JPS6142424B2 - - Google Patents
Info
- Publication number
- JPS6142424B2 JPS6142424B2 JP16876480A JP16876480A JPS6142424B2 JP S6142424 B2 JPS6142424 B2 JP S6142424B2 JP 16876480 A JP16876480 A JP 16876480A JP 16876480 A JP16876480 A JP 16876480A JP S6142424 B2 JPS6142424 B2 JP S6142424B2
- Authority
- JP
- Japan
- Prior art keywords
- rubber material
- wafer
- cut
- semiconductor pellets
- protective substance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000000873 masking effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 40
- 229920001971 elastomer Polymers 0.000 description 39
- 238000005520 cutting process Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16876480A JPS5792848A (en) | 1980-11-29 | 1980-11-29 | Manufacture of semiconductor pellet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16876480A JPS5792848A (en) | 1980-11-29 | 1980-11-29 | Manufacture of semiconductor pellet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5792848A JPS5792848A (en) | 1982-06-09 |
| JPS6142424B2 true JPS6142424B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-09-20 |
Family
ID=15874005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16876480A Granted JPS5792848A (en) | 1980-11-29 | 1980-11-29 | Manufacture of semiconductor pellet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5792848A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5659033B2 (ja) * | 2011-02-04 | 2015-01-28 | 株式会社東芝 | 半導体装置の製造方法 |
-
1980
- 1980-11-29 JP JP16876480A patent/JPS5792848A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5792848A (en) | 1982-06-09 |