2 (enrdf_load_stackoverflow) 1986-09-24

Family

ID=13510705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7318179A Granted JPS55165659A (en) 1979-06-11 1979-06-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55165659A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5349498A (en) * 1992-12-23 1994-09-20 Hughes Aircraft Company Integral extended surface cooling of power modules
CN107316852B (zh) * 2017-08-08 2019-09-27 苏州能讯高能半导体有限公司 一种半导体器件的散热结构及半导体器件

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599752A (en) * 1979-01-25 1980-07-30 Chiyou Lsi Gijutsu Kenkyu Kumiai Structure for fitting ic chip

Also Published As

Publication number Publication date
JPS55165659A (en) 1980-12-24

Similar Documents

Publication Publication Date Title
US5940271A (en) Stiffener with integrated heat sink attachment
US7759170B2 (en) Fabrication method of semiconductor package having heat dissipation device
US5367193A (en) Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die
US7265977B2 (en) Active liquid metal thermal spreader
KR0121438B1 (ko) 반도체 장치
JPH10189845A (ja) 半導体素子の放熱装置
JP2861981B2 (ja) 半導体装置の冷却構造
EP3693991B1 (en) Heat sink design for flip chip ball grid array
JP3401107B2 (ja) パッケージｉｃのモジュール
US5977622A (en) Stiffener with slots for clip-on heat sink attachment
US8797739B2 (en) Self circulating heat exchanger
JP2005294760A5 (enrdf_load_stackoverflow)
CN110828399A (zh) 芯片器件、电路板及数字货币挖矿机
JPS6142865B2 (enrdf_load_stackoverflow)
JPS60137042A (ja) 樹脂封止形半導体装置
JPH04291750A (ja) 放熱フィンおよび半導体集積回路装置
JPS6142864B2 (enrdf_load_stackoverflow)
JPH08274224A (ja) マルチチップモジュールの封止冷却構造
CN115483166A (zh) 浸没式直接冷却模块及相关方法
JP3256343B2 (ja) ヒートシンク
JP2718136B2 (ja) 樹脂封止型半導体装置
JPH05259326A (ja) 冷却装置
JPS6130742B2 (enrdf_load_stackoverflow)
JPH0617313Y2 (ja) 液冷形半導体パッケージ
JPH06310626A (ja) 半導体チップ及び半導体集積回路装置